GB1463023A - Hermetically sealed package including an integrated circuit - Google Patents

Hermetically sealed package including an integrated circuit

Info

Publication number
GB1463023A
GB1463023A GB1331275A GB1331275A GB1463023A GB 1463023 A GB1463023 A GB 1463023A GB 1331275 A GB1331275 A GB 1331275A GB 1331275 A GB1331275 A GB 1331275A GB 1463023 A GB1463023 A GB 1463023A
Authority
GB
United Kingdom
Prior art keywords
layer
ceramic
cavity
leads
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1331275A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of GB1463023A publication Critical patent/GB1463023A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB1331275A 1974-04-30 1975-04-01 Hermetically sealed package including an integrated circuit Expired GB1463023A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46567874A 1974-04-30 1974-04-30

Publications (1)

Publication Number Publication Date
GB1463023A true GB1463023A (en) 1977-02-02

Family

ID=23848740

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1331275A Expired GB1463023A (en) 1974-04-30 1975-04-01 Hermetically sealed package including an integrated circuit

Country Status (7)

Country Link
JP (1) JPS50152668A (https=)
BE (1) BE827801A (https=)
BR (1) BR7501972A (https=)
FR (1) FR2269793B1 (https=)
GB (1) GB1463023A (https=)
IN (1) IN139550B (https=)
NL (1) NL7504380A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521350A1 (fr) * 1982-02-05 1983-08-12 Hitachi Ltd Boitier porteur de puce semi-conductrice

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814740B2 (ja) * 1975-12-19 1983-03-22 松下電子工業株式会社 ハンドウタイチユウヘノフジユンブツカクサンホウホウ
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
EP0139029A1 (en) * 1983-10-19 1985-05-02 Olin Corporation Improved semiconductor package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521350A1 (fr) * 1982-02-05 1983-08-12 Hitachi Ltd Boitier porteur de puce semi-conductrice
US4691225A (en) * 1982-02-05 1987-09-01 Hitachi, Ltd. Semiconductor device and a method of producing the same

Also Published As

Publication number Publication date
JPS50152668A (https=) 1975-12-08
FR2269793A1 (https=) 1975-11-28
IN139550B (https=) 1976-07-03
FR2269793B1 (https=) 1979-03-16
BR7501972A (pt) 1976-03-03
BE827801A (fr) 1975-07-31
NL7504380A (nl) 1975-11-03

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee