MY172522A - Method and apparatus for resin-sealing electronic components - Google Patents
Method and apparatus for resin-sealing electronic componentsInfo
- Publication number
- MY172522A MY172522A MYPI2015001389A MYPI2015001389A MY172522A MY 172522 A MY172522 A MY 172522A MY PI2015001389 A MYPI2015001389 A MY PI2015001389A MY PI2015001389 A MYPI2015001389 A MY PI2015001389A MY 172522 A MY172522 A MY 172522A
- Authority
- MY
- Malaysia
- Prior art keywords
- die
- resin
- cavity
- air vent
- fit
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
[OBJECT] The invention is directed at reducing overall production costs of a resin filing apparatus and simplifying maintenance work for the apparatus by employing a facilitated resin-sealing method and a simplified molding die structure to handle a high-fluidity resin material. [SOLUTION] The apparatus has resin-sealing dies including an upper die (5) and a lower die (8), wherein the upper die (5) and the lower die (8) are opened and closed by a die opening/closing mechanism. A cavity block (16) is disposed on a die surface of the upper die (5) in a manner that is allowed to move in a die opening/closing (15) direction by a floating mechanism having floating pins (18). A cavity (20) and an air vent groove (22) communicating with the cavity (20) are formed in a die surface of the cavity block (16). A fit-in hole (24) is formed in a connected portion of the cavity (20) and the air vent groove (22) along the die opening/closing direction. An air vent block (23) is disposed on a floating pin holder (17) corresponding to the fit-in (20) hole (24) along the die opening/closing direction. The air vent block (23) is slidably and closely fitted in the fit-in hole (24). [SELECTED DRAWING] FIG. 7.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014111374A JP6320172B2 (en) | 2014-05-29 | 2014-05-29 | Resin sealing method and resin sealing device for electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
MY172522A true MY172522A (en) | 2019-11-28 |
Family
ID=54842557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015001389A MY172522A (en) | 2014-05-29 | 2015-05-27 | Method and apparatus for resin-sealing electronic components |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6320172B2 (en) |
KR (1) | KR101667879B1 (en) |
CN (1) | CN105280506B (en) |
MY (1) | MY172522A (en) |
SG (1) | SG10201504081PA (en) |
TW (1) | TWI602680B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6654861B2 (en) * | 2015-11-09 | 2020-02-26 | Towa株式会社 | Resin sealing device and resin sealing method |
EP3188260B1 (en) * | 2015-12-31 | 2020-02-12 | Dow Global Technologies Llc | Nanostructure material structures and methods |
JP6654971B2 (en) * | 2016-06-17 | 2020-02-26 | 本田技研工業株式会社 | Molding method and molding system for resin molded member |
JP6436260B1 (en) * | 2018-05-31 | 2018-12-12 | 株式会社玉谷製作所 | Pin, sleeve or nesting |
JP6981935B2 (en) * | 2018-08-23 | 2021-12-17 | アピックヤマダ株式会社 | Mold mold and resin molding device equipped with it |
US11981062B2 (en) * | 2018-08-30 | 2024-05-14 | Husky Injection Molding Systems Ltd | Melt dispenser for plastic molding |
JP6678973B1 (en) * | 2019-04-09 | 2020-04-15 | アサヒ・エンジニアリング株式会社 | Resin sealing device and resin sealing method |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61292926A (en) * | 1985-06-21 | 1986-12-23 | Hitachi Hokkai Semiconductor Ltd | Molding method and molding equipment |
JPH06210658A (en) * | 1993-01-19 | 1994-08-02 | Toshiba Corp | Mold device for resin molding |
JP2875479B2 (en) * | 1994-09-08 | 1999-03-31 | 日本ペルノックス株式会社 | Semiconductor sealing method |
CN100515720C (en) * | 1999-12-16 | 2009-07-22 | 第一精工株式会社 | Die device for packaging resin |
JP2007152831A (en) * | 2005-12-07 | 2007-06-21 | Sharp Corp | Movable air vent, mold forming apparatus provided with it and manufacturing method of electronic members |
JP5138470B2 (en) * | 2008-06-06 | 2013-02-06 | アピックヤマダ株式会社 | Transfer molding apparatus and transfer molding method using the same |
JP5140517B2 (en) * | 2008-08-07 | 2013-02-06 | アピックヤマダ株式会社 | Resin molding apparatus and resin molding method |
JP5906528B2 (en) * | 2011-07-29 | 2016-04-20 | アピックヤマダ株式会社 | Mold and resin molding apparatus using the same |
JP5744683B2 (en) * | 2011-08-31 | 2015-07-08 | Towa株式会社 | Resin sealing molding method and apparatus for electronic parts |
JP2013184413A (en) * | 2012-03-08 | 2013-09-19 | Sumitomo Heavy Ind Ltd | Resin sealing device and resin sealing method |
JP5930394B2 (en) * | 2012-07-06 | 2016-06-08 | アピックヤマダ株式会社 | Resin molding equipment |
JP6058431B2 (en) * | 2013-03-08 | 2017-01-11 | アピックヤマダ株式会社 | Resin molding apparatus and resin molding method |
JP6259263B2 (en) * | 2013-11-11 | 2018-01-10 | アピックヤマダ株式会社 | Resin mold and resin mold molding method |
-
2014
- 2014-05-29 JP JP2014111374A patent/JP6320172B2/en active Active
-
2015
- 2015-04-10 CN CN201510169123.2A patent/CN105280506B/en active Active
- 2015-04-14 KR KR1020150052469A patent/KR101667879B1/en active IP Right Grant
- 2015-04-17 TW TW104112302A patent/TWI602680B/en active
- 2015-05-25 SG SG10201504081PA patent/SG10201504081PA/en unknown
- 2015-05-27 MY MYPI2015001389A patent/MY172522A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR101667879B1 (en) | 2016-10-19 |
TW201603986A (en) | 2016-02-01 |
TWI602680B (en) | 2017-10-21 |
SG10201504081PA (en) | 2015-12-30 |
CN105280506B (en) | 2018-06-08 |
KR20150137992A (en) | 2015-12-09 |
JP2015226014A (en) | 2015-12-14 |
CN105280506A (en) | 2016-01-27 |
JP6320172B2 (en) | 2018-05-09 |
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