NL7504380A - Keramisch pakket zonder aansluitleidingen, be- stemd voor een geintegreerde keten. - Google Patents

Keramisch pakket zonder aansluitleidingen, be- stemd voor een geintegreerde keten.

Info

Publication number
NL7504380A
NL7504380A NL7504380A NL7504380A NL7504380A NL 7504380 A NL7504380 A NL 7504380A NL 7504380 A NL7504380 A NL 7504380A NL 7504380 A NL7504380 A NL 7504380A NL 7504380 A NL7504380 A NL 7504380A
Authority
NL
Netherlands
Prior art keywords
ceramic
layer
cavity
integrated
leads
Prior art date
Application number
NL7504380A
Other languages
English (en)
Dutch (nl)
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of NL7504380A publication Critical patent/NL7504380A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
NL7504380A 1974-04-30 1975-04-11 Keramisch pakket zonder aansluitleidingen, be- stemd voor een geintegreerde keten. NL7504380A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46567874A 1974-04-30 1974-04-30

Publications (1)

Publication Number Publication Date
NL7504380A true NL7504380A (nl) 1975-11-03

Family

ID=23848740

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7504380A NL7504380A (nl) 1974-04-30 1975-04-11 Keramisch pakket zonder aansluitleidingen, be- stemd voor een geintegreerde keten.

Country Status (7)

Country Link
JP (1) JPS50152668A (https=)
BE (1) BE827801A (https=)
BR (1) BR7501972A (https=)
FR (1) FR2269793B1 (https=)
GB (1) GB1463023A (https=)
IN (1) IN139550B (https=)
NL (1) NL7504380A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814740B2 (ja) * 1975-12-19 1983-03-22 松下電子工業株式会社 ハンドウタイチユウヘノフジユンブツカクサンホウホウ
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
EP0139029A1 (en) * 1983-10-19 1985-05-02 Olin Corporation Improved semiconductor package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing

Also Published As

Publication number Publication date
JPS50152668A (https=) 1975-12-08
FR2269793A1 (https=) 1975-11-28
IN139550B (https=) 1976-07-03
FR2269793B1 (https=) 1979-03-16
BR7501972A (pt) 1976-03-03
BE827801A (fr) 1975-07-31
GB1463023A (en) 1977-02-02

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Legal Events

Date Code Title Description
BV The patent application has lapsed