KR101667879B1 - 전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치 - Google Patents

전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치 Download PDF

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Publication number
KR101667879B1
KR101667879B1 KR1020150052469A KR20150052469A KR101667879B1 KR 101667879 B1 KR101667879 B1 KR 101667879B1 KR 1020150052469 A KR1020150052469 A KR 1020150052469A KR 20150052469 A KR20150052469 A KR 20150052469A KR 101667879 B1 KR101667879 B1 KR 101667879B1
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KR
South Korea
Prior art keywords
mold
cavity
block
air vent
resin
Prior art date
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KR1020150052469A
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English (en)
Korean (ko)
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KR20150137992A (ko
Inventor
도모노리 히메노
노부유키 모로하시
Original Assignee
토와 가부시기가이샤
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Publication of KR20150137992A publication Critical patent/KR20150137992A/ko
Application granted granted Critical
Publication of KR101667879B1 publication Critical patent/KR101667879B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020150052469A 2014-05-29 2015-04-14 전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치 KR101667879B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014111374A JP6320172B2 (ja) 2014-05-29 2014-05-29 電子部品の樹脂封止方法及び樹脂封止装置
JPJP-P-2014-111374 2014-05-29

Publications (2)

Publication Number Publication Date
KR20150137992A KR20150137992A (ko) 2015-12-09
KR101667879B1 true KR101667879B1 (ko) 2016-10-19

Family

ID=54842557

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150052469A KR101667879B1 (ko) 2014-05-29 2015-04-14 전자 부품의 수지 밀봉 방법 및 수지 밀봉 장치

Country Status (6)

Country Link
JP (1) JP6320172B2 (ja)
KR (1) KR101667879B1 (ja)
CN (1) CN105280506B (ja)
MY (1) MY172522A (ja)
SG (1) SG10201504081PA (ja)
TW (1) TWI602680B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654861B2 (ja) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
EP3188260B1 (en) * 2015-12-31 2020-02-12 Dow Global Technologies Llc Nanostructure material structures and methods
JP6654971B2 (ja) * 2016-06-17 2020-02-26 本田技研工業株式会社 樹脂成形部材の成形方法及び成形システム
JP6436260B1 (ja) * 2018-05-31 2018-12-12 株式会社玉谷製作所 ピン、スリーブ又は入れ子
JP6981935B2 (ja) * 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
US11981062B2 (en) * 2018-08-30 2024-05-14 Husky Injection Molding Systems Ltd Melt dispenser for plastic molding
JP6678973B1 (ja) * 2019-04-09 2020-04-15 アサヒ・エンジニアリング株式会社 樹脂封止装置および樹脂封止方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013049253A (ja) 2011-08-31 2013-03-14 Towa Corp 電子部品の樹脂封止成形方法及び装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292926A (ja) * 1985-06-21 1986-12-23 Hitachi Hokkai Semiconductor Ltd モ−ルド方法およびモ−ルド装置
JPH06210658A (ja) * 1993-01-19 1994-08-02 Toshiba Corp 樹脂成形用金型装置
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
CN100515720C (zh) * 1999-12-16 2009-07-22 第一精工株式会社 树脂封装用模具装置
JP2007152831A (ja) * 2005-12-07 2007-06-21 Sharp Corp 可動エアベントおよびそれを備えたモールド成形装置、並びに電子部品の製造方法
JP5138470B2 (ja) * 2008-06-06 2013-02-06 アピックヤマダ株式会社 トランスファモールド装置とこれを用いたトランスファモールド方法
JP5140517B2 (ja) * 2008-08-07 2013-02-06 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP2013184413A (ja) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5930394B2 (ja) * 2012-07-06 2016-06-08 アピックヤマダ株式会社 樹脂モールド装置
JP6058431B2 (ja) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 樹脂モールド装置、および樹脂モールド方法
JP6259263B2 (ja) * 2013-11-11 2018-01-10 アピックヤマダ株式会社 樹脂モールド金型および樹脂モールド成形方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013049253A (ja) 2011-08-31 2013-03-14 Towa Corp 電子部品の樹脂封止成形方法及び装置

Also Published As

Publication number Publication date
TW201603986A (zh) 2016-02-01
TWI602680B (zh) 2017-10-21
SG10201504081PA (en) 2015-12-30
MY172522A (en) 2019-11-28
CN105280506B (zh) 2018-06-08
KR20150137992A (ko) 2015-12-09
JP2015226014A (ja) 2015-12-14
CN105280506A (zh) 2016-01-27
JP6320172B2 (ja) 2018-05-09

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