MY172341A - Semiconductor-processing pressure-sensitive adhesive tape - Google Patents

Semiconductor-processing pressure-sensitive adhesive tape

Info

Publication number
MY172341A
MY172341A MYPI2016000952A MYPI2016000952A MY172341A MY 172341 A MY172341 A MY 172341A MY PI2016000952 A MYPI2016000952 A MY PI2016000952A MY PI2016000952 A MYPI2016000952 A MY PI2016000952A MY 172341 A MY172341 A MY 172341A
Authority
MY
Malaysia
Prior art keywords
sensitive adhesive
pressure
semiconductor
adhesive tape
semiconductor wafer
Prior art date
Application number
MYPI2016000952A
Other languages
English (en)
Inventor
Akira Yabuki
Yuri Tamagawa
Satoshi Hattori
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY172341A publication Critical patent/MY172341A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
MYPI2016000952A 2013-11-29 2014-11-27 Semiconductor-processing pressure-sensitive adhesive tape MY172341A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013247169 2013-11-29
JP2014040320A JP5607847B1 (ja) 2013-11-29 2014-03-03 半導体加工用粘着テープ

Publications (1)

Publication Number Publication Date
MY172341A true MY172341A (en) 2019-11-21

Family

ID=51840534

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016000952A MY172341A (en) 2013-11-29 2014-11-27 Semiconductor-processing pressure-sensitive adhesive tape

Country Status (7)

Country Link
JP (1) JP5607847B1 (zh)
KR (1) KR101897376B1 (zh)
CN (1) CN105765700B (zh)
MY (1) MY172341A (zh)
PH (1) PH12016500961B1 (zh)
TW (1) TWI589668B (zh)
WO (1) WO2015080188A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201805895XA (en) * 2016-03-04 2018-09-27 Lintec Corp Protective film-forming composite sheet
WO2017163971A1 (ja) * 2016-03-24 2017-09-28 リンテック株式会社 支持シート及び保護膜形成用複合シート
JP6278164B1 (ja) * 2016-05-12 2018-02-14 住友ベークライト株式会社 半導体基板加工用粘着テープ
JP6781639B2 (ja) * 2017-01-31 2020-11-04 株式会社ディスコ ウエーハ生成方法
JP6800062B2 (ja) * 2017-03-28 2020-12-16 古河電気工業株式会社 粘着テープ
WO2019131603A1 (ja) * 2017-12-27 2019-07-04 古河電気工業株式会社 放射線硬化型ダイシング用粘着テープ
JP2019189853A (ja) * 2018-04-23 2019-10-31 積水化学工業株式会社 粘着テープ、粘着テープロール及び粘着テープの製造方法
WO2019235487A1 (ja) * 2018-06-05 2019-12-12 積水化学工業株式会社 粘着テープ
JP7324023B2 (ja) * 2019-03-22 2023-08-09 日東電工株式会社 ダイシングテープ
JP7269095B2 (ja) * 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
JPWO2021065515A1 (zh) * 2019-10-01 2021-04-08
CN111545922B (zh) * 2020-04-08 2022-07-12 山东天岳先进科技股份有限公司 一种碳化硅晶体的加工方法
CN115287004A (zh) * 2022-04-19 2022-11-04 广东莱尔新材料科技股份有限公司 一种用于半导体晶圆加工的胶带及其制备方法
CN115011274B (zh) * 2022-06-24 2023-07-18 浙江权威胶粘制品有限公司 一种改性丙烯酸酯耐高温胶粘带及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06349799A (ja) * 1993-06-08 1994-12-22 Hitachi Chem Co Ltd シリコンウェハーのバックグラインド方法
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP2006135272A (ja) 2003-12-01 2006-05-25 Tokyo Ohka Kogyo Co Ltd 基板のサポートプレート及びサポートプレートの剥離方法
JP4784604B2 (ja) * 2005-05-30 2011-10-05 Ｊｓｒ株式会社 固定剤付きウエハの製造方法
JP2007284577A (ja) * 2006-04-17 2007-11-01 Nitto Denko Corp 粘着シート及びそれを用いた被着体の加工方法
JP5467720B2 (ja) * 2007-12-28 2014-04-09 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
US9111981B2 (en) 2008-01-24 2015-08-18 Brewer Science Inc. Method for reversibly mounting a device wafer to a carrier substrate
JP5184161B2 (ja) 2008-03-17 2013-04-17 古河電気工業株式会社 半導体加工用テープ
DE102008044200B4 (de) 2008-11-28 2012-08-23 Thin Materials Ag Bonding-Verfahren
JP5603757B2 (ja) * 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
KR101198254B1 (ko) * 2010-05-31 2012-11-07 주식회사 케이씨씨 반도체 제조용 점·접착쉬트
KR101311647B1 (ko) * 2010-07-07 2013-09-25 후루카와 덴키 고교 가부시키가이샤 웨이퍼 가공용 테이프 및 그것을 이용한 반도체 가공 방법
JP4865926B1 (ja) * 2011-06-24 2012-02-01 古河電気工業株式会社 ウェハ加工用テープ
JP5019657B1 (ja) * 2011-10-27 2012-09-05 古河電気工業株式会社 半導体デバイス加工用粘着テープ
JP5901422B2 (ja) * 2012-05-15 2016-04-13 古河電気工業株式会社 半導体ウェハのダイシング方法およびこれに用いる半導体加工用ダイシングテープ
JP5379919B1 (ja) * 2013-02-13 2013-12-25 古河電気工業株式会社 半導体加工用粘着テープ

