MX2015014049A - Pasta para sinterizar con oxido de plata recubierto en superficies nobles y no nobles que son dificiles de sinterizar. - Google Patents
Pasta para sinterizar con oxido de plata recubierto en superficies nobles y no nobles que son dificiles de sinterizar.Info
- Publication number
- MX2015014049A MX2015014049A MX2015014049A MX2015014049A MX2015014049A MX 2015014049 A MX2015014049 A MX 2015014049A MX 2015014049 A MX2015014049 A MX 2015014049A MX 2015014049 A MX2015014049 A MX 2015014049A MX 2015014049 A MX2015014049 A MX 2015014049A
- Authority
- MX
- Mexico
- Prior art keywords
- grade
- sinter
- difficult
- low
- silver oxide
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G3/00—Compounds of copper
- C01G3/02—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G5/00—Compounds of silver
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G55/00—Compounds of ruthenium, rhodium, palladium, osmium, iridium, or platinum
- C01G55/004—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/02—Particle morphology depicted by an image obtained by optical microscopy
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Die Bonding (AREA)
Abstract
La presente invención se refiere a una mezcla que contiene partículas de óxido de metal que son recubiertas con un compuesto orgánico, y un método para conectar los componentes, en el cual se usa tal mezcla. La presente invención también se refiere a un módulo que se produce usando tal mezcla y a un método para producir la mezcla descrita anteriormente.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13163776.1A EP2792642B1 (de) | 2013-04-15 | 2013-04-15 | Sinterpaste mit gecoateten Silberoxid auf schwer sinterbare edlen und unedlen Oberflächen |
PCT/EP2014/053185 WO2014170050A1 (de) | 2013-04-15 | 2014-02-19 | Sinterpaste mit gecoateten silberoxid auf schwer sinterbare edlen und unedlen oberflächen |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2015014049A true MX2015014049A (es) | 2016-02-05 |
Family
ID=48128141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015014049A MX2015014049A (es) | 2013-04-15 | 2014-02-19 | Pasta para sinterizar con oxido de plata recubierto en superficies nobles y no nobles que son dificiles de sinterizar. |
Country Status (9)
Country | Link |
---|---|
US (2) | US20160059361A1 (es) |
EP (1) | EP2792642B1 (es) |
JP (1) | JP6423416B2 (es) |
KR (1) | KR20150143655A (es) |
CN (1) | CN105121352B (es) |
MX (1) | MX2015014049A (es) |
SG (1) | SG11201508293SA (es) |
TW (1) | TW201502108A (es) |
WO (1) | WO2014170050A1 (es) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014114096A1 (de) | 2014-09-29 | 2016-03-31 | Danfoss Silicon Power Gmbh | Sinterwerkzeug für den Unterstempel einer Sintervorrichtung |
DE102014114097B4 (de) | 2014-09-29 | 2017-06-01 | Danfoss Silicon Power Gmbh | Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe |
DE102014114093B4 (de) * | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Verfahren zum Niedertemperatur-Drucksintern |
DE102014114095B4 (de) | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Sintervorrichtung |
CN105599360A (zh) * | 2014-11-14 | 2016-05-25 | 贺利氏德国有限责任两合公司 | 用于制备电感应加热元件的层状复合体 |
JP2020520410A (ja) | 2017-05-12 | 2020-07-09 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | 金属ペーストの手段によりコンポーネントを接続する方法 |
EP3401039A1 (de) | 2017-05-12 | 2018-11-14 | Heraeus Deutschland GmbH & Co. KG | Verfahren zum verbinden von bauelementen mittels metallpaste |
WO2018231612A2 (en) * | 2017-06-12 | 2018-12-20 | Ormet Circuits, Inc. | Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof |
