NL163370C - Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon. - Google Patents

Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.

Info

Publication number
NL163370C
NL163370C NL7205767.A NL7205767A NL163370C NL 163370 C NL163370 C NL 163370C NL 7205767 A NL7205767 A NL 7205767A NL 163370 C NL163370 C NL 163370C
Authority
NL
Netherlands
Prior art keywords
conductor
semi
manufacturing
conductor pattern
pattern
Prior art date
Application number
NL7205767.A
Other languages
English (en)
Other versions
NL7205767A (nl
NL163370B (nl
Inventor
Bohuslav Symersky
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL7205767.A priority Critical patent/NL163370C/nl
Priority to DE2319883A priority patent/DE2319883C3/de
Priority to US00354504A priority patent/US3822467A/en
Priority to GB1959573A priority patent/GB1435319A/en
Priority to SE7305819A priority patent/SE382283B/xx
Priority to US354510A priority patent/US3928658A/en
Priority to CH589273A priority patent/CH555087A/xx
Priority to GB1959673A priority patent/GB1435320A/en
Priority to DE2321099A priority patent/DE2321099C3/de
Priority to ES414113A priority patent/ES414113A1/es
Priority to BR3088/73A priority patent/BR7303088D0/pt
Priority to BE130561A priority patent/BE798883A/xx
Priority to FR7315459A priority patent/FR2182209A1/fr
Priority to FR7315458A priority patent/FR2182208B1/fr
Priority to JP4829073A priority patent/JPS531117B2/ja
Priority to JP4828973A priority patent/JPS5636576B2/ja
Priority to CA170,743A priority patent/CA984932A/en
Priority to CA170,741A priority patent/CA983177A/en
Priority to AU55430/73A priority patent/AU473179B2/en
Publication of NL7205767A publication Critical patent/NL7205767A/xx
Publication of NL163370B publication Critical patent/NL163370B/nl
Application granted granted Critical
Publication of NL163370C publication Critical patent/NL163370C/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/7688—Filling of holes, grooves or trenches, e.g. vias, with conductive material by deposition over sacrificial masking layer, e.g. lift-off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
    • H01L23/53252—Additional layers associated with noble-metal layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/04—Charge transferring layer characterised by chemical composition, i.e. conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/944—Shadow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/951—Lift-off
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
NL7205767.A 1972-04-28 1972-04-28 Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon. NL163370C (nl)

Priority Applications (19)

Application Number Priority Date Filing Date Title
NL7205767.A NL163370C (nl) 1972-04-28 1972-04-28 Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.
DE2319883A DE2319883C3 (de) 1972-04-28 1973-04-19 Verfahren zum Herstellen von Leitermustern auf einer Halbleiteranordnung
US00354504A US3822467A (en) 1972-04-28 1973-04-25 Method of manufacturing a semiconductor device having a pattern of conductors and device manufactured by using said method
GB1959573A GB1435319A (en) 1972-04-28 1973-04-25 Devices comprising a trasnparent insulating support having an applied pattern of conductors
SE7305819A SE382283B (sv) 1972-04-28 1973-04-25 Sett att framstella en halvledaranordning med ett monster av ledare.
US354510A US3928658A (en) 1972-04-28 1973-04-25 Method of providing transparent conductive electrodes on a transparent insulating support
CH589273A CH555087A (de) 1972-04-28 1973-04-25 Verfahren zur herstellung einer halbleiteranordnung mit einem leitermuster und durch dieses verfahren hergestellte halbleiteranordnung.
GB1959673A GB1435320A (en) 1972-04-28 1973-04-25 Methods of manufacturing semi-conductor devices
ES414113A ES414113A1 (es) 1972-04-28 1973-04-26 Un metodo de fabricar un dispositivo semiconductor.
DE2321099A DE2321099C3 (de) 1972-04-28 1973-04-26 Verfahren zur Herstellung einer Anordnung mit einem transparenten Leitermuster
BR3088/73A BR7303088D0 (pt) 1972-04-28 1973-04-27 Um processo de fabricar um dispositivo semicondutor
BE130561A BE798883A (fr) 1972-04-28 1973-04-27 Procede pour la fabrication d'un dispositif semiconducteur comportant une configuration de conducteurs et dispositif fabrique de la sorte
FR7315459A FR2182209A1 (nl) 1972-04-28 1973-04-27
FR7315458A FR2182208B1 (nl) 1972-04-28 1973-04-27
JP4829073A JPS531117B2 (nl) 1972-04-28 1973-04-28
JP4828973A JPS5636576B2 (nl) 1972-04-28 1973-04-28
CA170,743A CA984932A (en) 1972-04-28 1973-04-30 Method of providing transparent conductive electrodes on a transparent insulating support
CA170,741A CA983177A (en) 1972-04-28 1973-04-30 Method of manufacturing a semiconductor device having a pattern of conductors and device manufactured by using said method
AU55430/73A AU473179B2 (en) 1972-04-28 1973-05-09 Method of manufacturing a semiconductor device having a pattern of conductors and device manufactured by using said method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7205767.A NL163370C (nl) 1972-04-28 1972-04-28 Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.

Publications (3)

Publication Number Publication Date
NL7205767A NL7205767A (nl) 1973-10-30
NL163370B NL163370B (nl) 1980-03-17
NL163370C true NL163370C (nl) 1980-08-15

Family

ID=19815941

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7205767.A NL163370C (nl) 1972-04-28 1972-04-28 Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.

Country Status (13)

Country Link
US (2) US3822467A (nl)
JP (2) JPS5636576B2 (nl)
AU (1) AU473179B2 (nl)
BE (1) BE798883A (nl)
BR (1) BR7303088D0 (nl)
CA (2) CA983177A (nl)
CH (1) CH555087A (nl)
DE (2) DE2319883C3 (nl)
ES (1) ES414113A1 (nl)
FR (2) FR2182209A1 (nl)
GB (2) GB1435319A (nl)
NL (1) NL163370C (nl)
SE (1) SE382283B (nl)

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GB1435320A (en) 1976-05-12
NL7205767A (nl) 1973-10-30
GB1435319A (en) 1976-05-12
FR2182208B1 (nl) 1978-06-23
BR7303088D0 (pt) 1974-07-11
FR2182208A1 (nl) 1973-12-07
CH555087A (de) 1974-10-15
BE798883A (fr) 1973-10-29
NL163370B (nl) 1980-03-17
DE2319883C3 (de) 1982-11-18
DE2321099A1 (de) 1973-11-08
CA984932A (en) 1976-03-02
SE382283B (sv) 1976-01-19
JPS5636576B2 (nl) 1981-08-25
JPS531117B2 (nl) 1978-01-14
AU5543073A (en) 1974-11-14
DE2319883B2 (de) 1979-08-23
DE2319883A1 (de) 1973-11-08
JPS4949595A (nl) 1974-05-14
ES414113A1 (es) 1976-02-01
CA983177A (en) 1976-02-03
DE2321099B2 (de) 1979-11-08
USB354510I5 (nl) 1975-01-28
US3928658A (en) 1975-12-23
DE2321099C3 (de) 1982-01-14
FR2182209A1 (nl) 1973-12-07
AU473179B2 (en) 1976-06-17
JPS4955278A (nl) 1974-05-29
US3822467A (en) 1974-07-09

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