MY185297A - Work sucking board, work cutting apparatus, work-cutting method, and fabricating method for work sucking board - Google Patents

Work sucking board, work cutting apparatus, work-cutting method, and fabricating method for work sucking board

Info

Publication number
MY185297A
MY185297A MYPI2015002612A MYPI2015002612A MY185297A MY 185297 A MY185297 A MY 185297A MY PI2015002612 A MYPI2015002612 A MY PI2015002612A MY PI2015002612 A MYPI2015002612 A MY PI2015002612A MY 185297 A MY185297 A MY 185297A
Authority
MY
Malaysia
Prior art keywords
work
sucking board
cutting
board
sucking
Prior art date
Application number
MYPI2015002612A
Other languages
English (en)
Inventor
Watanabe Hajime
Amakawa Tsuyoshi
Tsutafuji Katsunori
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY185297A publication Critical patent/MY185297A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Jigs For Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
MYPI2015002612A 2014-10-24 2015-10-22 Work sucking board, work cutting apparatus, work-cutting method, and fabricating method for work sucking board MY185297A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014217101A JP5897686B1 (ja) 2014-10-24 2014-10-24 ワーク吸着板、ワーク切断装置、ワーク切断方法、およびワーク吸着板の製造方法

Publications (1)

Publication Number Publication Date
MY185297A true MY185297A (en) 2021-04-30

Family

ID=55628663

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015002612A MY185297A (en) 2014-10-24 2015-10-22 Work sucking board, work cutting apparatus, work-cutting method, and fabricating method for work sucking board

Country Status (5)

Country Link
JP (1) JP5897686B1 (zh)
KR (1) KR101739199B1 (zh)
CN (1) CN105538519B (zh)
MY (1) MY185297A (zh)
TW (1) TWI577516B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6815138B2 (ja) * 2016-09-06 2021-01-20 株式会社ディスコ 吸引保持システム
JP6284996B1 (ja) * 2016-11-04 2018-02-28 Ｔｏｗａ株式会社 検査方法、樹脂封止装置、樹脂封止方法及び樹脂封止品の製造方法
EP3403782B1 (de) * 2017-05-16 2022-11-02 Mayr-Melnhof Karton AG Werkzeug sowie verfahren zur herstellung eines nutzens aus einem kartonbogen
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
CN108890752B (zh) * 2018-07-26 2023-08-25 盐城市裕正精密机械有限公司 一种裁断机的刀模切割机构
DE102018215738A1 (de) * 2018-09-17 2020-03-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zum Entnehmen eines Werkstückteils aus einem Restwerkstück
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
DE102020115831B4 (de) * 2020-06-16 2024-03-14 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Schalteinrichtung mit einer Druckeinrichtung
JP7354069B2 (ja) * 2020-08-26 2023-10-02 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法
JP7183223B2 (ja) * 2020-08-28 2022-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TW202213614A (zh) * 2020-09-16 2022-04-01 力成科技股份有限公司 晶圓運送裝置
JP7068409B2 (ja) * 2020-09-23 2022-05-16 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
JP7084519B1 (ja) * 2021-03-04 2022-06-14 Ｔｏｗａ株式会社 加工装置
CN114147504B (zh) * 2021-12-14 2023-04-11 江苏集萃精凯高端装备技术有限公司 镜片固定装置及镜片的超精密车削加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01165166U (zh) * 1988-04-29 1989-11-17
JPH0936599A (ja) * 1995-07-17 1997-02-07 Hitachi Ltd 基板の保持方法およびその装置
KR100614797B1 (ko) 2005-03-24 2006-08-28 한미반도체 주식회사 반도체 제조공정용 척테이블
TWI274744B (en) * 2005-05-09 2007-03-01 Tpo Displays Corp Tray for cutting panel and panel manufacturing method using the same
KR100795966B1 (ko) 2006-12-19 2008-01-21 한미반도체 주식회사 반도체 패키지 제조용 쏘잉장치의 척테이블
JP2008221391A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 基板吸着固定機構
JP2009028889A (ja) * 2007-06-26 2009-02-12 Bridgestone Corp 炭化ケイ素単結晶基板の製造方法及び炭化ケイ素単結晶基板製造装置
JP2013207051A (ja) * 2012-03-28 2013-10-07 Shibaura Mechatronics Corp 保持装置、保持システム、および電子デバイスの製造方法
JP2014031286A (ja) * 2012-08-02 2014-02-20 Hoya Corp 電子機器用カバーガラスのガラス基板の製造方法
JP2014184502A (ja) * 2013-03-22 2014-10-02 Nippon Electric Glass Co Ltd 吸着パッド及びワーク加工装置
CN203428526U (zh) * 2013-08-08 2014-02-12 信利光电股份有限公司 一种菲林吸附装置
CN203697120U (zh) * 2014-02-24 2014-07-09 合肥鑫晟光电科技有限公司 一种切割设备

Also Published As

Publication number Publication date
CN105538519A (zh) 2016-05-04
CN105538519B (zh) 2017-07-28
TW201628812A (zh) 2016-08-16
JP5897686B1 (ja) 2016-03-30
JP2016083717A (ja) 2016-05-19
TWI577516B (zh) 2017-04-11
KR20160048659A (ko) 2016-05-04
KR101739199B1 (ko) 2017-05-23

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