MY190925A - Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method - Google Patents

Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method

Info

Publication number
MY190925A
MY190925A MYPI2017704846A MYPI2017704846A MY190925A MY 190925 A MY190925 A MY 190925A MY PI2017704846 A MYPI2017704846 A MY PI2017704846A MY PI2017704846 A MYPI2017704846 A MY PI2017704846A MY 190925 A MY190925 A MY 190925A
Authority
MY
Malaysia
Prior art keywords
mold
electronic
mold cavity
holder
cavity block
Prior art date
Application number
MYPI2017704846A
Other languages
English (en)
Inventor
Masuda Kosaku
Nishimoto Masakazu
Miyahara Hiroaki
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of MY190925A publication Critical patent/MY190925A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3665—Moulds for making articles of definite length, i.e. discrete articles cores or inserts, e.g. pins, mandrels, sliders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
MYPI2017704846A 2015-06-19 2016-01-08 Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method MY190925A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015124024A JP6020667B1 (ja) 2015-06-19 2015-06-19 トランスファー成形機および電子部品を製造する方法
PCT/JP2016/050550 WO2016203779A1 (ja) 2015-06-19 2016-01-08 電子部品封止金型、トランスファー成形機および電子部品封止方法

Publications (1)

Publication Number Publication Date
MY190925A true MY190925A (en) 2022-05-20

Family

ID=57216899

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017704846A MY190925A (en) 2015-06-19 2016-01-08 Electronic-components sealing mold, transfer molding apparatus, and electronic-components sealing method

Country Status (6)

Country Link
JP (1) JP6020667B1 (zh)
KR (1) KR102144610B1 (zh)
CN (1) CN107708956B (zh)
MY (1) MY190925A (zh)
TW (1) TWI668769B (zh)
WO (1) WO2016203779A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6296195B1 (ja) * 2017-07-21 2018-03-20 第一精工株式会社 樹脂封止用金型の調整方法及び樹脂封止用金型
JP7092513B2 (ja) * 2018-02-09 2022-06-28 アピックヤマダ株式会社 圧縮成形金型用モールドベース
TWI787417B (zh) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 壓縮成形用模具及壓縮成形裝置
JP6923502B2 (ja) * 2018-11-21 2021-08-18 Ｔｏｗａ株式会社 トランスファ駆動機構、樹脂成形装置および樹脂成形品の製造方法
CN110126177A (zh) * 2019-05-30 2019-08-16 开平市盈光机电科技有限公司 一种通过弹簧调节活动型腔的包括中框的手机后盖胚料的成型工艺
JP7160770B2 (ja) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置
TWI711520B (zh) * 2019-09-11 2020-12-01 日商朝日科技股份有限公司 樹脂密封成形裝置及樹脂密封成形方法
CN112976666B (zh) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 一种应用于压缩成形的模具上的动平衡缓冲机构
TWI822159B (zh) * 2022-06-30 2023-11-11 萬潤科技股份有限公司 壓合裝置及壓合設備
KR102498076B1 (ko) * 2022-08-22 2023-02-10 에스피반도체통신 주식회사 탑 몰드 블럭 무빙 구조를 갖는 미세 체적 변화 캐비티형 반도체칩용 금형
CN115332095B (zh) * 2022-10-12 2022-12-27 安徽大华半导体科技有限公司 一种qfn大基板的封装模具及方法
CN117790397B (zh) * 2024-02-26 2024-05-10 湖南酷牛存储科技有限公司 一种多层存储芯片封装设备及其工作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3524205B2 (ja) * 1995-04-18 2004-05-10 株式会社サイネックス 半導体樹脂封止装置
JP3280634B2 (ja) * 1999-03-26 2002-05-13 松下電工株式会社 半導体パッケージの製造方法及び半導体パッケージ製造用の金型及び半導体パッケージ
DE60041789D1 (de) * 1999-12-16 2009-04-23 Dai Ichi Seiko Co Ltd Verfahren zum Versiegeln mit Kunststoff
JP3368242B2 (ja) * 1999-12-16 2003-01-20 第一精工株式会社 樹脂封止方法及び樹脂封止装置
JP2002219740A (ja) * 2001-01-26 2002-08-06 Nec Kansai Ltd 樹脂モールド装置および樹脂モールド方法
JP2003053791A (ja) * 2001-08-22 2003-02-26 Mitsubishi Electric Corp 半導体製造装置及び該装置により製造された半導体装置
JP3612063B2 (ja) * 2003-02-24 2005-01-19 第一精工株式会社 樹脂封止金型、それを用いた樹脂封止方法および樹脂封止装置
JP4243177B2 (ja) * 2003-12-22 2009-03-25 株式会社ルネサステクノロジ 半導体装置の製造方法
US8342837B2 (en) * 2006-09-19 2013-01-01 Dai-Ichi Seiko Co., Ltd. Resin sealing apparatus
JP5065747B2 (ja) 2007-04-27 2012-11-07 アサヒ・エンジニアリング株式会社 半導体パッケージの製造方法及び製造装置
JP5352896B2 (ja) * 2008-01-19 2013-11-27 アピックヤマダ株式会社 トランスファ成形方法及びトランスファ成形装置
JP6058431B2 (ja) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 樹脂モールド装置、および樹脂モールド方法

Also Published As

Publication number Publication date
JP6020667B1 (ja) 2016-11-02
CN107708956A (zh) 2018-02-16
TW201701371A (zh) 2017-01-01
CN107708956B (zh) 2020-06-09
TWI668769B (zh) 2019-08-11
JP2017011072A (ja) 2017-01-12
KR20180018573A (ko) 2018-02-21
WO2016203779A1 (ja) 2016-12-22
KR102144610B1 (ko) 2020-08-13

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