MY172522A - Method and apparatus for resin-sealing electronic components - Google Patents

Method and apparatus for resin-sealing electronic components

Info

Publication number
MY172522A
MY172522A MYPI2015001389A MYPI2015001389A MY172522A MY 172522 A MY172522 A MY 172522A MY PI2015001389 A MYPI2015001389 A MY PI2015001389A MY PI2015001389 A MYPI2015001389 A MY PI2015001389A MY 172522 A MY172522 A MY 172522A
Authority
MY
Malaysia
Prior art keywords
die
resin
cavity
air vent
fit
Prior art date
Application number
MYPI2015001389A
Inventor
Himeno Tomonori
Morohashi Nobuyuki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY172522A publication Critical patent/MY172522A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

[OBJECT] The invention is directed at reducing overall production costs of a resin filing apparatus and simplifying maintenance work for the apparatus by employing a facilitated resin-sealing method and a simplified molding die structure to handle a high-fluidity resin material. [SOLUTION] The apparatus has resin-sealing dies including an upper die (5) and a lower die (8), wherein the upper die (5) and the lower die (8) are opened and closed by a die opening/closing mechanism. A cavity block (16) is disposed on a die surface of the upper die (5) in a manner that is allowed to move in a die opening/closing (15) direction by a floating mechanism having floating pins (18). A cavity (20) and an air vent groove (22) communicating with the cavity (20) are formed in a die surface of the cavity block (16). A fit-in hole (24) is formed in a connected portion of the cavity (20) and the air vent groove (22) along the die opening/closing direction. An air vent block (23) is disposed on a floating pin holder (17) corresponding to the fit-in (20) hole (24) along the die opening/closing direction. The air vent block (23) is slidably and closely fitted in the fit-in hole (24). [SELECTED DRAWING] FIG. 7.
MYPI2015001389A 2014-05-29 2015-05-27 Method and apparatus for resin-sealing electronic components MY172522A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014111374A JP6320172B2 (en) 2014-05-29 2014-05-29 Resin sealing method and resin sealing device for electronic parts

Publications (1)

Publication Number Publication Date
MY172522A true MY172522A (en) 2019-11-28

Family

ID=54842557

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015001389A MY172522A (en) 2014-05-29 2015-05-27 Method and apparatus for resin-sealing electronic components

Country Status (6)

Country Link
JP (1) JP6320172B2 (en)
KR (1) KR101667879B1 (en)
CN (1) CN105280506B (en)
MY (1) MY172522A (en)
SG (1) SG10201504081PA (en)
TW (1) TWI602680B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654861B2 (en) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
EP3188260B1 (en) * 2015-12-31 2020-02-12 Dow Global Technologies Llc Nanostructure material structures and methods
JP6654971B2 (en) * 2016-06-17 2020-02-26 本田技研工業株式会社 Molding method and molding system for resin molded member
JP6436260B1 (en) * 2018-05-31 2018-12-12 株式会社玉谷製作所 Pin, sleeve or nesting
JP6981935B2 (en) * 2018-08-23 2021-12-17 アピックヤマダ株式会社 Mold mold and resin molding device equipped with it
US11981062B2 (en) * 2018-08-30 2024-05-14 Husky Injection Molding Systems Ltd Melt dispenser for plastic molding
JP6678973B1 (en) * 2019-04-09 2020-04-15 アサヒ・エンジニアリング株式会社 Resin sealing device and resin sealing method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292926A (en) * 1985-06-21 1986-12-23 Hitachi Hokkai Semiconductor Ltd Molding method and molding equipment
JPH06210658A (en) * 1993-01-19 1994-08-02 Toshiba Corp Mold device for resin molding
JP2875479B2 (en) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 Semiconductor sealing method
CN100515720C (en) * 1999-12-16 2009-07-22 第一精工株式会社 Die device for packaging resin
JP2007152831A (en) * 2005-12-07 2007-06-21 Sharp Corp Movable air vent, mold forming apparatus provided with it and manufacturing method of electronic members
JP5138470B2 (en) * 2008-06-06 2013-02-06 アピックヤマダ株式会社 Transfer molding apparatus and transfer molding method using the same
JP5140517B2 (en) * 2008-08-07 2013-02-06 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
JP5906528B2 (en) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 Mold and resin molding apparatus using the same
JP5744683B2 (en) * 2011-08-31 2015-07-08 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts
JP2013184413A (en) * 2012-03-08 2013-09-19 Sumitomo Heavy Ind Ltd Resin sealing device and resin sealing method
JP5930394B2 (en) * 2012-07-06 2016-06-08 アピックヤマダ株式会社 Resin molding equipment
JP6058431B2 (en) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
JP6259263B2 (en) * 2013-11-11 2018-01-10 アピックヤマダ株式会社 Resin mold and resin mold molding method

Also Published As

Publication number Publication date
KR101667879B1 (en) 2016-10-19
TW201603986A (en) 2016-02-01
TWI602680B (en) 2017-10-21
SG10201504081PA (en) 2015-12-30
CN105280506B (en) 2018-06-08
KR20150137992A (en) 2015-12-09
JP2015226014A (en) 2015-12-14
CN105280506A (en) 2016-01-27
JP6320172B2 (en) 2018-05-09

Similar Documents

Publication Publication Date Title
MY172522A (en) Method and apparatus for resin-sealing electronic components
MX2017006730A (en) Adaptive side torso airbag.
MY172097A (en) Molded article production apparatus, molded article production method, and molded article
BR112017027161A2 (en) device and process for the production of plastic bags
MX2017003724A (en) Methods of using retrofitted injection molding machines with faster cycle times.
MX2016010920A (en) Machine component facilitating mold base movement.
JP2015226014A5 (en)
IN2015DN00221A (en)
WO2015185205A3 (en) Method for producing a dental drilling template
WO2009054451A1 (en) Compression-molding apparatus, and compression-molding method
EA201590896A1 (en) WAYS OF FORMATION OF THE OBTAINED BY THE CASTING UNDER THE PRESSURE OF THE COMPONENT AND THE FORTOCHOKI OF THE SALON, THE DIRECTING ROD, THE FORTOT OF THE SALON, THE DOOR OF THE VEHICLE AND THE VEHICLE
MX2018010129A (en) Molded material production method and molded material.
TW201611987A (en) Blow mold unit, blow molding machine, and method for fixing blow mold unit
MX2017005410A (en) Blow molding machine with molds moved mechanically and without the aid of electrical, hydraulic or pneumatic devices.
WO2014149822A8 (en) Forming press
AU2014379904A1 (en) Ironing mold and formed material manufacturing method
MX2016015418A (en) A mould tool for injection moulding.
CN204673946U (en) A kind of cover half cylinder core drawing slide block mechanism
PH12017550142A1 (en) A blowing mold for blowing thermoplastic material containers
MX2016016372A (en) Closing mechanism for the mold halves of an i.s. machine.
CN203752454U (en) Demoulding mechanism of point light source car lamp light guide mould
MX2017008932A (en) Press and method for molding an ingot made of thermoplastic or thermosetting material.
CN203198167U (en) Electric hand drill outer shell mold
CN205236817U (en) Stamping die
CN203805239U (en) Battery case injection mold