MY143823A - Compositions and methods for cmp of low-k-dielectric materials - Google Patents

Compositions and methods for cmp of low-k-dielectric materials

Info

Publication number
MY143823A
MY143823A MYPI20091862A MYPI20091862A MY143823A MY 143823 A MY143823 A MY 143823A MY PI20091862 A MYPI20091862 A MY PI20091862A MY PI20091862 A MYPI20091862 A MY PI20091862A MY 143823 A MY143823 A MY 143823A
Authority
MY
Malaysia
Prior art keywords
low
cmp
dielectric materials
compositions
methods
Prior art date
Application number
MYPI20091862A
Other languages
English (en)
Inventor
Keleher Jason
Woodland Daniel
De Rege Thesauro Francis
Medsker Robert
Aggio Jason
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY143823A publication Critical patent/MY143823A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI20091862A 2006-11-09 2007-11-07 Compositions and methods for cmp of low-k-dielectric materials MY143823A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/595,536 US7456107B2 (en) 2006-11-09 2006-11-09 Compositions and methods for CMP of low-k-dielectric materials

Publications (1)

Publication Number Publication Date
MY143823A true MY143823A (en) 2011-07-15

Family

ID=39368345

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20091862A MY143823A (en) 2006-11-09 2007-11-07 Compositions and methods for cmp of low-k-dielectric materials

Country Status (8)

Country Link
US (1) US7456107B2 (https=)
EP (1) EP2092035B1 (https=)
JP (2) JP5468903B2 (https=)
KR (1) KR101194901B1 (https=)
CN (2) CN105219274B (https=)
MY (1) MY143823A (https=)
TW (1) TWI357439B (https=)
WO (1) WO2008060419A2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7208325B2 (en) * 2005-01-18 2007-04-24 Applied Materials, Inc. Refreshing wafers having low-k dielectric materials
CN100400722C (zh) * 2006-06-06 2008-07-09 河北工业大学 消除半导体硅晶片表面应力的方法
JP2008130988A (ja) * 2006-11-24 2008-06-05 Fujimi Inc 研磨用組成物及び研磨方法
US8247327B2 (en) * 2008-07-30 2012-08-21 Cabot Microelectronics Corporation Methods and compositions for polishing silicon-containing substrates
JP2010226089A (ja) * 2009-01-14 2010-10-07 Rohm & Haas Electronic Materials Llc 半導体ウェハをクリーニングする方法
KR101907860B1 (ko) * 2010-10-07 2018-10-15 바스프 에스이 수성 연마 조성물 및 패턴화 또는 비패턴화 저-ｋ 유전층을 갖는 기판의 화학적 기계적 연마 방법
CN102585706B (zh) * 2012-01-09 2013-11-20 清华大学 酸性化学机械抛光组合物
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8920667B2 (en) * 2013-01-30 2014-12-30 Cabot Microelectronics Corporation Chemical-mechanical polishing composition containing zirconia and metal oxidizer
US20150375361A1 (en) * 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
JPWO2016031485A1 (ja) * 2014-08-29 2017-06-22 株式会社フジミインコーポレーテッド 研磨用組成物および研磨用組成物の製造方法
CN108473850A (zh) * 2016-01-06 2018-08-31 嘉柏微电子材料股份公司 低k基板的抛光方法
CN108250972B (zh) * 2016-12-28 2021-09-21 安集微电子科技（上海）股份有限公司 一种用于阻挡层平坦化的化学机械抛光液
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
CN113122144A (zh) * 2019-12-31 2021-07-16 安集微电子（上海）有限公司 一种化学机械抛光液
CN113122143B (zh) * 2019-12-31 2024-03-08 安集微电子（上海）有限公司 一种化学机械抛光液及其在铜抛光中的应用

