MY173967A - Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism - Google Patents

Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism

Info

Publication number
MY173967A
MY173967A MYPI2015002168A MYPI2015002168A MY173967A MY 173967 A MY173967 A MY 173967A MY PI2015002168 A MYPI2015002168 A MY PI2015002168A MY PI2015002168 A MYPI2015002168 A MY PI2015002168A MY 173967 A MY173967 A MY 173967A
Authority
MY
Malaysia
Prior art keywords
sucking
sucking mechanism
vacuum
sucking member
holes
Prior art date
Application number
MYPI2015002168A
Other languages
English (en)
Inventor
Okamoto Jun
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY173967A publication Critical patent/MY173967A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)
MYPI2015002168A 2014-09-04 2015-09-03 Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism MY173967A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014180254A JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置

Publications (1)

Publication Number Publication Date
MY173967A true MY173967A (en) 2020-02-28

Family

ID=55471207

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015002168A MY173967A (en) 2014-09-04 2015-09-03 Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism

Country Status (5)

Country Link
JP (1) JP6382039B2 (zh)
KR (1) KR20160028953A (zh)
CN (1) CN105405805A (zh)
MY (1) MY173967A (zh)
TW (1) TWI566291B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101899653B1 (ko) * 2016-10-05 2018-09-18 주식회사 포스코 소재 안착장치
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
JP7102157B2 (ja) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN108435714B (zh) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
JP7390855B2 (ja) * 2019-10-24 2023-12-04 株式会社ディスコ 切削装置のチャックテーブル
JP7423161B2 (ja) 2020-06-30 2024-01-29 株式会社ディスコ チャックテーブル
KR20230135661A (ko) * 2021-03-18 2023-09-25 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
US11993066B2 (en) * 2021-03-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
WO2024084715A1 (ja) * 2022-10-21 2024-04-25 株式会社東光高岳 ワーク検査装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62234685A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
JPS62234686A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
KR20040084128A (ko) * 2003-03-26 2004-10-06 한미반도체 주식회사 반도체 쏘잉장치의 척테이블
JP2004330417A (ja) * 2003-04-30 2004-11-25 Towa Corp 基板の切断方法、切断装置および基板吸着固定機構
JP2006229129A (ja) * 2005-02-21 2006-08-31 Fujitsu Ltd 真空吸着装置
JP2006344827A (ja) * 2005-06-09 2006-12-21 Renesas Technology Corp 半導体装置の製造方法
FR2893873B1 (fr) * 2005-11-25 2008-12-12 Air Liquide Procede de coupage avec un laser a fibre d'acier inoxydable
JP2008221391A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 基板吸着固定機構
JP5086690B2 (ja) * 2007-05-18 2012-11-28 日本特殊陶業株式会社 セラミック基板の製造方法
JP5117772B2 (ja) * 2007-06-28 2013-01-16 株式会社ディスコ 切削装置
JP2011040542A (ja) 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd パッケージ基板の分割方法
JP2011216704A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ

Also Published As

Publication number Publication date
JP2016054256A (ja) 2016-04-14
JP6382039B2 (ja) 2018-08-29
TWI566291B (zh) 2017-01-11
KR20160028953A (ko) 2016-03-14
CN105405805A (zh) 2016-03-16
TW201616566A (zh) 2016-05-01

Similar Documents

Publication Publication Date Title
MY173967A (en) Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism
US10632595B2 (en) Bearing flatform, bearing device and laser cutting apparatus
AU2018203009A1 (en) Air compressor
SG10201708954SA (en) Package substrate cutting jig table
BR112018008124A2 (pt) dispositivo de impressão a jato de tinta com dispositivo de suporte de substrato plano e removível
JP2016054256A5 (zh)
EP4201565A3 (en) Miter saw
PH12016502600A1 (en) Component handling assembly and method of handling components
EP2945205A3 (en) Vacuum cleaner
MX2019014698A (es) Dispositivo de procesamiento de alimentos, que comprende un frasco.
TW200603332A (en) Sucking equipment
EP2757808A3 (en) Microphone system with non-orthogonally mounted microphone die
MY175830A (en) Transfer unit including suction openings configured to receive suction pads or seal members therein
BR112015029438A2 (pt) corpo de sucção com coxim separável
SG11201906985QA (en) Bonding apparatus and bonding method
JP2019145548A5 (zh)
WO2012023798A3 (ko) 레이저 가공용 스테이지
WO2016089973A8 (en) Portable table saw
FR2969024B1 (fr) Dispositif formant plot de bridage.
JP2019145550A5 (zh)
SG11201808117RA (en) Substrate processing apparatus
EP2735407A3 (en) Robot system, suction hand, and method for producing product including workpiece
NZ779573A (en) Circular saw apparatus with integrated multistage filtration system
SG10201808052SA (en) Substrate Polishing Apparatus
PH12014502002A1 (en) End handler