NL192313C - Anti-oxydatiestelsel voor een draadhechtinrichting, gebruikmakend van een koperdraad. - Google Patents

Anti-oxydatiestelsel voor een draadhechtinrichting, gebruikmakend van een koperdraad. Download PDF

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Publication number
NL192313C
NL192313C NL8901395A NL8901395A NL192313C NL 192313 C NL192313 C NL 192313C NL 8901395 A NL8901395 A NL 8901395A NL 8901395 A NL8901395 A NL 8901395A NL 192313 C NL192313 C NL 192313C
Authority
NL
Netherlands
Prior art keywords
wire
gas
oxidation
capillary device
reducing
Prior art date
Application number
NL8901395A
Other languages
English (en)
Dutch (nl)
Other versions
NL192313B (nl
NL8901395A (nl
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019880006623A external-priority patent/KR920000628B1/ko
Priority claimed from KR1019880008038A external-priority patent/KR900001010A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of NL8901395A publication Critical patent/NL8901395A/nl
Publication of NL192313B publication Critical patent/NL192313B/xx
Application granted granted Critical
Publication of NL192313C publication Critical patent/NL192313C/nl

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
NL8901395A 1988-06-02 1989-06-01 Anti-oxydatiestelsel voor een draadhechtinrichting, gebruikmakend van een koperdraad. NL192313C (nl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR880006623 1988-06-02
KR1019880006623A KR920000628B1 (ko) 1988-06-02 1988-06-02 와이어 본더의 스풀마운터 산화방지시스템
KR880008038 1988-06-30
KR1019880008038A KR900001010A (ko) 1988-06-30 1988-06-30 동(銅)선을 이용한 와이어 본딩 방법 및 장치

Publications (3)

Publication Number Publication Date
NL8901395A NL8901395A (nl) 1990-01-02
NL192313B NL192313B (nl) 1997-01-06
NL192313C true NL192313C (nl) 1997-05-07

Family

ID=26627855

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8901395A NL192313C (nl) 1988-06-02 1989-06-01 Anti-oxydatiestelsel voor een draadhechtinrichting, gebruikmakend van een koperdraad.

Country Status (6)

Country Link
US (1) US4995552A (de)
JP (1) JPH0618223B2 (de)
DE (1) DE3915472C2 (de)
FR (1) FR2632229B1 (de)
GB (1) GB2220101B (de)
NL (1) NL192313C (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3911027A1 (de) * 1989-04-05 1990-10-11 Siemens Ag Verfahren zum verbinden von anschlusselementen mit lackisolierten draehten
JP2888463B2 (ja) * 1991-09-23 1999-05-10 健 柳沢 ２次元運動機構
JP2776100B2 (ja) * 1991-12-10 1998-07-16 日本電気株式会社 ワイヤボンディング装置
NL9200396A (nl) * 1992-03-03 1993-10-01 Nedap Nv Radiofrequente identificatielabel met relatief grote detectie-afstand en een minimum aantal electronische componenten.
US5603892A (en) * 1994-06-09 1997-02-18 Fujitsu Limited System for maintaining a controlled atmosphere in an electronic circuit package
DE19604287C2 (de) * 1996-02-07 1999-12-09 Fraunhofer Ges Forschung Vorrichtung zur Beaufschlagung eines Drahtendes in einer Drahtbondeinrichtung mit einem Schutzmedium
CA2377628A1 (en) * 1999-06-28 2001-01-04 Jurgen Ramm Component and method for the production thereof
US6373137B1 (en) * 2000-03-21 2002-04-16 Micron Technology, Inc. Copper interconnect for an integrated circuit and methods for its fabrication
US6630910B2 (en) 2001-10-29 2003-10-07 Marconi Communications Inc. Wave antenna wireless communication device and method
US20070251980A1 (en) * 2006-04-26 2007-11-01 Gillotti Gary S Reduced oxidation system for wire bonding
CN105149808B (zh) * 2015-09-30 2017-03-29 河南科技大学 一种可控制钎焊球大小的钎焊球加工装置及加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3125906A (en) * 1964-03-24 Lead bonding machine
JPS55128396A (en) * 1979-03-26 1980-10-04 Packer Eng Ass Zn alloy wax and its use
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
JPS607137A (ja) * 1983-06-27 1985-01-14 Shinkawa Ltd ワイヤボンダ用ボ−ル形成装置
EP0169574B1 (de) * 1984-07-27 1990-04-25 Kabushiki Kaisha Toshiba Apparat zum Herstellen einer Halbleiteranordnung
JPS61159743A (ja) * 1985-01-07 1986-07-19 Toshiba Corp ワイヤボンディング方法および装置
US4674671A (en) * 1985-11-04 1987-06-23 Olin Corporation Thermosonic palladium lead wire bonding
DE3851901T2 (de) * 1987-01-26 1995-04-13 Hitachi Ltd Anschweissen eines Drahtes.

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Publication number Publication date
DE3915472A1 (de) 1989-12-07
JPH0618223B2 (ja) 1994-03-09
FR2632229B1 (fr) 1991-11-29
NL192313B (nl) 1997-01-06
DE3915472C2 (de) 1995-11-30
GB2220101A (en) 1989-12-28
US4995552A (en) 1991-02-26
FR2632229A1 (fr) 1989-12-08
GB8912761D0 (en) 1989-07-19
GB2220101B (en) 1992-09-09
JPH0225044A (ja) 1990-01-26
NL8901395A (nl) 1990-01-02

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