Also Published As

Publication number Publication date
WO2015080188A1 (ja) 2015-06-04
PH12016500961A1 (en) 2016-07-11
TW201529794A (zh) 2015-08-01
TWI589668B (zh) 2017-07-01
PH12016500961B1 (en) 2016-07-11
CN105765700B (zh) 2018-12-11
KR101897376B1 (ko) 2018-09-10
JP2015128126A (ja) 2015-07-09
JP5607847B1 (ja) 2014-10-15
CN105765700A (zh) 2016-07-13
KR20160079045A (ko) 2016-07-05

Similar Documents

Publication Publication Date Title
MY172341A (en) Semiconductor-processing pressure-sensitive adhesive tape
GB2520905A (en) Advanced handler wafer debonding method
SG11201807052WA (en) Surface protective film
PH12018502073A1 (en) Method for manufacturing semiconductor device
JP2011040449A5 (zh)
GB2548726A (en) Low temperature adhesive resins for wafer bonding
AR087632A1 (es) Capas de oxido de silicio depositado por incidencia oblicua para lentes oftalmicas dinamicas
GB2562941A (en) Handler bonding and debonding for semiconductor dies
MY183013A (en) Sheet for semiconductor processing
PH12018500798B1 (en) First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip
SG11201708735SA (en) Tape for semiconductor processing
MY168172A (en) Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device
MY154031A (en) Adhesive tape for processing semiconductor device
SG11201902647VA (en) Thin film affixing device
SG11201900617YA (en) Method for manufacturing semiconductor device
PH12018500851A1 (en) First protective film forming sheet
PH12015500230A1 (en) Dicing sheet and method for manufacturing device chips
TW201612010A (en) Surface-protective film and optical component attached with the same
PH12018500836A1 (en) Curable resin film and first protective film forming sheet
TW201613011A (en) Method and apparatus for manufacturing semiconductor devices
WO2015095015A3 (en) Member peeling and processing for semiconductor chip
PH12017502122B1 (en) Tape for semiconductor processing
TW201613114A (en) Method and apparatus for structuring the topside and underside of a semiconductor substrate
SG10201807747VA (en) Wafer processing method
TW201535180A (zh) 觸控面板及其貼合方法