NL6816631A - - Google Patents

Info

Publication number
NL6816631A
NL6816631A NL6816631A NL6816631A NL6816631A NL 6816631 A NL6816631 A NL 6816631A NL 6816631 A NL6816631 A NL 6816631A NL 6816631 A NL6816631 A NL 6816631A NL 6816631 A NL6816631 A NL 6816631A
Authority
NL
Netherlands
Application number
NL6816631A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6816631A publication Critical patent/NL6816631A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
NL6816631A 1967-11-22 1968-11-21 NL6816631A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR129286 1967-11-22

Publications (1)

Publication Number Publication Date
NL6816631A true NL6816631A (xx) 1969-05-27

Family

ID=8642119

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6816631A NL6816631A (xx) 1967-11-22 1968-11-21

Country Status (6)

Country Link
US (1) US3568000A (xx)
BE (1) BE723494A (xx)
DE (1) DE1809183A1 (xx)
FR (1) FR1552207A (xx)
GB (1) GB1229220A (xx)
NL (1) NL6816631A (xx)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573670A (en) * 1969-03-21 1971-04-06 Ibm High-speed impedance-compensated circuits
US3657701A (en) * 1970-11-02 1972-04-18 Texas Instruments Inc Digital data processing system having a signal distribution system
US3740678A (en) * 1971-03-19 1973-06-19 Ibm Strip transmission line structures
US3891949A (en) * 1972-11-30 1975-06-24 Licentia Gmbh Slit line-type microwave circuit construction
US3904886A (en) * 1974-02-01 1975-09-09 Ibm Voltage distribution systems for integrated circuits
DE2627297C2 (de) * 1975-06-20 1982-06-03 International Computers Ltd., London Mehrschichtige, gedruckte Schaltungsplatte
JPS5518033A (en) * 1978-07-25 1980-02-07 Mitsumi Electric Co Ltd Board pattern structure
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
US4494172A (en) * 1982-01-28 1985-01-15 Mupac Corporation High-speed wire wrap board
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
US4754371A (en) * 1984-04-27 1988-06-28 Nec Corporation Large scale integrated circuit package
US4739448A (en) * 1984-06-25 1988-04-19 Magnavox Government And Industrial Electronics Company Microwave multiport multilayered integrated circuit chip carrier
JPS6156493A (ja) * 1984-08-28 1986-03-22 日本電気株式会社 多層回路基板の電源配線構造
JPH023631Y2 (xx) * 1984-12-28 1990-01-29
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
JPH0775123B2 (ja) * 1985-05-31 1995-08-09 株式会社潤工社 フラットケーブル状平衡伝送線路
US4716500A (en) * 1985-10-18 1987-12-29 Tektronix, Inc. Probe cable assembly
US4658334A (en) * 1986-03-19 1987-04-14 Rca Corporation RF signal shielding enclosure of electronic systems
GB2253308B (en) * 1986-09-26 1993-01-20 Gen Electric Co Plc Semiconductor circuit arrangements
JPH0783185B2 (ja) * 1987-06-11 1995-09-06 松下電器産業株式会社 高周波用回路基板
JPH0754875B2 (ja) * 1986-11-14 1995-06-07 松下電器産業株式会社 高周波回路基板
FR2625373B1 (fr) * 1987-12-29 1990-01-26 Thomson Hybrides Microondes Ligne de propagation hyperfrequence en microruban
US4861272A (en) * 1988-03-31 1989-08-29 E. I. Du Pont De Nemours And Company Impedance controlled connector interface
US5159536A (en) * 1988-05-13 1992-10-27 Mupac Corporation Panel board
US4845311A (en) * 1988-07-21 1989-07-04 Hughes Aircraft Company Flexible coaxial cable apparatus and method
JPH0834340B2 (ja) * 1988-12-09 1996-03-29 日立化成工業株式会社 配線板およびその製造法
JP2760829B2 (ja) * 1989-01-13 1998-06-04 株式会社日立製作所 電子基板
US5032803A (en) * 1990-02-02 1991-07-16 American Telephone & Telegraph Company Directional stripline structure and manufacture
US5053731A (en) * 1990-09-12 1991-10-01 Hewlett-Packard Company Software reconfigurable transmission line apparatus
NL9400261A (nl) * 1994-02-22 1995-10-02 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van een multilayer microwave board alsmede op deze wijze verkregen boards.
US5741729A (en) * 1994-07-11 1998-04-21 Sun Microsystems, Inc. Ball grid array package for an integrated circuit
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6181219B1 (en) * 1998-12-02 2001-01-30 Teradyne, Inc. Printed circuit board and method for fabricating such board
DE19943045A1 (de) 1999-09-09 2001-04-05 Pfisterer Kontaktsyst Gmbh Vorrichtung zum Steckverbinden elektrischer Leiter
JP2003110360A (ja) * 2001-09-28 2003-04-11 Seiko Epson Corp 電圧制御型発振器、受信装置および通信装置
WO2006104613A2 (en) 2005-03-01 2006-10-05 X2Y Attenuators, Llc Conditioner with coplanar conductors
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
TWM324855U (en) * 2007-03-23 2008-01-01 P Two Ind Inc Print type ultra-thin coaxial transmission cable
JP6385075B2 (ja) * 2013-04-15 2018-09-05 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器

Also Published As

Publication number Publication date
US3568000A (en) 1971-03-02
BE723494A (xx) 1969-05-07
FR1552207A (xx) 1969-01-03
GB1229220A (xx) 1971-04-21
DE1809183A1 (de) 1969-07-24

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