MY181601A - Plating bath composition and method for electroless plating of palladium - Google Patents

Plating bath composition and method for electroless plating of palladium

Info

Publication number
MY181601A
MY181601A MYPI2017701577A MYPI2017701577A MY181601A MY 181601 A MY181601 A MY 181601A MY PI2017701577 A MYPI2017701577 A MY PI2017701577A MY PI2017701577 A MYPI2017701577 A MY PI2017701577A MY 181601 A MY181601 A MY 181601A
Authority
MY
Malaysia
Prior art keywords
palladium
bath composition
present
plating
plating bath
Prior art date
Application number
MYPI2017701577A
Other languages
English (en)
Inventor
Beck Thomas
Steinberger Gerhard
Andreas Walter Dr
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MY181601A publication Critical patent/MY181601A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
MYPI2017701577A 2014-12-17 2015-12-17 Plating bath composition and method for electroless plating of palladium MY181601A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14198656 2014-12-17

Publications (1)

Publication Number Publication Date
MY181601A true MY181601A (en) 2020-12-29

Family

ID=52133927

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017701577A MY181601A (en) 2014-12-17 2015-12-17 Plating bath composition and method for electroless plating of palladium

Country Status (8)

Country Link
US (1) US20170321327A1 (zh)
EP (1) EP3234219B1 (zh)
JP (1) JP6664400B2 (zh)
KR (1) KR102459744B1 (zh)
CN (1) CN107109653B (zh)
MY (1) MY181601A (zh)
TW (1) TWI680207B (zh)
WO (1) WO2016097084A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6732751B2 (ja) * 2014-12-17 2020-07-29 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ パラジウム無電解めっき用のめっき浴組成物およびパラジウムの無電解めっき方法
WO2017043067A1 (ja) * 2015-09-11 2017-03-16 富士フイルム株式会社 走行支援装置及び走行支援装置による走行支援方法
TWI707061B (zh) * 2015-11-27 2020-10-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
KR102274349B1 (ko) * 2016-08-23 2021-07-07 아토테크더치랜드게엠베하 갈륨 니트라이드 반도체의 비-활성화 표면 상에 팔라듐을 직접 침착하는 방법
KR20200121333A (ko) 2018-02-20 2020-10-23 우에무라 고교 가부시키가이샤 무전해 팔라듐 도금액 및 팔라듐 피막

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA968908A (en) * 1971-07-29 1975-06-10 Photocircuits Division Of Kollmorgen Corporation Sensitized substrates for chemical metallization
US4424241A (en) * 1982-09-27 1984-01-03 Bell Telephone Laboratories, Incorporated Electroless palladium process
JPH02205388A (ja) * 1989-02-03 1990-08-15 Hitachi Chem Co Ltd 半導体光触媒を用いた無電解めっきによるプリント回路の製造法
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
DE4415211A1 (de) * 1993-05-13 1994-12-08 Atotech Deutschland Gmbh Verfahren zur Abscheidung von Palladiumschichten
US6207128B1 (en) * 1997-05-05 2001-03-27 Akzo Nobel N.V. Method of producing a catalyst
JPH1161425A (ja) * 1997-08-27 1999-03-05 Ebara Yuujiraito Kk パラジウム−スズ被膜の導電性向上方法
JP3972158B2 (ja) * 1998-03-24 2007-09-05 石原薬品株式会社 無電解パラジウムメッキ液
JP3437980B2 (ja) * 2000-04-10 2003-08-18 有限会社関東学院大学表面工学研究所 無電解パラジウム−ニッケルめっき浴およびこれを用いるめっき方法ならびにこの方法により得られるめっき製品
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
JP2006083446A (ja) * 2004-09-17 2006-03-30 Okuno Chem Ind Co Ltd 無電解パラジウム−銀合金めっき液
WO2009099067A1 (ja) * 2008-02-04 2009-08-13 Sekisui Chemical Co., Ltd. メッキ構造体
JP4511623B1 (ja) * 2009-05-08 2010-07-28 小島化学薬品株式会社 無電解パラジウムめっき液
JP5253369B2 (ja) * 2009-12-18 2013-07-31 公益財団法人地球環境産業技術研究機構 複合体の製造方法
DE102010012204B4 (de) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
CN103459031A (zh) * 2010-12-16 2013-12-18 能源技术公司 催化剂、催化剂的制备方法、脱氧的方法以及用于燃料制造的系统
EP2581470B1 (en) * 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
US20140072706A1 (en) * 2012-09-11 2014-03-13 Ernest Long Direct Electroless Palladium Plating on Copper
KR101469683B1 (ko) * 2013-05-31 2014-12-05 주식회사 불스원신소재 무전해 및 전해 연속 공정에 의해 제조된 구리 및 니켈 도금 탄소 섬유를 이용한 전자파 차폐 복합재의 제조 방법 및 전자파 차폐 복합재

