MY146678A - A fine processing method for a material of sintered diamond with a laser beam, a cutter wheel for a substrate made of a brittle material and its producing method thereof - Google Patents

A fine processing method for a material of sintered diamond with a laser beam, a cutter wheel for a substrate made of a brittle material and its producing method thereof

Info

Publication number
MY146678A
MY146678A MYPI20060451A MYPI20060451A MY146678A MY 146678 A MY146678 A MY 146678A MY PI20060451 A MYPI20060451 A MY PI20060451A MY PI20060451 A MYPI20060451 A MY PI20060451A MY 146678 A MY146678 A MY 146678A
Authority
MY
Malaysia
Prior art keywords
laser beam
processed
work piece
sintered diamond
substrate made
Prior art date
Application number
MYPI20060451A
Other languages
English (en)
Inventor
Mikio Kondo
Kazuhisa Kuriyama
Hiroshi Tomimori
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of MY146678A publication Critical patent/MY146678A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
MYPI20060451A 2005-02-02 2006-02-03 A fine processing method for a material of sintered diamond with a laser beam, a cutter wheel for a substrate made of a brittle material and its producing method thereof MY146678A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005026710 2005-02-02

Publications (1)

Publication Number Publication Date
MY146678A true MY146678A (en) 2012-09-14

Family

ID=36777281

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20060451A MY146678A (en) 2005-02-02 2006-02-03 A fine processing method for a material of sintered diamond with a laser beam, a cutter wheel for a substrate made of a brittle material and its producing method thereof

Country Status (8)

Country Link
US (1) US8324528B2 (ko)
EP (1) EP1844891A4 (ko)
JP (1) JP4709202B2 (ko)
KR (2) KR101031237B1 (ko)
CN (3) CN101115581B (ko)
MY (1) MY146678A (ko)
TW (1) TWI380868B (ko)
WO (1) WO2006082899A1 (ko)

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TWI451587B (zh) * 2010-01-08 2014-09-01 Mitsuboshi Diamond Ind Co Ltd 薄膜太陽電池用溝加工工具
JP2011142236A (ja) * 2010-01-08 2011-07-21 Mitsuboshi Diamond Industrial Co Ltd 薄膜太陽電池用の溝加工ツール及びその角度規制構造
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CN105149790B (zh) * 2015-07-10 2017-08-29 西安交通大学 毫米以及亚毫米量级环形金刚石刀具的深加工方法及系统
US9931714B2 (en) 2015-09-11 2018-04-03 Baker Hughes, A Ge Company, Llc Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams
JP6504196B2 (ja) * 2016-05-30 2019-04-24 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
JP2019009244A (ja) * 2017-06-23 2019-01-17 三星ダイヤモンド工業株式会社 多層基板の分断方法
CN107498179A (zh) * 2017-09-27 2017-12-22 杨沁玥 一种滤网焊接工艺
CN107414321A (zh) * 2017-09-27 2017-12-01 杨沁玥 一种齿槽激光切割工艺
CN107378247A (zh) * 2017-09-27 2017-11-24 杨沁玥 一种滤网激光叠焊工艺
JP7316999B2 (ja) * 2018-04-05 2023-07-28 ヌヴォトンテクノロジージャパン株式会社 試料分割方法、半導体素子の製造方法及び半導体素子
JP6578533B1 (ja) * 2018-06-13 2019-09-25 株式会社Ｎｓｃ 液晶パネル製造方法
KR101976441B1 (ko) * 2018-11-27 2019-08-28 주식회사 21세기 펨토초 레이저를 이용한 초정밀 블레이드 엣지 가공방법
RU2756175C1 (ru) * 2020-03-30 2021-09-28 Акционерное Общество "Государственный Научный Центр Российской Федерации Троицкий Институт Инновационных И Термоядерных Исследований" Роботизированный лазерный комплекс и способ демонтажа металлоконструкций аэс
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Also Published As

Publication number Publication date
CN101502912B (zh) 2012-06-27
KR101031235B1 (ko) 2011-04-29
EP1844891A1 (en) 2007-10-17
TWI380868B (zh) 2013-01-01
JP4709202B2 (ja) 2011-06-22
KR20090094392A (ko) 2009-09-04
JPWO2006082899A1 (ja) 2008-06-26
US20090039061A1 (en) 2009-02-12
KR101031237B1 (ko) 2011-04-29
EP1844891A4 (en) 2010-10-20
CN101115581B (zh) 2010-12-15
WO2006082899A1 (ja) 2006-08-10
CN101502912A (zh) 2009-08-12
KR20070097589A (ko) 2007-10-04
CN101733847B (zh) 2012-07-25
US8324528B2 (en) 2012-12-04
CN101733847A (zh) 2010-06-16
TW200640603A (en) 2006-12-01
CN101115581A (zh) 2008-01-30

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