MY181612A - Plating bath composition and method for electroless plating of palladium - Google Patents

Plating bath composition and method for electroless plating of palladium

Info

Publication number
MY181612A
MY181612A MYPI2017701581A MYPI2017701581A MY181612A MY 181612 A MY181612 A MY 181612A MY PI2017701581 A MYPI2017701581 A MY PI2017701581A MY PI2017701581 A MYPI2017701581 A MY PI2017701581A MY 181612 A MY181612 A MY 181612A
Authority
MY
Malaysia
Prior art keywords
palladium
bath composition
plating
present
aqueous
Prior art date
Application number
MYPI2017701581A
Inventor
Dr Andreas Walter
Katharina Muskulus
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MY181612A publication Critical patent/MY181612A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plats- ing bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aromatic compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aromatic compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aromatic compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.
MYPI2017701581A 2014-12-17 2015-12-17 Plating bath composition and method for electroless plating of palladium MY181612A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14198654 2014-12-17

Publications (1)

Publication Number Publication Date
MY181612A true MY181612A (en) 2020-12-29

Family

ID=52133925

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017701581A MY181612A (en) 2014-12-17 2015-12-17 Plating bath composition and method for electroless plating of palladium

Country Status (8)

Country Link
US (1) US10385458B2 (en)
EP (1) EP3234218A2 (en)
JP (1) JP6732751B2 (en)
KR (1) KR102614202B1 (en)
CN (1) CN107002242B (en)
MY (1) MY181612A (en)
TW (1) TWI690619B (en)
WO (1) WO2016097083A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707061B (en) * 2015-11-27 2020-10-11 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium
KR102587691B1 (en) * 2020-11-10 2023-10-10 멜텍스 가부시키가이샤 Formaldehyde-free electroless copper plating solution
CN114086160A (en) * 2021-11-10 2022-02-25 江苏艾森半导体材料股份有限公司 Copper surface chemical plating palladium activating solution and application thereof

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE222346C (en)
GB1174851A (en) * 1967-07-05 1969-12-17 Technograph Ltd Sensitization Process for Electroless Plating
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
US4424241A (en) 1982-09-27 1984-01-03 Bell Telephone Laboratories, Incorporated Electroless palladium process
US4415409A (en) * 1983-02-22 1983-11-15 Allied Corporation Process for the separation of high boiling oxygenated compounds from mixtures with phenol and/or cresol
DD222346A1 (en) 1984-03-08 1985-05-15 Funk A Bergbau Huettenkombinat SOLUTION FOR THE AUTOCATALTIC DIVISION OF PALLADIUM
JPH05214551A (en) * 1991-06-19 1993-08-24 Ishihara Chem Co Ltd Palladium-base electroless plating solution
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
DE4415211A1 (en) * 1993-05-13 1994-12-08 Atotech Deutschland Gmbh Process for the deposition of palladium layers
JP3035763B2 (en) * 1993-08-30 2000-04-24 小島化学薬品株式会社 Electroless palladium plating solution
JP3972158B2 (en) 1998-03-24 2007-09-05 石原薬品株式会社 Electroless palladium plating solution
JP3920462B2 (en) 1998-07-13 2007-05-30 株式会社大和化成研究所 Aqueous solutions for obtaining noble metals by chemical reduction deposition
JP3816241B2 (en) * 1998-07-14 2006-08-30 株式会社大和化成研究所 Aqueous solution for reducing and precipitating metals
WO2002022909A1 (en) * 2000-09-18 2002-03-21 Hitachi Chemical Co., Ltd. Electroless gold plating solution and method for electroless gold plating
JP4375702B2 (en) * 2001-10-25 2009-12-02 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Plating composition
JP4171604B2 (en) * 2002-03-18 2008-10-22 株式会社大和化成研究所 Electroless plating bath and metal coating obtained using the plating bath
SE0403042D0 (en) 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Improved stabilization and performance of autocatalytic electroless process
JP4162246B2 (en) 2005-08-12 2008-10-08 石原薬品株式会社 Cyanide-free silver-based plating bath, plated body and plating method
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
JP5458758B2 (en) 2009-09-11 2014-04-02 上村工業株式会社 Catalyst application solution and electroless plating method and direct plating method using the same
EP2559786B1 (en) * 2011-08-17 2018-01-03 Rohm and Haas Electronic Materials, L.L.C. Stable catalyst solution for electroless metallization
EP2581470B1 (en) * 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
JP6089164B2 (en) * 2012-03-30 2017-03-08 石原ケミカル株式会社 Replenishment method for tin plating solution
CN102912324B (en) * 2012-10-25 2014-09-24 南京大地冷冻食品有限公司 High-stability palladium catalyst concentrated solution and preparation method thereof
EP2740818B1 (en) * 2012-12-05 2016-03-30 ATOTECH Deutschland GmbH Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes
CN106460182B (en) * 2014-04-10 2019-07-09 安美特德国有限公司 The method of bath compositions and the electroless for palladium
MY181601A (en) * 2014-12-17 2020-12-29 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
TWI707061B (en) * 2015-11-27 2020-10-11 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium
TWI649449B (en) * 2015-11-27 2019-02-01 德國艾托特克公司 Plating bath composition and method for electroless plating of palladium

Also Published As

Publication number Publication date
JP6732751B2 (en) 2020-07-29
KR20170093846A (en) 2017-08-16
KR102614202B1 (en) 2023-12-14
TWI690619B (en) 2020-04-11
US10385458B2 (en) 2019-08-20
EP3234218A2 (en) 2017-10-25
CN107002242B (en) 2020-02-11
JP2017538866A (en) 2017-12-28
WO2016097083A2 (en) 2016-06-23
WO2016097083A3 (en) 2016-08-11
US20190093235A1 (en) 2019-03-28
CN107002242A (en) 2017-08-01
TW201631210A (en) 2016-09-01

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