BE827801A - Boitier ceramique sans conducteurs pour circuit integre avec des moyens de refroidissement - Google Patents

Boitier ceramique sans conducteurs pour circuit integre avec des moyens de refroidissement

Info

Publication number
BE827801A
BE827801A BE155292A BE155292A BE827801A BE 827801 A BE827801 A BE 827801A BE 155292 A BE155292 A BE 155292A BE 155292 A BE155292 A BE 155292A BE 827801 A BE827801 A BE 827801A
Authority
BE
Belgium
Prior art keywords
conductors
integrated circuit
cooling means
ceramic case
ceramic
Prior art date
Application number
BE155292A
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE827801A publication Critical patent/BE827801A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
BE155292A 1974-04-30 1975-04-10 Boitier ceramique sans conducteurs pour circuit integre avec des moyens de refroidissement BE827801A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46567874A 1974-04-30 1974-04-30

Publications (1)

Publication Number Publication Date
BE827801A true BE827801A (fr) 1975-07-31

Family

ID=23848740

Family Applications (1)

Application Number Title Priority Date Filing Date
BE155292A BE827801A (fr) 1974-04-30 1975-04-10 Boitier ceramique sans conducteurs pour circuit integre avec des moyens de refroidissement

Country Status (7)

Country Link
JP (1) JPS50152668A (https=)
BE (1) BE827801A (https=)
BR (1) BR7501972A (https=)
FR (1) FR2269793B1 (https=)
GB (1) GB1463023A (https=)
IN (1) IN139550B (https=)
NL (1) NL7504380A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814740B2 (ja) * 1975-12-19 1983-03-22 松下電子工業株式会社 ハンドウタイチユウヘノフジユンブツカクサンホウホウ
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
EP0139029A1 (en) * 1983-10-19 1985-05-02 Olin Corporation Improved semiconductor package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing

Also Published As

Publication number Publication date
JPS50152668A (https=) 1975-12-08
FR2269793A1 (https=) 1975-11-28
IN139550B (https=) 1976-07-03
FR2269793B1 (https=) 1979-03-16
BR7501972A (pt) 1976-03-03
NL7504380A (nl) 1975-11-03
GB1463023A (en) 1977-02-02

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: BURROUGHS CORP.

Effective date: 19910430