MY176799A - Photosensitive resin element - Google Patents

Photosensitive resin element

Info

Publication number
MY176799A
MY176799A MYUI2016701738A MYUI2016701738A MY176799A MY 176799 A MY176799 A MY 176799A MY UI2016701738 A MYUI2016701738 A MY UI2016701738A MY UI2016701738 A MYUI2016701738 A MY UI2016701738A MY 176799 A MY176799 A MY 176799A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin layer
layer contains
solvent
mass
Prior art date
Application number
MYUI2016701738A
Other languages
English (en)
Inventor
Tsutomu Igarashi
Tomohiro Kino
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY176799A publication Critical patent/MY176799A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
MYUI2016701738A 2013-11-29 2014-11-28 Photosensitive resin element MY176799A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013248365 2013-11-29
PCT/JP2014/081599 WO2015080257A1 (ja) 2013-11-29 2014-11-28 感光性樹脂エレメント

Publications (1)

Publication Number Publication Date
MY176799A true MY176799A (en) 2020-08-21

Family

ID=53199192

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2016701738A MY176799A (en) 2013-11-29 2014-11-28 Photosensitive resin element

Country Status (6)

Country Link
JP (2) JPWO2015080257A1 (ja)
KR (2) KR20160020567A (ja)
CN (1) CN105474094B (ja)
MY (1) MY176799A (ja)
TW (5) TWI633388B (ja)
WO (1) WO2015080257A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102494967B1 (ko) * 2017-02-01 2023-02-02 동우 화인켐 주식회사 착색 감광성 수지 조성물, 이를 이용하여 제조된 컬러필터 및 화상표시장치
CN108490737B (zh) * 2018-03-14 2021-11-02 杭州福斯特电子材料有限公司 一种感光性树脂组合物及其用途
WO2021137467A1 (ko) * 2019-12-31 2021-07-08 코오롱인더스트리 주식회사 감광성 수지층, 이를 이용한 드라이 필름 포토레지스트, 및 감광성 엘리먼트
JP7376712B2 (ja) * 2019-12-31 2023-11-08 コーロン インダストリーズ インク 感光性樹脂組成物およびそれを用いたドライフィルムフォトレジスト、感光性エレメント、回路基板、およびディスプレイ装置
JP2023509597A (ja) * 2019-12-31 2023-03-09 コーロン インダストリーズ インク 感光性樹脂層、それを用いたドライフィルムフォトレジスト、および感光性エレメント
CN114761874A (zh) * 2019-12-31 2022-07-15 可隆工业株式会社 光敏树脂层和使用该光敏树脂层的干膜光致抗蚀剂、光敏元件
JP7376723B2 (ja) * 2019-12-31 2023-11-08 コーロン インダストリーズ インク 感光性樹脂組成物およびそれを用いたドライフィルムフォトレジスト、感光性エレメント、回路基板、およびディスプレイ装置
WO2023188008A1 (ja) * 2022-03-29 2023-10-05 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、硬化物の製造方法、硬化物パターンの製造方法、及び、配線板の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11143069A (ja) 1997-11-10 1999-05-28 Fuji Photo Film Co Ltd プリント配線用原板
SG85613A1 (en) * 1998-02-06 2002-01-15 Morton Int Inc Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers
JP2001312056A (ja) * 2000-04-27 2001-11-09 Nichigo Morton Co Ltd 感光性樹脂組成物およびそれを用いてなる感光性フィルム
JP3824508B2 (ja) * 2001-08-10 2006-09-20 旭化成エレクトロニクス株式会社 ドライフィルムレジスト及びその製造方法
JP2006106287A (ja) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法
JP4966528B2 (ja) * 2005-09-14 2012-07-04 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007310201A (ja) * 2006-05-19 2007-11-29 Kaneka Corp 感光性ドライフィルムレジスト及びこれを用いたプリント配線板
JP2008239743A (ja) * 2007-03-27 2008-10-09 Toray Ind Inc ドライフィルムレジスト支持体用ポリエステルフィルム
JP2011048270A (ja) * 2009-08-28 2011-03-10 Hitachi Chem Co Ltd 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
KR20110041925A (ko) * 2009-10-16 2011-04-22 삼성전자주식회사 이중층 패턴형성용 접착필름, 이의 제조방법, 및 이를 이용한 패턴 접착층의 형성방법
JP2011257632A (ja) * 2010-06-10 2011-12-22 Hitachi Chem Co Ltd 感光性エレメント及びそれを用いたレジストパターンの形成法、リードフレーム並びにプリント配線板の製造方法
JP5688116B2 (ja) * 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Also Published As

Publication number Publication date
KR20180040739A (ko) 2018-04-20
TWI630459B (zh) 2018-07-21
KR102139035B1 (ko) 2020-07-29
WO2015080257A1 (ja) 2015-06-04
JPWO2015080257A1 (ja) 2017-03-16
CN105474094B (zh) 2020-09-22
TW201631394A (zh) 2016-09-01
TWI592753B (zh) 2017-07-21
TW201631391A (zh) 2016-09-01
TW201525615A (zh) 2015-07-01
JP6518304B2 (ja) 2019-05-22
TWI633388B (zh) 2018-08-21
KR20160020567A (ko) 2016-02-23
CN105474094A (zh) 2016-04-06
JP2018013799A (ja) 2018-01-25
TW201631392A (zh) 2016-09-01
TW201631393A (zh) 2016-09-01

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