NL1010688C2 - Werkwijze voor het vervaardigen een oppervlakte-geluidsgolfinrichting. - Google Patents

Werkwijze voor het vervaardigen een oppervlakte-geluidsgolfinrichting. Download PDF

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Publication number
NL1010688C2
NL1010688C2 NL1010688A NL1010688A NL1010688C2 NL 1010688 C2 NL1010688 C2 NL 1010688C2 NL 1010688 A NL1010688 A NL 1010688A NL 1010688 A NL1010688 A NL 1010688A NL 1010688 C2 NL1010688 C2 NL 1010688C2
Authority
NL
Netherlands
Prior art keywords
sound wave
wave device
surface sound
manufacturing
operating frequency
Prior art date
Application number
NL1010688A
Other languages
English (en)
Dutch (nl)
Other versions
NL1010688A1 (nl
Inventor
Michio Kadoto
Toshimaro Yoneda
Koji Fujimoto
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of NL1010688A1 publication Critical patent/NL1010688A1/xx
Application granted granted Critical
Publication of NL1010688C2 publication Critical patent/NL1010688C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/0023—Balance-unbalance or balance-balance networks
    • H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
    • H03H9/0047—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks
    • H03H9/0066—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically parallel
    • H03H9/0071—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically parallel the balanced terminals being on the same side of the tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
NL1010688A 1997-12-01 1998-11-30 Werkwijze voor het vervaardigen een oppervlakte-geluidsgolfinrichting. NL1010688C2 (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9330575A JPH11163655A (ja) 1997-12-01 1997-12-01 弾性表面波装置の製造方法
JP33057597 1997-12-01

Publications (2)

Publication Number Publication Date
NL1010688A1 NL1010688A1 (nl) 1999-06-02
NL1010688C2 true NL1010688C2 (nl) 2002-05-01

Family

ID=18234196

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1010688A NL1010688C2 (nl) 1997-12-01 1998-11-30 Werkwijze voor het vervaardigen een oppervlakte-geluidsgolfinrichting.

Country Status (8)

