|
US3373095A
(en)
*
|
1967-06-05 |
1968-03-12 |
Dayton Bright Copper Company |
Electroplating of copper
|
|
US3542655A
(en)
*
|
1968-04-29 |
1970-11-24 |
M & T Chemicals Inc |
Electrodeposition of copper
|
|
DE2039831C3
(de)
*
|
1970-06-06 |
1979-09-06 |
Schering Ag, 1000 Berlin Und 4619 Bergkamen |
Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
|
|
US3715289A
(en)
*
|
1971-02-08 |
1973-02-06 |
Stauffer Chemical Co |
Brightener composition for acid copper electroplating baths
|
|
US3770598A
(en)
*
|
1972-01-21 |
1973-11-06 |
Oxy Metal Finishing Corp |
Electrodeposition of copper from acid baths
|
|
US3956078A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3956079A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3956084A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3966565A
(en)
*
|
1972-12-14 |
1976-06-29 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3940320A
(en)
*
|
1972-12-14 |
1976-02-24 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US3956120A
(en)
*
|
1972-12-14 |
1976-05-11 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US4014760A
(en)
*
|
1974-11-21 |
1977-03-29 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US4036710A
(en)
*
|
1974-11-21 |
1977-07-19 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US4036711A
(en)
*
|
1975-12-18 |
1977-07-19 |
M & T Chemicals Inc. |
Electrodeposition of copper
|
|
US4272335A
(en)
*
|
1980-02-19 |
1981-06-09 |
Oxy Metal Industries Corporation |
Composition and method for electrodeposition of copper
|
|
US4316778A
(en)
*
|
1980-09-24 |
1982-02-23 |
Rca Corporation |
Method for the manufacture of recording substrates for capacitance electronic discs
|
|
US4336114A
(en)
*
|
1981-03-26 |
1982-06-22 |
Hooker Chemicals & Plastics Corp. |
Electrodeposition of bright copper
|
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
|
AU559896B2
(en)
*
|
1983-06-10 |
1987-03-26 |
Omi International Corp. |
Electrolytic copper depositing processes
|
|
AU554236B2
(en)
*
|
1983-06-10 |
1986-08-14 |
Omi International Corp. |
Electrolyte composition and process for electrodepositing copper
|
|
US4555315A
(en)
*
|
1984-05-29 |
1985-11-26 |
Omi International Corporation |
High speed copper electroplating process and bath therefor
|
|
US4551212A
(en)
*
|
1985-03-11 |
1985-11-05 |
Rca Corporation |
Bath and process for the electrodeposition of micromachinable copper and additive for said bath
|
|
US4673467A
(en)
*
|
1986-09-02 |
1987-06-16 |
Cbs Inc. |
Method of manufacturing fine-grained copper substrate for optical information carrier
|
|
DE4032864A1
(de)
*
|
1990-10-13 |
1992-04-16 |
Schering Ag |
Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
|
|
DE4126502C1
(forum.php)
*
|
1991-08-07 |
1993-02-11 |
Schering Ag Berlin Und Bergkamen, 1000 Berlin, De |
|
|
US5252196A
(en)
*
|
1991-12-05 |
1993-10-12 |
Shipley Company Inc. |
Copper electroplating solutions and processes
|
|
US5328589A
(en)
*
|
1992-12-23 |
1994-07-12 |
Enthone-Omi, Inc. |
Functional fluid additives for acid copper electroplating baths
|
|
US5980706A
(en)
*
|
1996-07-15 |
1999-11-09 |
Semitool, Inc. |
Electrode semiconductor workpiece holder
|
|
US6358388B1
(en)
*
|
1996-07-15 |
2002-03-19 |
Semitool, Inc. |
Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover
|
|
US6203582B1
(en)
*
|
1996-07-15 |
2001-03-20 |
Semitool, Inc. |
Modular semiconductor workpiece processing tool
|
|
US6454926B1
(en)
*
|
1997-09-30 |
2002-09-24 |
Semitool Inc. |
Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
|
|
US6936153B1
(en)
|
1997-09-30 |
2005-08-30 |
Semitool, Inc. |
Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
|
|
DE19758121C2
(de)
*
|
1997-12-17 |
2000-04-06 |
Atotech Deutschland Gmbh |
Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
|
|
US7244677B2
(en)
|
1998-02-04 |
2007-07-17 |
Semitool. Inc. |
Method for filling recessed micro-structures with metallization in the production of a microelectronic device
|
|
TWI223678B
(en)
|
1998-03-20 |
2004-11-11 |
Semitool Inc |
Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
|
|
US6197181B1
(en)
*
|
1998-03-20 |
2001-03-06 |
Semitool, Inc. |
Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
|
|
US6565729B2
(en)
|
1998-03-20 |
2003-05-20 |
Semitool, Inc. |
Method for electrochemically depositing metal on a semiconductor workpiece
|
|
US7247229B2
(en)
*
|
1999-06-28 |
2007-07-24 |
Eltech Systems Corporation |
Coatings for the inhibition of undesirable oxidation in an electrochemical cell
|
|
JP2001073182A
(ja)
*
|
1999-07-15 |
2001-03-21 |
Boc Group Inc:The |
改良された酸性銅電気メッキ用溶液
|
|
US6391209B1
(en)
|
1999-08-04 |
2002-05-21 |
Mykrolis Corporation |
Regeneration of plating baths
|
|
US6596148B1
(en)
|
1999-08-04 |
2003-07-22 |
Mykrolis Corporation |
Regeneration of plating baths and system therefore
|
|
US6942779B2
(en)
*
|
2000-05-25 |
2005-09-13 |
Mykrolis Corporation |
Method and system for regenerating of plating baths
|
|
ATE385863T1
(de)
*
|
2000-08-18 |
2008-03-15 |
Ti Group Automotive Sys Ltd |
Verfahren zur plattierung eines metallbandes zur herstellung eines mehrwandigen rohrs
|
|
US6652731B2
(en)
*
|
2001-10-02 |
2003-11-25 |
Shipley Company, L.L.C. |
Plating bath and method for depositing a metal layer on a substrate
|
|
JP3964263B2
(ja)
*
|
2002-05-17 |
2007-08-22 |
株式会社デンソー |
ブラインドビアホール充填方法及び貫通電極形成方法
|
|
US7025866B2
(en)
*
|
2002-08-21 |
2006-04-11 |
Micron Technology, Inc. |
Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
|
|
DE10261852B3
(de)
|
2002-12-20 |
2004-06-03 |
Atotech Deutschland Gmbh |
Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
|
|
US20040211657A1
(en)
*
|
2003-04-11 |
2004-10-28 |
Ingelbrecht Hugo Gerard Eduard |
Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom
|
|
DE10337669B4
(de)
*
|
2003-08-08 |
2006-04-27 |
Atotech Deutschland Gmbh |
Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
|
|
US20050092611A1
(en)
*
|
2003-11-03 |
2005-05-05 |
Semitool, Inc. |
Bath and method for high rate copper deposition
|
|
DE10354860B4
(de)
*
|
2003-11-19 |
2008-06-26 |
Atotech Deutschland Gmbh |
Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
|
|
US20080087549A1
(en)
*
|
2004-08-18 |
2008-04-17 |
Ebara-Udylite Co.,Ltd. |
Additive For Copper Plating And Process For Producing Electronic Circiut Substrate Therewith
|
|
DE102005011708B3
(de)
|
2005-03-11 |
2007-03-01 |
Atotech Deutschland Gmbh |
Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
|
|
EP1897975B1
(en)
*
|
2006-09-07 |
2012-03-14 |
Enthone, Inc. |
Deposition of conductive polymer and metallization of non-conductive substrates
|
|
EP1897973A1
(en)
*
|
2006-09-07 |
2008-03-12 |
Enthone, Inc. |
Deposition of conductive polymer and metallization of non-conductive substrates
|
|
KR101409710B1
(ko)
|
2006-09-07 |
2014-06-24 |
엔쏜 인코포레이티드 |
전도성 중합체의 전착 및 비전도성 기판의 금속화
|
|
JP5525762B2
(ja)
*
|
2008-07-01 |
2014-06-18 |
上村工業株式会社 |
無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
|
|
CN102443818B
(zh)
|
2010-10-08 |
2016-01-13 |
水之星公司 |
多层混合金属氧化物电极及其制造方法
|
|
CN102523785B
(zh)
*
|
2012-01-19 |
2013-10-02 |
南京农业大学 |
藏红t在种子染色标记示踪方面的应用
|
|
EP3415664B1
(en)
*
|
2017-06-16 |
2019-09-18 |
ATOTECH Deutschland GmbH |
Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating
|
|
US11668017B2
(en)
|
2018-07-30 |
2023-06-06 |
Water Star, Inc. |
Current reversal tolerant multilayer material, method of making the same, use as an electrode, and use in electrochemical processes
|