MY202139A - Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method - Google Patents
Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing methodInfo
- Publication number
- MY202139A MY202139A MYPI2019000211A MYPI2019000211A MY202139A MY 202139 A MY202139 A MY 202139A MY PI2019000211 A MYPI2019000211 A MY PI2019000211A MY PI2019000211 A MYPI2019000211 A MY PI2019000211A MY 202139 A MY202139 A MY 202139A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor
- defect detection
- light
- manufacturing
- semiconductor device
- Prior art date
Links
- 230000007547 defect Effects 0.000 title abstract 4
- 238000001514 detection method Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title 4
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 238000005286 illumination Methods 0.000 abstract 2
- 238000003384 imaging method Methods 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
This defect (40) detection device detects a defect (40) formed in a covering layer in a workpiece provided with a light and dark layer having a light and dark pattern, and the covering layer covering the light and dark pattern of the light and dark layer. Illumination light emitted from an illuminator has a wavelength at which the intensity of light that is reflected or scattered from the covering layer and is incident on an imaging device is higher than that of light that is reflected from at least the light and dark layer and is incident on the imaging device. Therefore, the illumination light reduces the influence of the light and dark pattern of the light and dark layer.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016133401 | 2016-07-05 | ||
JP2017112870 | 2017-06-07 | ||
JP2017112873A JP6505776B2 (en) | 2016-07-05 | 2017-06-07 | Defect detection apparatus, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method |
PCT/JP2017/023932 WO2018008512A1 (en) | 2016-07-05 | 2017-06-29 | Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
MY202139A true MY202139A (en) | 2024-04-05 |
Family
ID=60912617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019000211A MY202139A (en) | 2016-07-05 | 2017-06-29 | Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method |
Country Status (2)
Country | Link |
---|---|
MY (1) | MY202139A (en) |
WO (1) | WO2018008512A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7299728B2 (en) * | 2019-03-22 | 2023-06-28 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and semiconductor device manufacturing method |
WO2020237683A1 (en) * | 2019-05-31 | 2020-12-03 | 华为技术有限公司 | Chip crack detection apparatus |
CN117878025B (en) * | 2024-03-11 | 2024-05-28 | 江苏芯德半导体科技有限公司 | Method for automatically clamping and controlling defective chips on wafer map |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0373831A (en) * | 1989-05-19 | 1991-03-28 | Mitsubishi Rayon Co Ltd | Device for inspecting defect |
JP3033453B2 (en) * | 1994-11-17 | 2000-04-17 | ニチデン機械株式会社 | Small chip sensing method |
JPH09105724A (en) * | 1995-08-04 | 1997-04-22 | Kobe Steel Ltd | Surface inspection device |
JPH10253547A (en) * | 1997-03-06 | 1998-09-25 | Kao Corp | Visual inspection system for board |
JP2000321212A (en) * | 1999-05-13 | 2000-11-24 | Nikon Corp | Surface inspection apparatus |
JP3898401B2 (en) * | 1999-11-29 | 2007-03-28 | 株式会社日立ハイテクインスツルメンツ | Parts supply device |
US6966476B2 (en) * | 2003-07-30 | 2005-11-22 | Stanley Fastening Systems, L.P. | Integrated check pawl, last nail-retaining, and dry fire lock-out mechanism for fastener-driving tool |
JP4631002B2 (en) * | 2006-06-29 | 2011-02-16 | 独立行政法人産業技術総合研究所 | Method for detecting defects and apparatus therefor |
JP2008046011A (en) * | 2006-08-17 | 2008-02-28 | Nikon Corp | Surface inspecting device |
JP2010190722A (en) * | 2009-02-18 | 2010-09-02 | Hitachi High-Technologies Corp | Method and device for inspecting defect |
JP2012013614A (en) * | 2010-07-02 | 2012-01-19 | Hitachi Ltd | Specular inspection method and specular inspection device |
-
2017
- 2017-06-29 MY MYPI2019000211A patent/MY202139A/en unknown
- 2017-06-29 WO PCT/JP2017/023932 patent/WO2018008512A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2018008512A1 (en) | 2018-01-11 |
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