MY194439A - Copper terminal material having excellent insertion/removal properties and method for producing same - Google Patents
Copper terminal material having excellent insertion/removal properties and method for producing sameInfo
- Publication number
- MY194439A MY194439A MYPI2019004079A MYPI2019004079A MY194439A MY 194439 A MY194439 A MY 194439A MY PI2019004079 A MYPI2019004079 A MY PI2019004079A MY PI2019004079 A MYPI2019004079 A MY PI2019004079A MY 194439 A MY194439 A MY 194439A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper
- inclusive
- alloy layer
- nickel
- tin
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052802 copper Inorganic materials 0.000 title abstract 5
- 239000010949 copper Substances 0.000 title abstract 5
- 239000000463 material Substances 0.000 title abstract 3
- 238000003780 insertion Methods 0.000 title 1
- 230000037431 insertion Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract 4
- 239000013078 crystal Substances 0.000 abstract 4
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 3
- 229910052759 nickel Inorganic materials 0.000 abstract 3
- 229910018471 Cu6Sn5 Inorganic materials 0.000 abstract 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017006184A JP6423025B2 (ja) | 2017-01-17 | 2017-01-17 | 挿抜性に優れた錫めっき付銅端子材及びその製造方法 |
| PCT/JP2018/000996 WO2018135482A1 (ja) | 2017-01-17 | 2018-01-16 | コネクタ用端子材及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY194439A true MY194439A (en) | 2022-11-30 |
Family
ID=62908690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2019004079A MY194439A (en) | 2017-01-17 | 2018-01-16 | Copper terminal material having excellent insertion/removal properties and method for producing same |
Country Status (9)
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7040224B2 (ja) * | 2018-03-30 | 2022-03-23 | 三菱マテリアル株式会社 | 錫めっき付銅端子材及びその製造方法 |
| JP7293829B2 (ja) | 2019-04-11 | 2023-06-20 | 富士フイルムビジネスイノベーション株式会社 | 定着部材、定着装置、及び画像形成装置 |
| JP7354719B2 (ja) | 2019-09-24 | 2023-10-03 | 富士フイルムビジネスイノベーション株式会社 | 定着部材、定着装置、及び画像形成装置 |
| JP7272224B2 (ja) * | 2019-09-30 | 2023-05-12 | 三菱マテリアル株式会社 | コネクタ用端子材 |
| CN110592515B (zh) * | 2019-09-30 | 2022-06-17 | 凯美龙精密铜板带（河南）有限公司 | 一种热浸镀锡铜材及其制造方法 |
| CN111009759B (zh) * | 2019-12-23 | 2021-08-20 | 苏州威贝斯特电子科技有限公司 | 一种端子组合物及其插座连接器用制品 |
| JP2023061782A (ja) * | 2021-10-20 | 2023-05-02 | Ｊｘ金属株式会社 | めっき材及び電子部品 |
| DE102021130188A1 (de) * | 2021-11-18 | 2023-05-25 | Te Connectivity Germany Gmbh | Verfahren zur oberflächenbehandlung eines elektrischen kontaktlements und kontaktelement |
| JP7579476B1 (ja) * | 2024-02-21 | 2024-11-07 | 有限会社 ナプラ | 端子 |
| JP7732566B1 (ja) | 2024-10-23 | 2025-09-02 | 三菱マテリアル株式会社 | コネクタ用端子材及びその製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7820303B2 (en) * | 2004-09-10 | 2010-10-26 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Conductive material for connecting part and method for manufacturing the conductive material |
| JP4503620B2 (ja) | 2007-01-25 | 2010-07-14 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
| JP5319101B2 (ja) * | 2007-10-31 | 2013-10-16 | Ｊｘ日鉱日石金属株式会社 | 電子部品用Ｓｎめっき材 |
| WO2010084532A1 (ja) | 2009-01-20 | 2010-07-29 | 三菱伸銅株式会社 | 導電部材及びその製造方法 |
| EP2620275B1 (en) * | 2012-01-26 | 2019-10-02 | Mitsubishi Materials Corporation | Tin-plated copper-alloy material for terminal and method for producing the same |
| TW201413068A (zh) * | 2012-07-02 | 2014-04-01 | Mitsubishi Materials Corp | 插拔性優良之鍍錫銅合金端子材料及其製造方法 |
| JP5522300B1 (ja) | 2012-07-02 | 2014-06-18 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材及びその製造方法 |
| JP2015063750A (ja) * | 2013-08-26 | 2015-04-09 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
| JP6160582B2 (ja) * | 2014-09-11 | 2017-07-12 | 三菱マテリアル株式会社 | 錫めっき銅合金端子材及びその製造方法 |
| JP5984980B2 (ja) * | 2015-02-24 | 2016-09-06 | Ｊｘ金属株式会社 | 電子部品用Ｓｎめっき材 |
| JP6558971B2 (ja) | 2015-06-17 | 2019-08-14 | 株式会社日立ハイテクノロジーズ | 採血装置 |
-
2017
- 2017-01-17 JP JP2017006184A patent/JP6423025B2/ja active Active
-
2018
- 2018-01-16 MY MYPI2019004079A patent/MY194439A/en unknown
- 2018-01-16 MX MX2019008513A patent/MX2019008513A/es unknown
- 2018-01-16 EP EP18742148.2A patent/EP3572558A4/en active Pending
- 2018-01-16 US US16/478,256 patent/US10923245B2/en active Active
- 2018-01-16 KR KR1020197023283A patent/KR102390232B1/ko active Active
- 2018-01-16 WO PCT/JP2018/000996 patent/WO2018135482A1/ja unknown
- 2018-01-16 CN CN201880005730.7A patent/CN110177904A/zh active Pending
- 2018-01-17 TW TW107101682A patent/TWI799404B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018135482A1 (ja) | 2018-07-26 |
| TWI799404B (zh) | 2023-04-21 |
| US10923245B2 (en) | 2021-02-16 |
| EP3572558A4 (en) | 2020-10-28 |
| US20190362865A1 (en) | 2019-11-28 |
| MX2019008513A (es) | 2019-12-02 |
| TW201832643A (zh) | 2018-09-01 |
| JP2018115361A (ja) | 2018-07-26 |
| CN110177904A (zh) | 2019-08-27 |
| KR102390232B1 (ko) | 2022-04-22 |
| KR20190101465A (ko) | 2019-08-30 |
| JP6423025B2 (ja) | 2018-11-14 |
| EP3572558A1 (en) | 2019-11-27 |
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