NL163672B - Halfgeleiderinrichting. - Google Patents

Halfgeleiderinrichting.

Info

Publication number
NL163672B
NL163672B NL6903124A NL6903124A NL163672B NL 163672 B NL163672 B NL 163672B NL 6903124 A NL6903124 A NL 6903124A NL 6903124 A NL6903124 A NL 6903124A NL 163672 B NL163672 B NL 163672B
Authority
NL
Netherlands
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
NL6903124A
Other languages
English (en)
Other versions
NL163672C (nl
NL6903124A (nl
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of NL6903124A publication Critical patent/NL6903124A/xx
Publication of NL163672B publication Critical patent/NL163672B/nl
Application granted granted Critical
Publication of NL163672C publication Critical patent/NL163672C/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
NL6903124A 1968-03-01 1969-02-28 Halfgeleiderinrichting. NL163672C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70956168A 1968-03-01 1968-03-01

Publications (3)

Publication Number Publication Date
NL6903124A NL6903124A (nl) 1969-09-03
NL163672B true NL163672B (nl) 1980-04-15
NL163672C NL163672C (nl) 1980-09-15

Family

ID=24850358

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6903124A NL163672C (nl) 1968-03-01 1969-02-28 Halfgeleiderinrichting.

Country Status (4)

Country Link
DE (1) DE1909480C2 (nl)
FR (1) FR2003026B1 (nl)
GB (1) GB1262511A (nl)
NL (1) NL163672C (nl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2365209A1 (fr) * 1976-09-20 1978-04-14 Cii Honeywell Bull Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre
DE2840973A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung pruefbarer halbleiter-miniaturgehaeuse in bandform
FR2438339A1 (fr) * 1978-10-05 1980-04-30 Suisse Horlogerie Liaison electrique d'un circuit integre
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
DE3138743A1 (de) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München In einem dichten gehaeuse montiertes oberflaechenwellenfilter und dergleichen
DE3147729A1 (de) * 1981-12-02 1983-06-09 Siemens AG, 1000 Berlin und 8000 München Zwischentraegerband mit verdrahtungselementen zur bestueckung mit chipbausteinen
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
DE3686990T2 (de) * 1985-08-23 1993-04-22 Nec Corp Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird.

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271625A (en) * 1962-08-01 1966-09-06 Signetics Corp Electronic package assembly
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3192307A (en) * 1964-05-29 1965-06-29 Burndy Corp Connector for component and printed circuit board
GB1054670A (nl) * 1964-07-31
DE1439708C3 (de) * 1964-08-01 1975-04-17 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Kontaktieren von Halbleiteranordnungen
GB1113217A (en) * 1964-10-26 1968-05-08 Matsushita Electronics Corp Method of manufacturing semiconductor devices
GB1102292A (en) * 1965-02-12 1968-02-07 Associated Semiconductor Mft Improvements in and relating to methods of manufacturing semi-conductor devices
FR1471662A (fr) * 1965-03-17 1967-03-03 Int Standard Electric Corp Bloc de circuit intégré plat
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
FR1544302A (fr) * 1966-11-09 1968-10-31 Advalloy Inc Bande de grilles de conducteurs pour dispositifs semiconducteurs et procédé pour la former

Also Published As

Publication number Publication date
FR2003026A1 (nl) 1969-11-07
NL163672C (nl) 1980-09-15
DE1909480A1 (de) 1970-01-15
GB1262511A (en) 1972-02-02
DE1909480C2 (de) 1984-10-11
FR2003026B1 (nl) 1973-10-19
NL6903124A (nl) 1969-09-03

Similar Documents

Publication Publication Date Title
NL162253C (nl) Halfgeleiderinrichting.
NL159822B (nl) Halfgeleiderinrichting.
CH529445A (de) Halbleiteranordnung
CH511511A (de) Halbleiter-Anordnung
BE736743A (fr) Dispositif semiconducteur
NL161923C (nl) Halfgeleiderinrichting.
CH492302A (de) Halbleiterbauelement
AT320025B (de) Halbleitervorrichtung
NL163672C (nl) Halfgeleiderinrichting.
AT300961B (de) Halbleiteranordnung
CH487504A (de) Halbleitervorrichtung
DE1903342B2 (de) Halbleitervorrichtung
CH508279A (de) Halbleiterbauelement
FI52673C (fi) Kierteityslaite.
DK117909B (da) Halvlederapparat.
DE1949174B2 (de) Halbleiterbauelement
NL164153C (nl) Contactinrichting.
CH493942A (de) Halbleitervorrichtung
CH485323A (de) Halbleiteranordnung
CH510346A (de) Halbleiteranordnung
CH518009A (de) Halbleiteranordnung
CH539341A (de) Halbleiterbauelement
AT278907B (de) Halbleiterelement
FI44021C (fi) Puolijohdelaitelma
NL162248C (nl) Halfgeleiderinrichting.

Legal Events

Date Code Title Description
V4 Lapsed because of reaching the maxim lifetime of a patent