BR7501972A - Conjunto hermeticamente selado - Google Patents

Conjunto hermeticamente selado

Info

Publication number
BR7501972A
BR7501972A BR2508/75A BR7502508A BR7501972A BR 7501972 A BR7501972 A BR 7501972A BR 2508/75 A BR2508/75 A BR 2508/75A BR 7502508 A BR7502508 A BR 7502508A BR 7501972 A BR7501972 A BR 7501972A
Authority
BR
Brazil
Prior art keywords
hermetically sealed
sealed set
hermetically
sealed
Prior art date
Application number
BR2508/75A
Other languages
English (en)
Portuguese (pt)
Inventor
R Morse
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of BR7501972A publication Critical patent/BR7501972A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
BR2508/75A 1974-04-30 1975-04-02 Conjunto hermeticamente selado BR7501972A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46567874A 1974-04-30 1974-04-30

Publications (1)

Publication Number Publication Date
BR7501972A true BR7501972A (pt) 1976-03-03

Family

ID=23848740

Family Applications (1)

Application Number Title Priority Date Filing Date
BR2508/75A BR7501972A (pt) 1974-04-30 1975-04-02 Conjunto hermeticamente selado

Country Status (7)

Country Link
JP (1) JPS50152668A (https=)
BE (1) BE827801A (https=)
BR (1) BR7501972A (https=)
FR (1) FR2269793B1 (https=)
GB (1) GB1463023A (https=)
IN (1) IN139550B (https=)
NL (1) NL7504380A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814740B2 (ja) * 1975-12-19 1983-03-22 松下電子工業株式会社 ハンドウタイチユウヘノフジユンブツカクサンホウホウ
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
EP0139029A1 (en) * 1983-10-19 1985-05-02 Olin Corporation Improved semiconductor package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing

Also Published As

Publication number Publication date
JPS50152668A (https=) 1975-12-08
FR2269793A1 (https=) 1975-11-28
IN139550B (https=) 1976-07-03
FR2269793B1 (https=) 1979-03-16
BE827801A (fr) 1975-07-31
NL7504380A (nl) 1975-11-03
GB1463023A (en) 1977-02-02

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