Also Published As

Publication number Publication date
KR20170093845A (ko) 2017-08-16
CN107109653B (zh) 2020-02-07
WO2016097084A1 (en) 2016-06-23
TW201627531A (zh) 2016-08-01
KR102459744B1 (ko) 2022-10-26
TWI680207B (zh) 2019-12-21
EP3234219B1 (en) 2019-03-27
US20170321327A1 (en) 2017-11-09
EP3234219A1 (en) 2017-10-25
JP2017538867A (ja) 2017-12-28
JP6664400B2 (ja) 2020-03-13
CN107109653A (zh) 2017-08-29

Similar Documents

Publication Publication Date Title
MY181601A (en) Plating bath composition and method for electroless plating of palladium
MY182304A (en) Plating bath composition and method for electroless plating of palladium
WO2014072885A3 (en) Composition for metal electroplating comprising leveling agent
MX2023012571A (es) Procesamiento de capa de material de perovskita.
MY168645A (en) Plating bath for electroless deposition of nickel layers
MY181804A (en) Method for creating a hidden pattern
EP3095788A3 (en) Organoaminosilane precursors and methods for depositing films comprising same
MX2013012735A (es) Metodo para incrementar las propiedades adhesivas de compuestos adhesivos sensibles a la presion, sobre sustratos por medio de tratamiento con plasma.
EP2982702A4 (en) FLUORINE-CONTAINING ETHER COMPOUND, FLUORINE-CONTAINING ETHER COMPOSITION, AND COATING SOLUTION, AND SURFACE-LAYERING SUBSTRATE, AND PROCESS FOR PRODUCING THE SAME
EP2981507A4 (en) Metal compound, method for preparing the same, selective metallization of surface of substrate with the metal compound
MX344173B (es) Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos.
IL217536A (en) Composition containing copper ion source and at least one copper coating electrically, using it electrically coating and process for coating copper layer
MY165453A (en) Drill having a coating
MX2017011660A (es) Metodo de impresion por inyeccion de tinta.
EP2990505A4 (en) SUBSTRATE PROCESSING COMPOSITION FOR COATED METAL PLATE, PLATED METAL PLATE SUBSTRATE-PROCESSED, AND METHOD OF MANUFACTURING THE SAME, COATED AND PLATED METAL PLATE, AND METHOD OF MANUFACTURING THE PLATE
MY186814A (en) Film formation method
WO2011092236A3 (de) Badabscheidungslösung zur nasschemischen abscheidung einer metallsulfidschicht und zugehörige herstellungsverfahren
MY181612A (en) Plating bath composition and method for electroless plating of palladium
MY176735A (en) Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method
WO2014015063A3 (en) Electroless nickel coatings and compositions and methods for forming the coatings
NZ742785A (en) Methods for preparing substituted 5,6-dihydro-6-phenylbenzo[f]isoquinolin-2-amine
WO2015090991A3 (de) Verfahren zur herstellung strukturierter metallischer beschichtungen
MY185286A (en) Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
TW201614678A (en) Silver-coated copper powder and method for producing same
MY186470A (en) Plating bath and method for electroless deposition of nickel layers