KR20160020567A - 감광성 수지 엘리먼트 - Google Patents

감광성 수지 엘리먼트 Download PDF

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Publication number
KR20160020567A
KR20160020567A KR1020167001362A KR20167001362A KR20160020567A KR 20160020567 A KR20160020567 A KR 20160020567A KR 1020167001362 A KR1020167001362 A KR 1020167001362A KR 20167001362 A KR20167001362 A KR 20167001362A KR 20160020567 A KR20160020567 A KR 20160020567A
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KR
South Korea
Prior art keywords
photosensitive resin
mass
solvent
group
integer
Prior art date
Application number
KR1020167001362A
Other languages
English (en)
Korean (ko)
Inventor
츠토무 이가라시
도모히로 기노
Original Assignee
아사히 가세이 이-매터리얼즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 이-매터리얼즈 가부시키가이샤 filed Critical 아사히 가세이 이-매터리얼즈 가부시키가이샤
Publication of KR20160020567A publication Critical patent/KR20160020567A/ko

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
KR1020167001362A 2013-11-29 2014-11-28 감광성 수지 엘리먼트 KR20160020567A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013248365 2013-11-29
JPJP-P-2013-248365 2013-11-29
PCT/JP2014/081599 WO2015080257A1 (ja) 2013-11-29 2014-11-28 感光性樹脂エレメント

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187010592A Division KR102139035B1 (ko) 2013-11-29 2014-11-28 감광성 수지 엘리먼트

Publications (1)

Publication Number Publication Date
KR20160020567A true KR20160020567A (ko) 2016-02-23

Family

ID=53199192

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187010592A KR102139035B1 (ko) 2013-11-29 2014-11-28 감광성 수지 엘리먼트
KR1020167001362A KR20160020567A (ko) 2013-11-29 2014-11-28 감광성 수지 엘리먼트

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020187010592A KR102139035B1 (ko) 2013-11-29 2014-11-28 감광성 수지 엘리먼트

Country Status (6)

Country Link
JP (2) JPWO2015080257A1 (ja)
KR (2) KR102139035B1 (ja)
CN (1) CN105474094B (ja)
MY (1) MY176799A (ja)
TW (5) TWI630459B (ja)
WO (1) WO2015080257A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102494967B1 (ko) * 2017-02-01 2023-02-02 동우 화인켐 주식회사 착색 감광성 수지 조성물, 이를 이용하여 제조된 컬러필터 및 화상표시장치
CN108490737B (zh) * 2018-03-14 2021-11-02 杭州福斯特电子材料有限公司 一种感光性树脂组合物及其用途
CN114787711A (zh) * 2019-12-31 2022-07-22 可隆工业株式会社 光敏树脂组合物以及使用其的干膜光致抗蚀剂、光敏元件、电路板和显示装置
CN114761874A (zh) * 2019-12-31 2022-07-15 可隆工业株式会社 光敏树脂层和使用该光敏树脂层的干膜光致抗蚀剂、光敏元件
CN114830033A (zh) * 2019-12-31 2022-07-29 可隆工业株式会社 光敏树脂层和使用其的干膜光致抗蚀剂、光敏元件
WO2021137468A1 (ko) * 2019-12-31 2021-07-08 코오롱인더스트리 주식회사 감광성 수지층, 이를 이용한 드라이 필름 포토레지스트, 및 감광성 엘리먼트
WO2021137546A1 (ko) * 2019-12-31 2021-07-08 코오롱인더스트리 주식회사 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 회로기판, 및 디스플레이 장치
CN118355324A (zh) * 2022-03-29 2024-07-16 株式会社力森诺科 感光性树脂组合物、感光性元件、固化物的制造方法、固化物图案的制造方法及线路板的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11143069A (ja) 1997-11-10 1999-05-28 Fuji Photo Film Co Ltd プリント配線用原板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG85613A1 (en) * 1998-02-06 2002-01-15 Morton Int Inc Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers
JP2001312056A (ja) * 2000-04-27 2001-11-09 Nichigo Morton Co Ltd 感光性樹脂組成物およびそれを用いてなる感光性フィルム
JP3824508B2 (ja) * 2001-08-10 2006-09-20 旭化成エレクトロニクス株式会社 ドライフィルムレジスト及びその製造方法
JP2006106287A (ja) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法
JP4966528B2 (ja) * 2005-09-14 2012-07-04 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007310201A (ja) * 2006-05-19 2007-11-29 Kaneka Corp 感光性ドライフィルムレジスト及びこれを用いたプリント配線板
JP2008239743A (ja) * 2007-03-27 2008-10-09 Toray Ind Inc ドライフィルムレジスト支持体用ポリエステルフィルム
JP2011048270A (ja) * 2009-08-28 2011-03-10 Hitachi Chem Co Ltd 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
KR20110041925A (ko) * 2009-10-16 2011-04-22 삼성전자주식회사 이중층 패턴형성용 접착필름, 이의 제조방법, 및 이를 이용한 패턴 접착층의 형성방법
JP2011257632A (ja) * 2010-06-10 2011-12-22 Hitachi Chem Co Ltd 感光性エレメント及びそれを用いたレジストパターンの形成法、リードフレーム並びにプリント配線板の製造方法
JP5688116B2 (ja) * 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11143069A (ja) 1997-11-10 1999-05-28 Fuji Photo Film Co Ltd プリント配線用原板

Also Published As

Publication number Publication date
TWI630459B (zh) 2018-07-21
CN105474094B (zh) 2020-09-22
KR102139035B1 (ko) 2020-07-29
TW201525615A (zh) 2015-07-01
TW201631393A (zh) 2016-09-01
TW201631394A (zh) 2016-09-01
TWI592753B (zh) 2017-07-21
TWI633388B (zh) 2018-08-21
JP2018013799A (ja) 2018-01-25
TW201631391A (zh) 2016-09-01
WO2015080257A1 (ja) 2015-06-04
MY176799A (en) 2020-08-21
TW201631392A (zh) 2016-09-01
KR20180040739A (ko) 2018-04-20
JP6518304B2 (ja) 2019-05-22
JPWO2015080257A1 (ja) 2017-03-16
CN105474094A (zh) 2016-04-06

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