MY175409A - Sputtering target for magnetic recording film, and raw carbon material for use in producing same - Google Patents
Sputtering target for magnetic recording film, and raw carbon material for use in producing sameInfo
- Publication number
- MY175409A MY175409A MYPI2015703482A MYPI2015703482A MY175409A MY 175409 A MY175409 A MY 175409A MY PI2015703482 A MYPI2015703482 A MY PI2015703482A MY PI2015703482 A MYPI2015703482 A MY PI2015703482A MY 175409 A MY175409 A MY 175409A
- Authority
- MY
- Malaysia
- Prior art keywords
- sputtering target
- magnetic recording
- carbon material
- recording film
- producing same
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094300 | 2013-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY175409A true MY175409A (en) | 2020-06-24 |
Family
ID=51791958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015703482A MY175409A (en) | 2013-04-26 | 2014-04-24 | Sputtering target for magnetic recording film, and raw carbon material for use in producing same |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5876155B2 (zh) |
CN (1) | CN104955981B (zh) |
MY (1) | MY175409A (zh) |
SG (1) | SG11201506097YA (zh) |
TW (1) | TWI595103B (zh) |
WO (1) | WO2014175392A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6383510B2 (ja) * | 2016-03-07 | 2018-08-29 | 田中貴金属工業株式会社 | FePt−C系スパッタリングターゲット |
JP7483999B1 (ja) | 2023-09-22 | 2024-05-15 | Jx金属株式会社 | スパッタリングターゲット及びスパッタリングターゲット組立品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012020A (ja) * | 1998-06-23 | 2000-01-14 | Nippon Steel Corp | リチウム二次電池負極用炭素材料 |
US20070189916A1 (en) * | 2002-07-23 | 2007-08-16 | Heraeus Incorporated | Sputtering targets and methods for fabricating sputtering targets having multiple materials |
KR100470151B1 (ko) * | 2002-10-29 | 2005-02-05 | 한국과학기술원 | FePtC 박막을 이용한 고밀도 자기기록매체 및 그제조방법 |
JP5428561B2 (ja) * | 2009-06-16 | 2014-02-26 | 株式会社Gsユアサ | 直接形燃料電池システム及びその運転停止方法 |
JP5678414B2 (ja) * | 2009-06-17 | 2015-03-04 | 三菱化学株式会社 | 黒鉛負極材料及びその製造方法、並びにそれを用いたリチウム二次電池用負極及びリチウム二次電池 |
WO2012086335A1 (ja) * | 2010-12-20 | 2012-06-28 | Jx日鉱日石金属株式会社 | C粒子が分散したFe-Pt系スパッタリングターゲット |
JP5912559B2 (ja) * | 2011-03-30 | 2016-04-27 | 田中貴金属工業株式会社 | FePt−C系スパッタリングターゲットの製造方法 |
US9683284B2 (en) * | 2011-03-30 | 2017-06-20 | Jx Nippon Mining & Metals Corporation | Sputtering target for magnetic recording film |
JP6037197B2 (ja) * | 2011-05-09 | 2016-12-07 | 三菱マテリアル株式会社 | 磁気記録媒体膜形成用スパッタリングターゲットおよびその製造方法 |
-
2014
- 2014-04-24 SG SG11201506097YA patent/SG11201506097YA/en unknown
- 2014-04-24 JP JP2014530046A patent/JP5876155B2/ja active Active
- 2014-04-24 MY MYPI2015703482A patent/MY175409A/en unknown
- 2014-04-24 CN CN201480006305.1A patent/CN104955981B/zh active Active
- 2014-04-24 WO PCT/JP2014/061594 patent/WO2014175392A1/ja active Application Filing
- 2014-04-25 TW TW103114947A patent/TWI595103B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN104955981B (zh) | 2018-01-23 |
WO2014175392A1 (ja) | 2014-10-30 |
SG11201506097YA (en) | 2015-09-29 |
CN104955981A (zh) | 2015-09-30 |
TWI595103B (zh) | 2017-08-11 |
JP5876155B2 (ja) | 2016-03-02 |
JPWO2014175392A1 (ja) | 2017-02-23 |
TW201508074A (zh) | 2015-03-01 |
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