NL6703972A - - Google Patents
Info
- Publication number
- NL6703972A NL6703972A NL6703972A NL6703972A NL6703972A NL 6703972 A NL6703972 A NL 6703972A NL 6703972 A NL6703972 A NL 6703972A NL 6703972 A NL6703972 A NL 6703972A NL 6703972 A NL6703972 A NL 6703972A
- Authority
- NL
- Netherlands
- Prior art keywords
- chip
- welding
- lands
- mask
- regions
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0046—Welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01038—Strontium [Sr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB11624/66A GB1125745A (en) | 1966-03-16 | 1966-03-16 | Attaching integrated circuits to substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6703972A true NL6703972A (xx) | 1967-09-18 |
Family
ID=9989698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6703972A NL6703972A (xx) | 1966-03-16 | 1967-03-16 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3480755A (xx) |
DE (1) | DE1591113B2 (xx) |
FR (1) | FR1514656A (xx) |
GB (1) | GB1125745A (xx) |
NL (1) | NL6703972A (xx) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3988564A (en) * | 1972-07-17 | 1976-10-26 | Hughes Aircraft Company | Ion beam micromachining method |
US4379218A (en) * | 1981-06-30 | 1983-04-05 | International Business Machines Corporation | Fluxless ion beam soldering process |
EP0349756A3 (en) * | 1988-05-30 | 1991-03-20 | Canon Kabushiki Kaisha | Method of making electric circuit device |
DE19726489C1 (de) * | 1997-06-21 | 1999-02-11 | Hartmann & Braun Gmbh & Co Kg | Verfahren zur Herstellung einer mechanischen Verbindung zwischen einem dünnen metallischen Draht und einem Glaskörper |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE712434C (de) * | 1938-01-26 | 1941-10-18 | Siemens & Halske Akt Ges | Verfahren zur Herstellung von reinen Oberflaechenfiltern und Ultrafiltern |
BE630858A (xx) * | 1962-04-10 | 1900-01-01 | ||
US3391451A (en) * | 1965-03-22 | 1968-07-09 | Sperry Rand Corp | Method for preparing electronic circuit units |
US3368116A (en) * | 1966-01-18 | 1968-02-06 | Allen Bradley Co | Thin film circuitry with improved capacitor structure |
-
1966
- 1966-03-16 GB GB11624/66A patent/GB1125745A/en not_active Expired
-
1967
- 1967-03-15 FR FR98858A patent/FR1514656A/fr not_active Expired
- 1967-03-16 DE DE1967E0033622 patent/DE1591113B2/de active Granted
- 1967-03-16 US US623604A patent/US3480755A/en not_active Expired - Lifetime
- 1967-03-16 NL NL6703972A patent/NL6703972A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR1514656A (fr) | 1968-02-23 |
DE1591113A1 (de) | 1970-02-26 |
DE1591113B2 (de) | 1972-03-30 |
US3480755A (en) | 1969-11-25 |
GB1125745A (en) | 1968-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3424890A (en) | Method of bonding two different materials by electro-magnetic radiation | |
US5185295A (en) | Method for dicing semiconductor substrates using a laser scribing and dual etch process | |
TW330876B (en) | Method of separating semiconductor elements formed in a wafer of semiconductor material | |
US4914269A (en) | Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser | |
US4078711A (en) | Metallurgical method for die attaching silicon on sapphire devices to obtain heat resistant bond | |
JPH081914B2 (ja) | 圧接型半導体装置 | |
US3340601A (en) | Alloy diffused transistor | |
EP0028737A3 (en) | Method for high efficiency gettering contaminants and defects in a semiconductor body | |
NL6703972A (xx) | ||
US4634043A (en) | Engaging second articles to engaged first articles | |
JPS594060A (ja) | 半導体装置 | |
JPS5842244A (ja) | 半導体チツプとその支持体との結合方法 | |
US4183135A (en) | Hermetic glass encapsulation for semiconductor die and method | |
US3012316A (en) | Attaching leads to silicon semiconductor devices | |
JPS635537A (ja) | 半導体装置 | |
JPS56165333A (en) | Mounting method for electronic parts | |
JPH04162641A (ja) | レーザボンディング法 | |
JPS6240119B2 (xx) | ||
US3733691A (en) | Process for making semiconductor devices | |
JPS6119102B2 (xx) | ||
US4151638A (en) | Hermetic glass encapsulation for semiconductor die and method | |
JPS54162465A (en) | Chip replacing method | |
JPS59108322A (ja) | 半導体ウエハ− | |
JPS60240393A (ja) | レ−ザ切断機による切断方法 | |
JPS574139A (en) | Semiconductor device and manufacturing process therefor |