MY184278A - Resin sealing apparatus and resin sealing method - Google Patents

Resin sealing apparatus and resin sealing method

Info

Publication number
MY184278A
MY184278A MYPI2014000061A MYPI2014000061A MY184278A MY 184278 A MY184278 A MY 184278A MY PI2014000061 A MYPI2014000061 A MY PI2014000061A MY PI2014000061 A MYPI2014000061 A MY PI2014000061A MY 184278 A MY184278 A MY 184278A
Authority
MY
Malaysia
Prior art keywords
resin tablets
resin sealing
resin
communicating passage
tablets
Prior art date
Application number
MYPI2014000061A
Other languages
English (en)
Inventor
Takada Naoki
Owari Hiroki
Takeuchi Shin
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY184278A publication Critical patent/MY184278A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
MYPI2014000061A 2013-01-08 2014-01-08 Resin sealing apparatus and resin sealing method MY184278A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013001303A JP5985402B2 (ja) 2013-01-08 2013-01-08 樹脂封止装置及び樹脂封止方法

Publications (1)

Publication Number Publication Date
MY184278A true MY184278A (en) 2021-03-30

Family

ID=51040949

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014000061A MY184278A (en) 2013-01-08 2014-01-08 Resin sealing apparatus and resin sealing method

Country Status (5)

Country Link
JP (1) JP5985402B2 (ko)
KR (1) KR101587694B1 (ko)
CN (1) CN103915352B (ko)
MY (1) MY184278A (ko)
TW (1) TWI527167B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101678441B1 (ko) 2014-07-16 2016-11-22 엘지전자 주식회사 음식물 처리장치
JP6430342B2 (ja) * 2015-08-11 2018-11-28 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法並びに成形型
CN107466160B (zh) 2016-06-06 2022-04-29 宁波舜宇光电信息有限公司 摄像模组的模塑电路板的制造设备及其制造方法
CN107466159B (zh) * 2016-06-06 2022-07-19 宁波舜宇光电信息有限公司 摄像模组的模塑电路板及其制造设备和制造方法
JP6923423B2 (ja) * 2017-11-21 2021-08-18 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JP7416392B2 (ja) 2019-02-27 2024-01-17 株式会社ショウワ インデックス洗浄装置
JP7121763B2 (ja) * 2020-02-14 2022-08-18 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
JP7360368B2 (ja) * 2020-08-18 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP2022045705A (ja) * 2020-09-09 2022-03-22 アピックヤマダ株式会社 樹脂供給機構及びそれを備えた樹脂封止装置
JP7417507B2 (ja) * 2020-11-10 2024-01-18 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN113353664A (zh) * 2021-06-22 2021-09-07 濮阳市恩赢高分子材料有限公司 用于苯并噁嗪树脂生产的移动式卸料固化装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3423766B2 (ja) * 1994-03-11 2003-07-07 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び金型装置
JP3575893B2 (ja) * 1995-11-27 2004-10-13 アピックヤマダ株式会社 樹脂タブレットの温度管理機構を備えた樹脂モールド装置
JP2002127186A (ja) * 2000-10-25 2002-05-08 Matsushita Electric Works Ltd トランスファー成形装置用の材料供給装置
KR101254860B1 (ko) * 2008-09-30 2013-04-15 토와 가부시기가이샤 전자 부품의 압축 수지 밀봉 성형 방법 및 그를 위한 장치
JP5697919B2 (ja) * 2010-07-29 2015-04-08 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP5776092B2 (ja) * 2011-01-11 2015-09-09 アピックヤマダ株式会社 圧縮成形方法及び圧縮成形装置並びに樹脂供給ハンドラ
JP5682033B2 (ja) * 2011-03-14 2015-03-11 アピックヤマダ株式会社 樹脂封止装置

Also Published As

Publication number Publication date
JP2014135330A (ja) 2014-07-24
CN103915352B (zh) 2017-07-14
CN103915352A (zh) 2014-07-09
KR101587694B1 (ko) 2016-01-21
KR20140090068A (ko) 2014-07-16
TWI527167B (zh) 2016-03-21
TW201436124A (zh) 2014-09-16
JP5985402B2 (ja) 2016-09-06

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