EP4263120A1 (de) * | 2020-12-16 | 2023-10-25 | Heraeus Deutschland GmbH & Co. KG | Sinterpaste und deren verwendung zum verbinden von bauelementen |
CN112759952A (zh) * | 2020-12-25 | 2021-05-07 | 浙江苏生元福珠宝有限公司 | 油性烧结银浆料及其制备方法 |
DE102021121625B3 (de) | 2021-08-20 | 2022-11-03 | Danfoss Silicon Power Gmbh | Verfahren zum Herstellen einer wenigstens ein aktives elektronisches Bauelement und wenigstens ein passives Bauelement aufweisenden elektronischen Baugruppe |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1950767B1 (en) | 2005-09-21 | 2012-08-22 | Nihon Handa Co., Ltd. | Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board |
WO2008024625A1 (en) * | 2006-08-21 | 2008-02-28 | Omg Americas, Inc. | Conductive paste with enhanced color properties |
JP5151150B2 (ja) * | 2006-12-28 | 2013-02-27 | 株式会社日立製作所 | 導電性焼結層形成用組成物、これを用いた導電性被膜形成法および接合法 |
JP4895994B2 (ja) * | 2006-12-28 | 2012-03-14 | 株式会社日立製作所 | 金属粒子を用いた接合方法及び接合材料 |
JP2009067837A (ja) * | 2007-09-11 | 2009-04-02 | Dowa Electronics Materials Co Ltd | 導電性接着材 |
JP5611537B2 (ja) * | 2009-04-28 | 2014-10-22 | 日立化成株式会社 | 導電性接合材料、それを用いた接合方法、並びにそれによって接合された半導体装置 |
DE102009040078A1 (de) | 2009-09-04 | 2011-03-10 | W.C. Heraeus Gmbh | Metallpaste mit CO-Vorläufern |
DE102009040076A1 (de) * | 2009-09-04 | 2011-03-10 | W.C. Heraeus Gmbh | Metallpaste mit Oxidationsmittel |
DE102010044326A1 (de) | 2010-09-03 | 2012-03-08 | Heraeus Materials Technology Gmbh & Co. Kg | Verwendung von aliphatischen Kohlenwasserstoffen und Paraffinen als Lösemittel in Silbersinterpasten |
DE102010042702A1 (de) * | 2010-10-20 | 2012-04-26 | Robert Bosch Gmbh | Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung |
US20130251447A1 (en) * | 2010-10-20 | 2013-09-26 | Robert Bosch Gmbh | Starting material and process for producing a sintered join |
WO2012129554A2 (en) | 2011-03-24 | 2012-09-27 | E. I. Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
JP5966379B2 (ja) * | 2011-05-31 | 2016-08-10 | 三菱マテリアル株式会社 | パワーモジュール、及び、パワーモジュールの製造方法 |
US9039942B2 (en) * | 2011-12-21 | 2015-05-26 | E I Du Pont De Nemours And Company | Lead-free conductive paste composition and semiconductor devices made therewith |
-
2013
- 2013-04-15 EP EP13163776.1A patent/EP2792642B1/de active Active
-
2014
- 2014-02-19 MX MX2015014049A patent/MX2015014049A/es unknown
- 2014-02-19 US US14/784,842 patent/US20160059361A1/en not_active Abandoned
- 2014-02-19 SG SG11201508293SA patent/SG11201508293SA/en unknown
- 2014-02-19 JP JP2016508053A patent/JP6423416B2/ja not_active Expired - Fee Related
- 2014-02-19 CN CN201480022024.5A patent/CN105121352B/zh not_active Expired - Fee Related
- 2014-02-19 WO PCT/EP2014/053185 patent/WO2014170050A1/de active Application Filing
- 2014-02-19 KR KR1020157032300A patent/KR20150143655A/ko not_active Application Discontinuation
- 2014-03-26 TW TW103111302A patent/TW201502108A/zh unknown
-
2018
- 2018-05-01 US US15/968,712 patent/US10144095B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20160059361A1 (en) | 2016-03-03 |
US10144095B2 (en) | 2018-12-04 |
CN105121352A (zh) | 2015-12-02 |
EP2792642A1 (de) | 2014-10-22 |
EP2792642B1 (de) | 2018-02-21 |
SG11201508293SA (en) | 2015-11-27 |
KR20150143655A (ko) | 2015-12-23 |
WO2014170050A1 (de) | 2014-10-23 |
JP2016525495A (ja) | 2016-08-25 |
CN105121352B (zh) | 2018-10-16 |
US20180311774A1 (en) | 2018-11-01 |
JP6423416B2 (ja) | 2018-11-14 |
TW201502108A (zh) | 2015-01-16 |
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