GB1174851A - Sensitization Process for Electroless Plating - Google Patents
Sensitization Process for Electroless PlatingInfo
- Publication number
- GB1174851A GB1174851A GB3088267A GB3088267A GB1174851A GB 1174851 A GB1174851 A GB 1174851A GB 3088267 A GB3088267 A GB 3088267A GB 3088267 A GB3088267 A GB 3088267A GB 1174851 A GB1174851 A GB 1174851A
- Authority
- GB
- United Kingdom
- Prior art keywords
- salt
- soluble
- metal
- sensitization
- hydroxyl compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1,174,851. Sensitization for electroless plating. TECHNOGRAPH Ltd. June 28, 1968 [July 5, 1967], No.30882/67. Headings C7E and C7F. A solution for sensitizing surfaces prior to electroless deposition of metal contains a precious metal salt, a stannous salt, and a water-soluble hydroxyl-group-containing organic compound, which acts as a stabilizer. The solution preferably contains 0À2 to 2 g/l precious metal chloride, 20-80 g/l SnCl 2 , and 25-400 ml/1 of 37% aqueous HCl. The hydroxyl compound may be one of the following, used in an amount not less than that indicated: ethylene glycol, 25% V/V, isopropyl alcohol 25% V/V, glycerol 12À5% V/V, or sucrose, 40 g/l. However, the hydroxyl compound is preferably an aromatic hydroxyl compound more water-soluble than phenol, e.g. resorcinol, a sulphonated phenol, catechol, quinol, pyrogallol, or phloroglucinol, used in amounts of 30 to 50 g/l. Prior to sensitization, the following steps may be carried out: (1) abrasive scrubbing (for heavily soiled surface) (2) etching/degreasing, rising for instance a soluble ammonium salt and a quaternary organic amine salt surfactant such as cetyl pyridinium bromide, (3) metal oxide removal (metal surfaces only) using a chelating agent such as E.D.T.A. disodium salt, dipotassium tartrate, or citric acid/ammonia and (4) rinsing with HCl, possibly containing SnCl 2 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3088267A GB1174851A (en) | 1967-07-05 | 1967-07-05 | Sensitization Process for Electroless Plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3088267A GB1174851A (en) | 1967-07-05 | 1967-07-05 | Sensitization Process for Electroless Plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1174851A true GB1174851A (en) | 1969-12-17 |
Family
ID=10314604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3088267A Expired GB1174851A (en) | 1967-07-05 | 1967-07-05 | Sensitization Process for Electroless Plating |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1174851A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2105898A1 (en) * | 1970-02-05 | 1971-09-02 | Kollmorgen Corp | Sensitive solution and process for its manufacture and use |
| DK151196B (en) * | 1973-08-01 | 1987-11-09 | Kollmorgen Tech Corp | PROCEDURE FOR PREPARING A SENSIBILIZATION OF SURFACES WITH REGARD TO THE MARKETING OF METAL FROM AN AIRLESS WORKING METAL DISPOSAL |
| US10385458B2 (en) * | 2014-12-17 | 2019-08-20 | Atotech Deutschland Gmbh | Plating bath composition and method for electroless plating of palladium |
| CZ309565B6 (en) * | 2022-02-02 | 2023-04-12 | EGO 93 s.r.o | Sensitizing solution and preparing it |
-
1967
- 1967-07-05 GB GB3088267A patent/GB1174851A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2105898A1 (en) * | 1970-02-05 | 1971-09-02 | Kollmorgen Corp | Sensitive solution and process for its manufacture and use |
| DK151196B (en) * | 1973-08-01 | 1987-11-09 | Kollmorgen Tech Corp | PROCEDURE FOR PREPARING A SENSIBILIZATION OF SURFACES WITH REGARD TO THE MARKETING OF METAL FROM AN AIRLESS WORKING METAL DISPOSAL |
| US10385458B2 (en) * | 2014-12-17 | 2019-08-20 | Atotech Deutschland Gmbh | Plating bath composition and method for electroless plating of palladium |
| CZ309565B6 (en) * | 2022-02-02 | 2023-04-12 | EGO 93 s.r.o | Sensitizing solution and preparing it |
| EP4223714A1 (en) * | 2022-02-02 | 2023-08-09 | Ego 93, s.r.o. | A sensitizing solution and method of its preparation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |