CN105280506B - 电子部件的树脂封装方法及树脂封装装置 - Google Patents
电子部件的树脂封装方法及树脂封装装置 Download PDFInfo
- Publication number
- CN105280506B CN105280506B CN201510169123.2A CN201510169123A CN105280506B CN 105280506 B CN105280506 B CN 105280506B CN 201510169123 A CN201510169123 A CN 201510169123A CN 105280506 B CN105280506 B CN 105280506B
- Authority
- CN
- China
- Prior art keywords
- cavity
- resin
- block
- stent
- mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 170
- 239000011347 resin Substances 0.000 title claims abstract description 170
- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000005538 encapsulation Methods 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 230000008569 process Effects 0.000 claims description 72
- 238000000465 moulding Methods 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 47
- 238000007789 sealing Methods 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 238000007667 floating Methods 0.000 abstract description 25
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 3
- 230000008439 repair process Effects 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 52
- 208000015943 Coeliac disease Diseases 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 230000006837 decompression Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000037361 pathway Effects 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014111374A JP6320172B2 (ja) | 2014-05-29 | 2014-05-29 | 電子部品の樹脂封止方法及び樹脂封止装置 |
| JP2014-111374 | 2014-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105280506A CN105280506A (zh) | 2016-01-27 |
| CN105280506B true CN105280506B (zh) | 2018-06-08 |
Family
ID=54842557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510169123.2A Active CN105280506B (zh) | 2014-05-29 | 2015-04-10 | 电子部件的树脂封装方法及树脂封装装置 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6320172B2 (ja) |
| KR (1) | KR101667879B1 (ja) |
| CN (1) | CN105280506B (ja) |
| MY (1) | MY172522A (ja) |
| SG (1) | SG10201504081PA (ja) |
| TW (1) | TWI602680B (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6654861B2 (ja) * | 2015-11-09 | 2020-02-26 | Ｔｏｗａ株式会社 | 樹脂封止装置及び樹脂封止方法 |
| EP3188260B1 (en) * | 2015-12-31 | 2020-02-12 | Dow Global Technologies Llc | Nanostructure material structures and methods |
| JP6654971B2 (ja) * | 2016-06-17 | 2020-02-26 | 本田技研工業株式会社 | 樹脂成形部材の成形方法及び成形システム |
| JP6436260B1 (ja) * | 2018-05-31 | 2018-12-12 | 株式会社玉谷製作所 | ピン、スリーブ又は入れ子 |
| JP6981935B2 (ja) * | 2018-08-23 | 2021-12-17 | アピックヤマダ株式会社 | モールド金型及びそれを備えた樹脂モールド装置 |
| CN113015609B (zh) * | 2018-08-30 | 2023-05-12 | 赫斯基注塑系统有限公司 | 具有快速连接和断开的模具 |
| JP6678973B1 (ja) * | 2019-04-09 | 2020-04-15 | アサヒ・エンジニアリング株式会社 | 樹脂封止装置および樹脂封止方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100515717C (zh) * | 1999-12-16 | 2009-07-22 | 第一精工株式会社 | 树脂封装方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292926A (ja) * | 1985-06-21 | 1986-12-23 | Hitachi Hokkai Semiconductor Ltd | モ−ルド方法およびモ−ルド装置 |
| JPH06210658A (ja) * | 1993-01-19 | 1994-08-02 | Toshiba Corp | 樹脂成形用金型装置 |
| JP2875479B2 (ja) * | 1994-09-08 | 1999-03-31 | 日本ペルノックス株式会社 | 半導体の封止方法 |
| JP2007152831A (ja) * | 2005-12-07 | 2007-06-21 | Sharp Corp | 可動エアベントおよびそれを備えたモールド成形装置、並びに電子部品の製造方法 |
| JP5138470B2 (ja) * | 2008-06-06 | 2013-02-06 | アピックヤマダ株式会社 | トランスファモールド装置とこれを用いたトランスファモールド方法 |
| JP5140517B2 (ja) * | 2008-08-07 | 2013-02-06 | アピックヤマダ株式会社 | 樹脂モールド装置および樹脂モールド方法 |
| JP5906528B2 (ja) * | 2011-07-29 | 2016-04-20 | アピックヤマダ株式会社 | モールド金型及びこれを用いた樹脂モールド装置 |
| JP5744683B2 (ja) * | 2011-08-31 | 2015-07-08 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| JP2013184413A (ja) * | 2012-03-08 | 2013-09-19 | Sumitomo Heavy Ind Ltd | 樹脂封止装置及び樹脂封止方法 |
| JP5930394B2 (ja) * | 2012-07-06 | 2016-06-08 | アピックヤマダ株式会社 | 樹脂モールド装置 |
| JP6058431B2 (ja) * | 2013-03-08 | 2017-01-11 | アピックヤマダ株式会社 | 樹脂モールド装置、および樹脂モールド方法 |
| JP6259263B2 (ja) * | 2013-11-11 | 2018-01-10 | アピックヤマダ株式会社 | 樹脂モールド金型および樹脂モールド成形方法 |
-
2014
- 2014-05-29 JP JP2014111374A patent/JP6320172B2/ja active Active
-
2015
- 2015-04-10 CN CN201510169123.2A patent/CN105280506B/zh active Active
- 2015-04-14 KR KR1020150052469A patent/KR101667879B1/ko active IP Right Grant
- 2015-04-17 TW TW104112302A patent/TWI602680B/zh active
- 2015-05-25 SG SG10201504081PA patent/SG10201504081PA/en unknown
- 2015-05-27 MY MYPI2015001389A patent/MY172522A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100515717C (zh) * | 1999-12-16 | 2009-07-22 | 第一精工株式会社 | 树脂封装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105280506A (zh) | 2016-01-27 |
| KR20150137992A (ko) | 2015-12-09 |
| SG10201504081PA (en) | 2015-12-30 |
| TWI602680B (zh) | 2017-10-21 |
| JP6320172B2 (ja) | 2018-05-09 |
| TW201603986A (zh) | 2016-02-01 |
| MY172522A (en) | 2019-11-28 |
| KR101667879B1 (ko) | 2016-10-19 |
| JP2015226014A (ja) | 2015-12-14 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |