PH12016500367A1 - Cryo-smashing of waste pcb - Google Patents

Cryo-smashing of waste pcb

Info

Publication number
PH12016500367A1
PH12016500367A1 PH12016500367A PH12016500367A PH12016500367A1 PH 12016500367 A1 PH12016500367 A1 PH 12016500367A1 PH 12016500367 A PH12016500367 A PH 12016500367A PH 12016500367 A PH12016500367 A PH 12016500367A PH 12016500367 A1 PH12016500367 A1 PH 12016500367A1
Authority
PH
Philippines
Prior art keywords
smashing
cryo
pcb
waste pcb
waste
Prior art date
Application number
PH12016500367A
Inventor
Feng Tao
Original Assignee
Linde Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linde Ag filed Critical Linde Ag
Publication of PH12016500367A1 publication Critical patent/PH12016500367A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C19/00—Other disintegrating devices or methods
    • B02C19/18—Use of auxiliary physical effects, e.g. ultrasonics, irradiation, for disintegrating
    • B02C19/186—Use of cold or heat for disintegrating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/04—Disintegrating plastics, e.g. by milling
    • B29B17/0412—Disintegrating plastics, e.g. by milling to large particles, e.g. beads, granules, flakes, slices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/04—Disintegrating plastics, e.g. by milling
    • B29B2017/0416—Cooling the plastics before disintegration, e.g. freezing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Abstract

A method and an apparatus of cryo-smashing waste PCB are provided. The method comprises pre-heating the PCB, cooling the pre-heated PCB, and smashing the cooled PCB.
PH12016500367A 2013-09-03 2016-02-24 Cryo-smashing of waste pcb PH12016500367A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2013/082823 WO2015032019A1 (en) 2013-09-03 2013-09-03 Cryo-smashing of waste pcb

Publications (1)

Publication Number Publication Date
PH12016500367A1 true PH12016500367A1 (en) 2016-05-02

Family

ID=52627668

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12016500367A PH12016500367A1 (en) 2013-09-03 2016-02-24 Cryo-smashing of waste pcb

Country Status (5)

Country Link
KR (1) KR20160048970A (en)
CN (1) CN105473246B (en)
PH (1) PH12016500367A1 (en)
TW (1) TWI590873B (en)
WO (1) WO2015032019A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105750058A (en) * 2016-04-19 2016-07-13 赵美玲 Ore crushing device and method
CN110280372A (en) * 2019-08-02 2019-09-27 合肥通彩自动化设备有限公司 A kind of temperature difference crusher for TFT glass substrates crash
CN111872022A (en) * 2020-07-09 2020-11-03 湖州巨旺墙体材料有限公司 Low-cost refractory material rapid recycling process
KR102334989B1 (en) * 2020-10-13 2021-12-02 강명숙 Crushing method of PCB

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07140871A (en) * 1993-09-24 1995-06-02 Asmo Co Ltd Waste toner processor
DE19518277C1 (en) * 1995-05-18 1996-05-23 Daimler Benz Ag Process for processing scrap from assembled printed circuit boards from electrical or electronic devices
CN1115210C (en) * 1998-12-11 2003-07-23 松下电器产业株式会社 Method for separating metal material from waste printed circuit board and destruction distillation apparatus for processing waste materials
CN100518969C (en) * 2006-09-15 2009-07-29 清华大学 Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method
CN101386015A (en) * 2008-10-31 2009-03-18 天津大学 Metal and non-metal pyrogenation separation method on waste printed plate board
CN101642765B (en) * 2009-09-04 2012-07-04 北京航空航天大学 Recycling method of discarded circuit board
CN202105696U (en) * 2011-05-31 2012-01-11 南通腾达服装粘合剂有限公司 Low-temperature crusher

Also Published As

Publication number Publication date
WO2015032019A1 (en) 2015-03-12
CN105473246A (en) 2016-04-06
CN105473246B (en) 2018-11-06
TW201526989A (en) 2015-07-16
KR20160048970A (en) 2016-05-04
TWI590873B (en) 2017-07-11

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PH12016500367A1 (en) Cryo-smashing of waste pcb