MY172522A - Method and apparatus for resin-sealing electronic components - Google Patents

Method and apparatus for resin-sealing electronic components

Info

Publication number
MY172522A
MY172522A MYPI2015001389A MYPI2015001389A MY172522A MY 172522 A MY172522 A MY 172522A MY PI2015001389 A MYPI2015001389 A MY PI2015001389A MY PI2015001389 A MYPI2015001389 A MY PI2015001389A MY 172522 A MY172522 A MY 172522A
Authority
MY
Malaysia
Prior art keywords
die
resin
cavity
air vent
fit
Prior art date
Application number
MYPI2015001389A
Other languages
English (en)
Inventor
Himeno Tomonori
Morohashi Nobuyuki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY172522A publication Critical patent/MY172522A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
MYPI2015001389A 2014-05-29 2015-05-27 Method and apparatus for resin-sealing electronic components MY172522A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014111374A JP6320172B2 (ja) 2014-05-29 2014-05-29 電子部品の樹脂封止方法及び樹脂封止装置

Publications (1)

Publication Number Publication Date
MY172522A true MY172522A (en) 2019-11-28

Family

ID=54842557

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015001389A MY172522A (en) 2014-05-29 2015-05-27 Method and apparatus for resin-sealing electronic components

Country Status (6)

Country Link
JP (1) JP6320172B2 (ja)
KR (1) KR101667879B1 (ja)
CN (1) CN105280506B (ja)
MY (1) MY172522A (ja)
SG (1) SG10201504081PA (ja)
TW (1) TWI602680B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654861B2 (ja) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
EP3188260B1 (en) * 2015-12-31 2020-02-12 Dow Global Technologies Llc Nanostructure material structures and methods
JP6654971B2 (ja) * 2016-06-17 2020-02-26 本田技研工業株式会社 樹脂成形部材の成形方法及び成形システム
JP6436260B1 (ja) * 2018-05-31 2018-12-12 株式会社玉谷製作所 ピン、スリーブ又は入れ子
JP6981935B2 (ja) * 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
CN113195195B (zh) * 2018-08-30 2023-03-10 赫斯基注塑系统有限公司 用于塑料模制的熔体分配器
JP6678973B1 (ja) * 2019-04-09 2020-04-15 アサヒ・エンジニアリング株式会社 樹脂封止装置および樹脂封止方法
CN111775392A (zh) * 2020-08-03 2020-10-16 昆山大全凯帆精密模具有限公司 一种bmc&dmc传递压制模具和加工方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292926A (ja) * 1985-06-21 1986-12-23 Hitachi Hokkai Semiconductor Ltd モ−ルド方法およびモ−ルド装置
JPH06210658A (ja) * 1993-01-19 1994-08-02 Toshiba Corp 樹脂成形用金型装置
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
CN1227107C (zh) * 1999-12-16 2005-11-16 第一精工株式会社 树脂封装用模具装置及树脂封装方法
JP2007152831A (ja) * 2005-12-07 2007-06-21 Sharp Corp 可動エアベントおよびそれを備えたモールド成形装置、並びに電子部品の製造方法
JP5138470B2 (ja) * 2008-06-06 2013-02-06 アピックヤマダ株式会社 トランスファモールド装置とこれを用いたトランスファモールド方法
JP5140517B2 (ja) * 2008-08-07 2013-02-06 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP5744683B2 (ja) * 2011-08-31 2015-07-08 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2013184413A (ja) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5930394B2 (ja) * 2012-07-06 2016-06-08 アピックヤマダ株式会社 樹脂モールド装置
JP6058431B2 (ja) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 樹脂モールド装置、および樹脂モールド方法
JP6259263B2 (ja) * 2013-11-11 2018-01-10 アピックヤマダ株式会社 樹脂モールド金型および樹脂モールド成形方法

Also Published As

Publication number Publication date
SG10201504081PA (en) 2015-12-30
CN105280506B (zh) 2018-06-08
CN105280506A (zh) 2016-01-27
TWI602680B (zh) 2017-10-21
KR20150137992A (ko) 2015-12-09
KR101667879B1 (ko) 2016-10-19
JP6320172B2 (ja) 2018-05-09
TW201603986A (zh) 2016-02-01
JP2015226014A (ja) 2015-12-14

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