MY178751A - Silver paste having excellent low-temperature sinterability and method for manufacturing same silver paste - Google Patents

Silver paste having excellent low-temperature sinterability and method for manufacturing same silver paste

Info

Publication number
MY178751A
MY178751A MYPI2016702566A MYPI2016702566A MY178751A MY 178751 A MY178751 A MY 178751A MY PI2016702566 A MYPI2016702566 A MY PI2016702566A MY PI2016702566 A MYPI2016702566 A MY PI2016702566A MY 178751 A MY178751 A MY 178751A
Authority
MY
Malaysia
Prior art keywords
silver paste
silver particles
solid
metal paste
excellent low
Prior art date
Application number
MYPI2016702566A
Other languages
English (en)
Inventor
Yuichi Makita
Yuusuke Ohshima
Junichi Taniuchi
Hitoshi Kubo
Original Assignee
Tanaka Precious Metal Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54008883&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY178751(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tanaka Precious Metal Ind filed Critical Tanaka Precious Metal Ind
Publication of MY178751A publication Critical patent/MY178751A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
MYPI2016702566A 2014-02-25 2015-02-20 Silver paste having excellent low-temperature sinterability and method for manufacturing same silver paste MY178751A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014034554A JP5795096B2 (ja) 2014-02-25 2014-02-25 低温焼結性に優れる銀ペースト及び該銀ペーストの製造方法

Publications (1)

Publication Number Publication Date
MY178751A true MY178751A (en) 2020-10-20

Family

ID=54008883

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016702566A MY178751A (en) 2014-02-25 2015-02-20 Silver paste having excellent low-temperature sinterability and method for manufacturing same silver paste

Country Status (7)

Country Link
JP (1) JP5795096B2 (de)
KR (2) KR101866111B1 (de)
CN (1) CN106062886B (de)
DE (1) DE112015000957B4 (de)
MY (1) MY178751A (de)
TW (1) TWI542711B (de)
WO (1) WO2015129562A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107109095B (zh) * 2014-11-25 2021-01-26 阪东化学株式会社 导电性墨水
JP2017066501A (ja) * 2015-10-02 2017-04-06 アルプス電気株式会社 被覆銀粒子の製造方法、液状組成物、被覆銀粒子、被覆銀粒子含有組成物、導電部材、導電部材の製造方法、電気・電子部品および電気・電子機器
KR102517709B1 (ko) 2018-08-30 2023-04-05 다나카 기킨조쿠 고교 가부시키가이샤 저온 소성용의 은 잉크
EP3848134A4 (de) 2018-09-03 2022-02-09 Osaka Soda Co., Ltd. Silbernanopartikel
WO2021044817A1 (ja) 2019-09-02 2021-03-11 株式会社大阪ソーダ 銀粒子
TWI774439B (zh) 2020-07-03 2022-08-11 日商田中貴金屬工業股份有限公司 耐彎折性優異之金屬配線及導電薄片以及為形成該金屬配線之金屬糊
JPWO2022045263A1 (de) 2020-08-31 2022-03-03
EP4223435A1 (de) 2020-09-30 2023-08-09 Osaka Soda Co., Ltd. Elektrisch leitfähiger klebstoff
WO2022176809A1 (ja) 2021-02-18 2022-08-25 学校法人 関西大学 導電性接着剤、導電性接着剤の焼結体、焼結体の製造方法、電子部品、及び電子部品の製造方法
CN113770370A (zh) * 2021-08-18 2021-12-10 清华大学 银粉及其制备方法、银浆和光伏电池
WO2024154463A1 (ja) * 2023-01-17 2024-07-25 富士フイルム株式会社 組成物、導電性接合材、デバイスおよび導電性接合材の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100081563A1 (en) * 2008-09-26 2010-04-01 Andrew Edgar-Beltran Adhesion and coating integrity of washcoats and overcoats
JP5574761B2 (ja) 2009-04-17 2014-08-20 国立大学法人山形大学 被覆銀超微粒子とその製造方法
CN101710497B (zh) * 2009-12-08 2011-04-20 华中科技大学 一种纳米银导电浆料
JP5761483B2 (ja) * 2010-05-07 2015-08-12 戸田工業株式会社 銀微粒子とその製造方法、並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
WO2011148520A1 (ja) * 2010-05-26 2011-12-01 第一工業製薬株式会社 分散剤および分散体組成物
WO2011155055A1 (ja) 2010-06-11 2011-12-15 Ｄｏｗａエレクトロニクス株式会社 低温焼結性接合材および該接合材を用いた接合方法
JP2012031478A (ja) * 2010-07-30 2012-02-16 Toda Kogyo Corp 銀微粒子とその製造方法、並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
JP6241908B2 (ja) * 2011-02-04 2017-12-06 国立大学法人山形大学 被覆金属微粒子とその製造方法
EP2881198B1 (de) 2012-08-02 2020-03-25 National University Corporation Yamagata University Verfahren zur herstellung beschichteter feiner silberpartikel und paste umfassend genannte beschichtete silberfeinpartikel

Also Published As

Publication number Publication date
KR20160113266A (ko) 2016-09-28
CN106062886A (zh) 2016-10-26
TW201538753A (zh) 2015-10-16
KR101866111B1 (ko) 2018-06-08
DE112015000957B4 (de) 2023-01-05
WO2015129562A1 (ja) 2015-09-03
TWI542711B (zh) 2016-07-21
JP2015159096A (ja) 2015-09-03
DE112015000957T5 (de) 2016-11-03
JP5795096B2 (ja) 2015-10-14
CN106062886B (zh) 2018-12-07
KR20180036799A (ko) 2018-04-09

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