Country Link
US (1) US6185801B1 (zh)
JP (1) JPH11163655A (zh)
KR (1) KR100302969B1 (zh)
CN (1) CN1206751C (zh)
DE (1) DE19854729C2 (zh)
NL (1) NL1010688C2 (zh)
SG (1) SG94318A1 (zh)
TW (1) TW404090B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3712035B2 (ja) * 1999-04-28 2005-11-02 株式会社村田製作所 表面波装置の製造方法
JP3317274B2 (ja) * 1999-05-26 2002-08-26 株式会社村田製作所 弾性表面波装置及び弾性表面波装置の製造方法
DE19949739C1 (de) * 1999-10-15 2001-08-23 Karlsruhe Forschzent Massesensitiver Sensor
DE19949738A1 (de) * 1999-10-15 2001-05-23 Karlsruhe Forschzent Verfahren zur Herstellung von Oberflächenwellensensoren und Oberflächenwellensensor
JP3435639B2 (ja) * 2000-04-13 2003-08-11 株式会社村田製作所 弾性表面波装置の製造方法及び弾性表面波装置
JP3485067B2 (ja) * 2000-05-22 2004-01-13 株式会社村田製作所 ラッピング加工方法およびラッピング装置
JP2002217672A (ja) * 2001-01-12 2002-08-02 Murata Mfg Co Ltd 弾性表面波装置およびそれを用いた通信機装置
US6650205B2 (en) * 2001-03-29 2003-11-18 Clarisay, Inc. Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
JP4063000B2 (ja) * 2001-08-14 2008-03-19 株式会社村田製作所 端面反射型表面波フィルタ
JP3945363B2 (ja) * 2001-10-12 2007-07-18 株式会社村田製作所 弾性表面波装置
JP4704660B2 (ja) * 2002-12-18 2011-06-15 株式会社日立製作所 記憶デバイス制御装置の制御方法、記憶デバイス制御装置、及びプログラム
JP3969311B2 (ja) * 2003-01-20 2007-09-05 株式会社村田製作所 端面反射型弾性表面波装置
JP2005033379A (ja) 2003-07-09 2005-02-03 Tdk Corp 薄膜バルク波振動子およびその製造方法
JP2009130806A (ja) * 2007-11-27 2009-06-11 Seiko Epson Corp 弾性表面波素子及びその製造方法
JP2009281887A (ja) * 2008-05-22 2009-12-03 Fujitsu Ltd 気圧測定装置および気圧測定方法
DE102009019523B4 (de) * 2009-04-30 2014-02-13 Epcos Ag Verfahren zum Trimmen eines SAW Bauelements
JP2011023929A (ja) * 2009-07-15 2011-02-03 Panasonic Corp 弾性波素子とこれを用いた電子機器
US8959734B2 (en) * 2010-12-16 2015-02-24 Palo Alto Research Center Incorporated Method of fabricating a card with piezo-powered indicator by printed electronics processes
US8976093B2 (en) 2010-12-16 2015-03-10 Palo Alto Research Center Incorporated Printed interactive card with piezo-powered indicator
US20180329271A1 (en) * 2017-05-11 2018-11-15 The Charles Stark Draper Laboratory, Inc. Surface Acoustic Wave (SAW) Spatial Light Modulator Device Providing Varying SAW Speed
JP7195758B2 (ja) * 2018-04-19 2022-12-26 株式会社ディスコ Ｓａｗデバイスの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4243960A (en) * 1978-08-14 1981-01-06 The United States Of America As Represented By The Secretary Of The Navy Method and materials for tuning the center frequency of narrow-band surface-acoustic-wave (SAW) devices by means of dielectric overlays
US4435441A (en) * 1982-12-30 1984-03-06 The United States Of America As Represented By The Secretary Of The Army Method of frequency trimming surface acoustic wave devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4442574A (en) * 1982-07-26 1984-04-17 General Electric Company Frequency trimming of saw resonators
US4539847A (en) * 1984-01-03 1985-09-10 Texaco Inc. Acoustic method and apparatus for measuring thickness of a coating layer on a substrate
JPH0763131B2 (ja) 1985-03-13 1995-07-05 株式会社村田製作所 表面波装置の周波数調整方法
FR2646309B1 (fr) * 1989-04-24 1997-01-31 Technomed Int Sa Procede de fabrication d'un capteur acoustique et capteur acoustique ainsi obtenu, a couche de protection indecollable
JPH0832392A (ja) 1994-07-19 1996-02-02 Meidensha Corp 弾性表面波素子及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4243960A (en) * 1978-08-14 1981-01-06 The United States Of America As Represented By The Secretary Of The Navy Method and materials for tuning the center frequency of narrow-band surface-acoustic-wave (SAW) devices by means of dielectric overlays
US4435441A (en) * 1982-12-30 1984-03-06 The United States Of America As Represented By The Secretary Of The Army Method of frequency trimming surface acoustic wave devices

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ICHIKAWA Y ET AL: "UV LASER IRRADIATION EFFECTS ON FREQUENCY OF SURFACE ACOUSTIC WAVE (SAW) FILTERS COATED WITH TITANIUM OXIDE FILMS", JAPANESE JOURNAL OF APPLIED PHYSICS, PUBLICATION OFFICE JAPANESE JOURNAL OF APPLIED PHYSICS. TOKYO, JP, vol. 36, no. 7A, PART 2, 1 July 1997 (1997-07-01), pages L889 - L891, XP000742440, ISSN: 0021-4922 *
MOROZUMI K ET AL: "Characteristics of BGS wave resonators using ceramic substrates and their applications", ULTRASONICS SYMPOSIUM, 1996. PROCEEDINGS., 1996 IEEE SAN ANTONIO, TX, USA 3-6 NOV. 1996, NEW YORK, NY, USA,IEEE, US, 3 November 1996 (1996-11-03), pages 81 - 86, XP010217831, ISBN: 0-7803-3615-1 *

Also Published As

Publication number Publication date
JPH11163655A (ja) 1999-06-18
NL1010688A1 (nl) 1999-06-02
DE19854729A1 (de) 1999-06-10
CN1221255A (zh) 1999-06-30
KR19990062681A (ko) 1999-07-26
CN1206751C (zh) 2005-06-15
SG94318A1 (en) 2003-02-18
TW404090B (en) 2000-09-01
US6185801B1 (en) 2001-02-13
KR100302969B1 (ko) 2001-09-22
DE19854729C2 (de) 2001-05-03

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AD1A A request for search or an international type search has been filed
RD2N Patents in respect of which a decision has been taken or a report has been made (novelty report)

Effective date: 20020226

PD2B A search report has been drawn up
MK Patent expired because of reaching the maximum lifetime of a patent

Effective date: 20181129