IN139550B - - Google Patents
Info
- Publication number
- IN139550B IN139550B IN2501/CAL/74A IN2501CA1974A IN139550B IN 139550 B IN139550 B IN 139550B IN 2501CA1974 A IN2501CA1974 A IN 2501CA1974A IN 139550 B IN139550 B IN 139550B
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46567874A | 1974-04-30 | 1974-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN139550B true IN139550B (https=) | 1976-07-03 |
Family
ID=23848740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2501/CAL/74A IN139550B (https=) | 1974-04-30 | 1974-11-12 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS50152668A (https=) |
| BE (1) | BE827801A (https=) |
| BR (1) | BR7501972A (https=) |
| FR (1) | FR2269793B1 (https=) |
| GB (1) | GB1463023A (https=) |
| IN (1) | IN139550B (https=) |
| NL (1) | NL7504380A (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814740B2 (ja) * | 1975-12-19 | 1983-03-22 | 松下電子工業株式会社 | ハンドウタイチユウヘノフジユンブツカクサンホウホウ |
| JPS548976A (en) * | 1977-06-22 | 1979-01-23 | Nec Corp | Lsi package |
| FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
| US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
| US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
| US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
| EP0139029A1 (en) * | 1983-10-19 | 1985-05-02 | Olin Corporation | Improved semiconductor package |
| US4862323A (en) * | 1984-04-12 | 1989-08-29 | Olin Corporation | Chip carrier |
| US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier |
| US4701573A (en) * | 1985-09-26 | 1987-10-20 | Itt Gallium Arsenide Technology Center | Semiconductor chip housing |
-
1974
- 1974-11-12 IN IN2501/CAL/74A patent/IN139550B/en unknown
-
1975
- 1975-04-01 GB GB1331275A patent/GB1463023A/en not_active Expired
- 1975-04-02 BR BR2508/75A patent/BR7501972A/pt unknown
- 1975-04-10 BE BE155292A patent/BE827801A/xx not_active IP Right Cessation
- 1975-04-11 NL NL7504380A patent/NL7504380A/xx not_active Application Discontinuation
- 1975-04-16 JP JP50046932A patent/JPS50152668A/ja active Pending
- 1975-04-28 FR FR7513239A patent/FR2269793B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50152668A (https=) | 1975-12-08 |
| FR2269793A1 (https=) | 1975-11-28 |
| FR2269793B1 (https=) | 1979-03-16 |
| BR7501972A (pt) | 1976-03-03 |
| BE827801A (fr) | 1975-07-31 |
| NL7504380A (nl) | 1975-11-03 |
| GB1463023A (en) | 1977-02-02 |