GB1262511A - Semiconductor devices and manufacture thereof - Google Patents

Semiconductor devices and manufacture thereof

Info

Publication number
GB1262511A
GB1262511A GB1102169A GB1102169A GB1262511A GB 1262511 A GB1262511 A GB 1262511A GB 1102169 A GB1102169 A GB 1102169A GB 1102169 A GB1102169 A GB 1102169A GB 1262511 A GB1262511 A GB 1262511A
Authority
GB
United Kingdom
Prior art keywords
leads
tape
semi
conductor
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1102169A
Inventor
Alanson Douglas Aird
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1262511A publication Critical patent/GB1262511A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

1,262,511. Semi-conductor devices. GENERAL ELECTRIC CO. 28 Feb., 1969 [1 March, 1968], No. 11021/69. Heading H1K. A lead frame 'for a semi-conductor device comprises a flexible support tape 10, preferably of an insulating material such as Mylar or Kapton (Registered Trade Marks), having longitudinally spaced apertures 12 therein, and sets of metal leads 80-stuck to the tape 10 and extending over each aperture 12, where they may be registered with and bonded to corresponding electrodes on a semi-conductor body placed within the aperture 12. The leads may be of tinned copper, and preferably comprise parts of an initially continuous metal layer 16 which is photolithographically shaped to -the desired configuration. Additional apertures may also be -provided in the tape 10 beneath the outer ends of the leads 80 to facilitate bonding of the leads-to relatively stiff terminals and to allow the tape to be cut-more readily to separate individual structures therefrom. Plastics material or glass may be moulded -around the semi-conductor body and at least the inner ends of the leads 80. In an alternative arrangement the tape 10 itself may be metal and in this case the leads 80 are stripped from the tape 10 in order to separate individual structures.
GB1102169A 1968-03-01 1969-02-28 Semiconductor devices and manufacture thereof Expired GB1262511A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70956168A 1968-03-01 1968-03-01

Publications (1)

Publication Number Publication Date
GB1262511A true GB1262511A (en) 1972-02-02

Family

ID=24850358

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1102169A Expired GB1262511A (en) 1968-03-01 1969-02-28 Semiconductor devices and manufacture thereof

Country Status (4)

Country Link
DE (1) DE1909480C2 (en)
FR (1) FR2003026B1 (en)
GB (1) GB1262511A (en)
NL (1) NL163672C (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0009610A1 (en) * 1978-09-20 1980-04-16 Siemens Aktiengesellschaft Method for producing testable semiconductor miniature containers in strip form
GB2140207A (en) * 1980-12-08 1984-11-21 Gao Ges Automation Org Assemblies of an ic module and a carrier
US4829666A (en) * 1980-05-20 1989-05-16 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for producing a carrier element for an IC-chip

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2365209A1 (en) * 1976-09-20 1978-04-14 Cii Honeywell Bull PROCESS FOR THE ASSEMBLY OF MICRO-PLATES OF INTEGRATED CIRCUITS ON A SUBSTRATE AND INSTALLATION FOR ITS IMPLEMENTATION
FR2438339A1 (en) * 1978-10-05 1980-04-30 Suisse Horlogerie Electrical connection to integrated circuit - by placing integrated circuit in housing punched in thickness of substrate supporting printed conductors
DE3029667A1 (en) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC COMPONENT
DE3138743A1 (en) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Surface acoustic wave filter and the like, mounted in a tight casing
DE3147729A1 (en) * 1981-12-02 1983-06-09 Siemens AG, 1000 Berlin und 8000 München INTERMEDIATE CARRIER TAPE WITH WIRING ELEMENTS FOR FITTING WITH CHIP COMPONENTS
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
EP0213575B1 (en) * 1985-08-23 1992-10-21 Nec Corporation Method of manufacturing a semiconductor device employing a film carrier tape

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271625A (en) * 1962-08-01 1966-09-06 Signetics Corp Electronic package assembly
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3192307A (en) * 1964-05-29 1965-06-29 Burndy Corp Connector for component and printed circuit board
GB1054670A (en) * 1964-07-31
DE1439708C3 (en) * 1964-08-01 1975-04-17 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Method for contacting semiconductor arrangements
GB1113217A (en) * 1964-10-26 1968-05-08 Matsushita Electronics Corp Method of manufacturing semiconductor devices
GB1102292A (en) * 1965-02-12 1968-02-07 Associated Semiconductor Mft Improvements in and relating to methods of manufacturing semi-conductor devices
FR1471662A (en) * 1965-03-17 1967-03-03 Int Standard Electric Corp Flat integrated circuit block
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
FR1544302A (en) * 1966-11-09 1968-10-31 Advalloy Inc Strip of conductor grids for semiconductor devices and method of forming same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0009610A1 (en) * 1978-09-20 1980-04-16 Siemens Aktiengesellschaft Method for producing testable semiconductor miniature containers in strip form
US4829666A (en) * 1980-05-20 1989-05-16 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for producing a carrier element for an IC-chip
GB2140207A (en) * 1980-12-08 1984-11-21 Gao Ges Automation Org Assemblies of an ic module and a carrier

Also Published As

Publication number Publication date
NL6903124A (en) 1969-09-03
DE1909480C2 (en) 1984-10-11
FR2003026B1 (en) 1973-10-19
FR2003026A1 (en) 1969-11-07
NL163672B (en) 1980-04-15
NL163672C (en) 1980-09-15
DE1909480A1 (en) 1970-01-15

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