MY202139A - Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method - Google Patents
Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing methodInfo
- Publication number
- MY202139A MY202139A MYPI2019000211A MYPI2019000211A MY202139A MY 202139 A MY202139 A MY 202139A MY PI2019000211 A MYPI2019000211 A MY PI2019000211A MY PI2019000211 A MYPI2019000211 A MY PI2019000211A MY 202139 A MY202139 A MY 202139A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor
- defect detection
- light
- manufacturing
- semiconductor device
- Prior art date
Links
- 230000007547 defect Effects 0.000 title abstract 4
- 238000001514 detection method Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title 4
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 238000005286 illumination Methods 0.000 abstract 2
- 238000003384 imaging method Methods 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016133401 | 2016-07-05 | ||
| JP2017112873A JP6505776B2 (ja) | 2016-07-05 | 2017-06-07 | 欠陥検出装置、欠陥検出方法、ウェハ、半導体チップ、ダイボンダ、半導体製造方法、および半導体装置製造方法 |
| JP2017112870 | 2017-06-07 | ||
| PCT/JP2017/023932 WO2018008512A1 (ja) | 2016-07-05 | 2017-06-29 | 欠陥検出装置、欠陥検出方法、ウェハ、半導体チップ、半導体装置、ダイボンダ、ボンディング方法、半導体製造方法、および半導体装置製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY202139A true MY202139A (en) | 2024-04-05 |
Family
ID=60912617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2019000211A MY202139A (en) | 2016-07-05 | 2017-06-29 | Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| MY (1) | MY202139A (ja) |
| WO (1) | WO2018008512A1 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7299728B2 (ja) * | 2019-03-22 | 2023-06-28 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
| EP3971948A4 (en) * | 2019-05-31 | 2022-06-08 | Huawei Technologies Co., Ltd. | DEVICE FOR DETECTING CHIP CRACKS |
| CN117878025B (zh) * | 2024-03-11 | 2024-05-28 | 江苏芯德半导体科技有限公司 | 一种自动卡控晶圆图谱上缺陷芯片的方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0373831A (ja) * | 1989-05-19 | 1991-03-28 | Mitsubishi Rayon Co Ltd | 欠陥検査装置 |
| JP3033453B2 (ja) * | 1994-11-17 | 2000-04-17 | ニチデン機械株式会社 | 小片チップのセンシング方法 |
| JPH09105724A (ja) * | 1995-08-04 | 1997-04-22 | Kobe Steel Ltd | 表面検査装置 |
| JPH10253547A (ja) * | 1997-03-06 | 1998-09-25 | Kao Corp | 基板外観検査システム |
| JP2000321212A (ja) * | 1999-05-13 | 2000-11-24 | Nikon Corp | 表面検査装置 |
| JP3898401B2 (ja) * | 1999-11-29 | 2007-03-28 | 株式会社日立ハイテクインスツルメンツ | 部品供給装置 |
| US6966476B2 (en) * | 2003-07-30 | 2005-11-22 | Stanley Fastening Systems, L.P. | Integrated check pawl, last nail-retaining, and dry fire lock-out mechanism for fastener-driving tool |
| JP4631002B2 (ja) * | 2006-06-29 | 2011-02-16 | 独立行政法人産業技術総合研究所 | 欠陥を検出する方法及びそのための装置 |
| JP2008046011A (ja) * | 2006-08-17 | 2008-02-28 | Nikon Corp | 表面検査装置 |
| JP2010190722A (ja) * | 2009-02-18 | 2010-09-02 | Hitachi High-Technologies Corp | 欠陥検査方法及び欠陥検査装置 |
| JP2012013614A (ja) * | 2010-07-02 | 2012-01-19 | Hitachi Ltd | 鏡面検査方法及びその装置 |
-
2017
- 2017-06-29 WO PCT/JP2017/023932 patent/WO2018008512A1/ja active Application Filing
- 2017-06-29 MY MYPI2019000211A patent/MY202139A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018008512A1 (ja) | 2018-01-11 |
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