GB1145611A - Improvements in or relating to methods of drilling a hole in a workpiece with the aid of a high-energy beam of rays - Google Patents
Improvements in or relating to methods of drilling a hole in a workpiece with the aid of a high-energy beam of raysInfo
- Publication number
- GB1145611A GB1145611A GB15662/67A GB1566267A GB1145611A GB 1145611 A GB1145611 A GB 1145611A GB 15662/67 A GB15662/67 A GB 15662/67A GB 1566267 A GB1566267 A GB 1566267A GB 1145611 A GB1145611 A GB 1145611A
- Authority
- GB
- United Kingdom
- Prior art keywords
- hole
- workpiece
- layer
- piercing
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/08—Removing material, e.g. by cutting, by hole drilling
- B23K15/085—Boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/26—Alloys of Nickel and Cobalt and Chromium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Laser Beam Processing (AREA)
Abstract
1,145,611. Removing metal by high energy beams. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 5 April, 1967 [8 April, 1966], No. 15662/67. Headings B3A and B3V. In a method of piercing a hole 11 in a workpiece 9 by a high energy beam 21, the surface of the workpiece in the vicinity of the hole is provided with a covering layer 15 which is later removed. This layer prevents damage to the hole near the surface. The layer 15 may be of refractory metal such as tungsten and has a spacer 17 formed around the hole to be pierced. Alternatively a separate spacer ring may be used. An electron beam 13 first pierces a hole in the layer 15 and then the centre part of the beam pierces the hole 11 in the workpiece. The beam may be pulsed. After piercing, the layer is removed and the metal workpiece (51), Fig. 5 (not shown), may be then electroplated with copper (55). In another embodiment, Fig. 1, a workpiece (1) of nickel is provided before piercing with a thin layer of copper (5). Subsequently the layer is removed by grinding or etching. Before grinding the hole may be filled with wax which is later removed by melting or by a solvent. For piercing large numbers of holes, the beam may be controlled by a programmed device. The hole may be of circular or elongated cross-section and may extend only partly through the workpiece. The workpiece may be an electrode for an electron tube, or a diaphragm for a mass spectrograph or an electron microscope. Reference is also made to a LASER beam.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6604805A NL6604805A (en) | 1966-04-08 | 1966-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1145611A true GB1145611A (en) | 1969-03-19 |
Family
ID=19796241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB15662/67A Expired GB1145611A (en) | 1966-04-08 | 1967-04-05 | Improvements in or relating to methods of drilling a hole in a workpiece with the aid of a high-energy beam of rays |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB1145611A (en) |
NL (1) | NL6604805A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4378481A (en) | 1981-03-02 | 1983-03-29 | United Technologies Corporation | Backers having glass particulates for electron beam hole drilling |
US4386257A (en) | 1981-03-02 | 1983-05-31 | United Technologies Corporation | Alkali metal oxide free backers for energy beam drilling |
DK152096B (en) * | 1978-03-24 | 1988-02-01 | United Technologies Corp | PROCEDURE FOR DRILLING A HOLE OR CLEANING IN A SUBJECT WITH THE USE OF AN ENERGY RADIATION |
GB2231525A (en) * | 1989-05-18 | 1990-11-21 | Colin John Humphreys | Preparation of substrates. |
GB2236973A (en) * | 1989-10-17 | 1991-04-24 | Bosch Gmbh Robert | Producing high-precision through bores by laser radiation |
GB2247856A (en) * | 1990-09-11 | 1992-03-18 | Balzers Hochvakuum | Controling vapor deposition. |
US5438179A (en) * | 1990-10-05 | 1995-08-01 | Linotype-Hell Ag | Method and apparatus for manufacturing texture drums |
CN104175002A (en) * | 2013-05-20 | 2014-12-03 | 三星钻石工业股份有限公司 | Cutting method of resign board pasted at glass substrate |
-
1966
- 1966-04-08 NL NL6604805A patent/NL6604805A/xx unknown
-
1967
- 1967-04-05 GB GB15662/67A patent/GB1145611A/en not_active Expired
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK152096B (en) * | 1978-03-24 | 1988-02-01 | United Technologies Corp | PROCEDURE FOR DRILLING A HOLE OR CLEANING IN A SUBJECT WITH THE USE OF AN ENERGY RADIATION |
US4378481A (en) | 1981-03-02 | 1983-03-29 | United Technologies Corporation | Backers having glass particulates for electron beam hole drilling |
US4386257A (en) | 1981-03-02 | 1983-05-31 | United Technologies Corporation | Alkali metal oxide free backers for energy beam drilling |
GB2231525A (en) * | 1989-05-18 | 1990-11-21 | Colin John Humphreys | Preparation of substrates. |
GB2236973A (en) * | 1989-10-17 | 1991-04-24 | Bosch Gmbh Robert | Producing high-precision through bores by laser radiation |
GB2236973B (en) * | 1989-10-17 | 1994-02-02 | Bosch Gmbh Robert | Method of producing in workpieces high-precision through bores made by laser radiation |
GB2247856A (en) * | 1990-09-11 | 1992-03-18 | Balzers Hochvakuum | Controling vapor deposition. |
GB2247856B (en) * | 1990-09-11 | 1994-05-11 | Balzers Hochvakuum | A method of and arrangement for controlling the density of a vapour deposition flow and/or its distribution |
US5438179A (en) * | 1990-10-05 | 1995-08-01 | Linotype-Hell Ag | Method and apparatus for manufacturing texture drums |
CN104175002A (en) * | 2013-05-20 | 2014-12-03 | 三星钻石工业股份有限公司 | Cutting method of resign board pasted at glass substrate |
TWI581885B (en) * | 2013-05-20 | 2017-05-11 | 三星鑽石工業股份有限公司 | A method of cutting a resin plate attached to a glass substrate |
Also Published As
Publication number | Publication date |
---|---|
NL6604805A (en) | 1967-10-09 |
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