JPS50152668A - - Google Patents

Info

Publication number
JPS50152668A
JPS50152668A JP50046932A JP4693275A JPS50152668A JP S50152668 A JPS50152668 A JP S50152668A JP 50046932 A JP50046932 A JP 50046932A JP 4693275 A JP4693275 A JP 4693275A JP S50152668 A JPS50152668 A JP S50152668A
Authority
JP
Japan
Prior art keywords
layer
ceramic
cavity
leads
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50046932A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50152668A publication Critical patent/JPS50152668A/ja
Priority to CA249,530A priority Critical patent/CA1061914A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP50046932A 1974-04-30 1975-04-16 Pending JPS50152668A (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA249,530A CA1061914A (en) 1975-04-16 1976-04-05 Fixing device for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46567874A 1974-04-30 1974-04-30

Publications (1)

Publication Number Publication Date
JPS50152668A true JPS50152668A (https=) 1975-12-08

Family

ID=23848740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50046932A Pending JPS50152668A (https=) 1974-04-30 1975-04-16

Country Status (7)

Country Link
JP (1) JPS50152668A (https=)
BE (1) BE827801A (https=)
BR (1) BR7501972A (https=)
FR (1) FR2269793B1 (https=)
GB (1) GB1463023A (https=)
IN (1) IN139550B (https=)
NL (1) NL7504380A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275265A (en) * 1975-12-19 1977-06-24 Matsushita Electronics Corp Method of diffusing impurity to semiconductor
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
EP0139029A1 (en) * 1983-10-19 1985-05-02 Olin Corporation Improved semiconductor package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5275265A (en) * 1975-12-19 1977-06-24 Matsushita Electronics Corp Method of diffusing impurity to semiconductor
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package

Also Published As

Publication number Publication date
FR2269793A1 (https=) 1975-11-28
IN139550B (https=) 1976-07-03
FR2269793B1 (https=) 1979-03-16
BR7501972A (pt) 1976-03-03
BE827801A (fr) 1975-07-31
NL7504380A (nl) 1975-11-03
GB1463023A (en) 1977-02-02

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