KR102459744B1 - 팔라듐의 무전해 도금을 위한 도금 배쓰 조성물 및 방법 - Google Patents

팔라듐의 무전해 도금을 위한 도금 배쓰 조성물 및 방법 Download PDF

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Publication number
KR102459744B1
KR102459744B1 KR1020177015896A KR20177015896A KR102459744B1 KR 102459744 B1 KR102459744 B1 KR 102459744B1 KR 1020177015896 A KR1020177015896 A KR 1020177015896A KR 20177015896 A KR20177015896 A KR 20177015896A KR 102459744 B1 KR102459744 B1 KR 102459744B1
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KR
South Korea
Prior art keywords
palladium
electroless
deposition
plating bath
group
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KR1020177015896A
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English (en)
Korean (ko)
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KR20170093845A (ko
Inventor
토마스 벡
게르하르트 슈타인베르거
안드레아스 발터
Original Assignee
아토테크 도이칠란트 게엠베하 운트 콤파니 카게
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Publication of KR20170093845A publication Critical patent/KR20170093845A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
KR1020177015896A 2014-12-17 2015-12-17 팔라듐의 무전해 도금을 위한 도금 배쓰 조성물 및 방법 KR102459744B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14198656 2014-12-17
EP14198656.2 2014-12-17
PCT/EP2015/080138 WO2016097084A1 (en) 2014-12-17 2015-12-17 Plating bath composition and method for electroless plating of palladium

Publications (2)

Publication Number Publication Date
KR20170093845A KR20170093845A (ko) 2017-08-16
KR102459744B1 true KR102459744B1 (ko) 2022-10-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177015896A KR102459744B1 (ko) 2014-12-17 2015-12-17 팔라듐의 무전해 도금을 위한 도금 배쓰 조성물 및 방법

Country Status (8)

Country Link
US (1) US20170321327A1 (zh)
EP (1) EP3234219B1 (zh)
JP (1) JP6664400B2 (zh)
KR (1) KR102459744B1 (zh)
CN (1) CN107109653B (zh)
MY (1) MY181601A (zh)
TW (1) TWI680207B (zh)
WO (1) WO2016097084A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI690619B (zh) * 2014-12-17 2020-04-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
CN108027976B (zh) * 2015-09-11 2021-10-29 富士胶片株式会社 行驶支援装置以及基于行驶支援装置的行驶支援方法
TWI707061B (zh) * 2015-11-27 2020-10-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
WO2018036951A1 (en) * 2016-08-23 2018-03-01 Atotech Deutschland Gmbh Method for directly depositing palladium onto a non-activated surface of a gallium nitride semiconductor
WO2019163665A1 (ja) * 2018-02-20 2019-08-29 上村工業株式会社 無電解パラジウムめっき液、およびパラジウム皮膜

Citations (1)

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JP2006083446A (ja) * 2004-09-17 2006-03-30 Okuno Chem Ind Co Ltd 無電解パラジウム−銀合金めっき液

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US4424241A (en) * 1982-09-27 1984-01-03 Bell Telephone Laboratories, Incorporated Electroless palladium process
JPH02205388A (ja) * 1989-02-03 1990-08-15 Hitachi Chem Co Ltd 半導体光触媒を用いた無電解めっきによるプリント回路の製造法
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
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JP3437980B2 (ja) * 2000-04-10 2003-08-18 有限会社関東学院大学表面工学研究所 無電解パラジウム−ニッケルめっき浴およびこれを用いるめっき方法ならびにこの方法により得られるめっき製品
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
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Also Published As

Publication number Publication date
JP6664400B2 (ja) 2020-03-13
TWI680207B (zh) 2019-12-21
CN107109653B (zh) 2020-02-07
EP3234219A1 (en) 2017-10-25
TW201627531A (zh) 2016-08-01
CN107109653A (zh) 2017-08-29
KR20170093845A (ko) 2017-08-16
MY181601A (en) 2020-12-29
EP3234219B1 (en) 2019-03-27
US20170321327A1 (en) 2017-11-09
WO2016097084A1 (en) 2016-06-23
JP2017538867A (ja) 2017-12-28

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