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1493240A (en) * 1923-02-15 1924-05-06 Frank J Bohn Surgical bone cutter and extractor
US4201213A (en) * 1978-01-30 1980-05-06 Codman & Shurtleff, Inc. Surgical tool
US4777948A (en) * 1984-01-16 1988-10-18 Wright David W Surgical tool
US4911600A (en) * 1984-01-20 1990-03-27 Perkins Manufacturing Company Lifting device
DE3581421D1 (de) * 1984-03-15 1991-02-28 Procter & Gamble Haarbehandlungsmittel mit konditionierenden eigenschaften.
US4708147A (en) * 1985-02-25 1987-11-24 Haaga John R Universal biopsy needle
US4733663A (en) * 1986-07-02 1988-03-29 Farley Daniel K Medical instrument for removing bone
US4834729A (en) * 1986-12-30 1989-05-30 Dyonics, Inc. Arthroscopic surgical instrument
US4850354A (en) * 1987-08-13 1989-07-25 Baxter Travenol Laboratories, Inc. Surgical cutting instrument
US4811734A (en) * 1987-08-13 1989-03-14 Baxter Travenol Laboratories, Inc. Surgical cutting instrument
US5653713A (en) * 1989-04-24 1997-08-05 Michelson; Gary Karlin Surgical rongeur
US5451227A (en) * 1989-04-24 1995-09-19 Michaelson; Gary K. Thin foot plate multi bite rongeur
US5226910A (en) * 1989-07-05 1993-07-13 Kabushiki Kaisha Topcon Surgical cutter
US5026375A (en) * 1989-10-25 1991-06-25 Origin Medsystems, Inc. Surgical cutting instrument
US5017222A (en) 1989-12-07 1991-05-21 Dow Corning Corporation Polish containing micronized wax particles
JPH06114070A (ja) * 1990-06-22 1994-04-26 Vance Prod Inc 外科用組織切除装置
US5957882A (en) * 1991-01-11 1999-09-28 Advanced Cardiovascular Systems, Inc. Ultrasound devices for ablating and removing obstructive matter from anatomical passageways and blood vessels
US5387215A (en) * 1992-02-12 1995-02-07 Sierra Surgical Inc. Surgical instrument for cutting hard tissue and method of use
US5613972A (en) * 1992-07-15 1997-03-25 The University Of Miami Surgical cutting heads with curled cutting wings
US5385570A (en) * 1993-01-12 1995-01-31 R. J. Surgical Instruments, Inc. Surgical cutting instrument
US6716216B1 (en) * 1998-08-14 2004-04-06 Kyphon Inc. Systems and methods for treating vertebral bodies
US5526822A (en) * 1994-03-24 1996-06-18 Biopsys Medical, Inc. Method and apparatus for automated biopsy and collection of soft tissue
JPH0813167A (ja) * 1994-06-29 1996-01-16 Yushiro Chem Ind Co Ltd 水溶性研削油剤
US5458112A (en) * 1994-08-15 1995-10-17 Arrow Precision Products, Inc. Biliary biopsy device
AU701424B2 (en) * 1994-10-24 1999-01-28 Smith & Nephew, Inc. Hollow surgical cutter with apertured flutes
US5562102A (en) * 1994-11-21 1996-10-08 Taylor; Thomas V. Multiple biopsy device
US5601561A (en) * 1995-01-17 1997-02-11 W. L. Gore & Associates, Inc. Guided bone rasp
US5873886A (en) * 1995-04-04 1999-02-23 United States Surgical Corporation Surgical cutting apparatus
US5879365A (en) * 1995-04-04 1999-03-09 United States Surgical Corporation Surgical cutting apparatus
US5681337A (en) * 1995-06-07 1997-10-28 Bray Jr.; Robert S. Bone shaver
US5827305A (en) * 1996-01-24 1998-10-27 Gordon; Mark G. Tissue sampling device
KR100336598B1 (ko) * 1996-02-07 2002-05-16 이사오 우치가사키 산화 세륨 연마제 제조용 산화 세륨 입자
WO1997038635A1 (en) * 1996-04-12 1997-10-23 Surgical Dynamics, Inc. Surgical cutting device removably connected to a rotary drive element
US6096053A (en) * 1996-05-03 2000-08-01 Scimed Life Systems, Inc. Medical retrieval basket
US6258111B1 (en) * 1997-10-03 2001-07-10 Scieran Technologies, Inc. Apparatus and method for performing ophthalmic procedures
US6852095B1 (en) * 1997-07-09 2005-02-08 Charles D. Ray Interbody device and method for treatment of osteoporotic vertebral collapse
US5925050A (en) * 1997-08-15 1999-07-20 The University Of Iowa Research Foundation Self-clearing bone biting instrument
US5980525A (en) * 1997-10-27 1999-11-09 Bristol-Myers Squibb Company Bone reamer with impeller
DE19802145C1 (de) * 1998-01-22 1999-09-30 Storz Karl Gmbh & Co Medizinisches Schiebeschaftinstrument
JP2002502626A (ja) * 1998-02-10 2002-01-29 アーテミス・メディカル・インコーポレイテッド 補足装置およびその使用方法
US5968238A (en) 1998-02-18 1999-10-19 Turtle Wax, Inc. Polishing composition including water soluble polishing agent
US6428498B2 (en) * 1998-04-14 2002-08-06 Renan Uflacker Suction catheter for rapidly debriding abscesses
US6296639B1 (en) * 1999-02-12 2001-10-02 Novacept Apparatuses and methods for interstitial tissue removal
US6022362A (en) * 1998-09-03 2000-02-08 Rubicor Medical, Inc. Excisional biopsy devices and methods
JP2000114212A (ja) * 1998-10-05 2000-04-21 Asahi Denka Kogyo Kk シリコンウェハー用研磨助剤
US6083237A (en) * 1998-10-23 2000-07-04 Ethico Endo-Surgery, Inc. Biopsy instrument with tissue penetrating spiral
US6541381B2 (en) * 1998-11-06 2003-04-01 Beaver Creek Concepts Inc Finishing method for semiconductor wafers using a lubricating boundary layer
EP1253862A4 (en) * 1999-02-01 2003-09-17 Garland U Edwards SURGICAL REAMER CUTTER
US7189206B2 (en) * 2003-02-24 2007-03-13 Senorx, Inc. Biopsy device with inner cutter
DE60018712T2 (de) * 1999-02-03 2006-03-16 Synthes Ag Chur, Chur Chirurgischer bohrer
US6264087B1 (en) * 1999-07-12 2001-07-24 Powermed, Inc. Expanding parallel jaw device for use with an electromechanical driver device
US6692445B2 (en) * 1999-07-27 2004-02-17 Scimed Life Systems, Inc. Biopsy sampler
US6638233B2 (en) * 1999-08-19 2003-10-28 Fox Hollow Technologies, Inc. Apparatus and methods for material capture and removal
US6248081B1 (en) * 1999-09-28 2001-06-19 Scimed Life Systems, Inc. Endoscopic submucosal core biopsy device
US6287304B1 (en) * 1999-10-15 2001-09-11 Neothermia Corporation Interstitial cauterization of tissue volumes with electrosurgically deployed electrodes
DK176336B1 (da) * 1999-12-22 2007-08-20 Asahi Optical Co Ltd Endoskopisk vævsindsamlingsinstrument
US6746093B2 (en) * 2001-06-08 2004-06-08 Raul Martinez Methods and apparatus for image transfer to non-planar surfaces
US20030162399A1 (en) * 2002-02-22 2003-08-28 University Of Florida Method, composition and apparatus for tunable selectivity during chemical mechanical polishing of metallic structures
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
US6936543B2 (en) * 2002-06-07 2005-08-30 Cabot Microelectronics Corporation CMP method utilizing amphiphilic nonionic surfactants
JP2004051756A (ja) * 2002-07-19 2004-02-19 Sanyo Chem Ind Ltd Ｃｍｐプロセス用研磨組成物
US20040092102A1 (en) * 2002-11-12 2004-05-13 Sachem, Inc. Chemical mechanical polishing composition and method
JP2004247605A (ja) * 2003-02-14 2004-09-02 Toshiba Corp Ｃｍｐ用スラリーおよび半導体装置の製造方法
US7473267B2 (en) * 2003-04-25 2009-01-06 Warsaw Orthopedic, Inc. System and method for minimally invasive posterior fixation
TW200427827A (en) * 2003-05-30 2004-12-16 Sumitomo Chemical Co Metal polishing composition
US20050080441A1 (en) * 2003-10-10 2005-04-14 Duke University Surgical instruments which are especially useful for ophthalmic surgical procedures, and methods of making the same
EP1691848B1 (en) * 2003-10-23 2012-08-22 TRANS1, Inc. Tools and tool kits for performing minimally invasive procedures on the spine
US6972277B2 (en) 2004-02-19 2005-12-06 Goldschmidt Gbmh Foaming clean and polish emulsions comprising bisquaternary organomodified silicone
US20050228403A1 (en) * 2004-03-31 2005-10-13 Manoa Medical, Inc., A Delaware Corporation Tissue cutting devices and methods
CA2506961C (en) * 2004-05-11 2013-05-07 Inrad, Inc. Core biopsy device
EP1768573A2 (en) * 2004-06-16 2007-04-04 Medtronic, Inc. Minimally invasive coring vein harvester
US7896879B2 (en) * 2004-07-29 2011-03-01 Vertos Medical, Inc. Spinal ligament modification
JP4012180B2 (ja) * 2004-08-06 2007-11-21 株式会社東芝 Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
US8048080B2 (en) * 2004-10-15 2011-11-01 Baxano, Inc. Flexible tissue rasp
US20060122535A1 (en) * 2004-12-08 2006-06-08 Wolfgang Daum Method and device to obtain percutaneous tissue samples
US8109945B2 (en) * 2005-02-04 2012-02-07 St. Jude Medical Puerto Rico Llc Percutaneous suture path tracking device with cutting blade
JP4542927B2 (ja) * 2005-03-17 2010-09-15 富士フイルム株式会社 膜形成用組成物、該組成物から得られた絶縁膜およびそれを有する電子デバイス
US8696671B2 (en) * 2005-07-29 2014-04-15 Vertos Medical Inc. Percutaneous tissue excision devices
WO2007016684A2 (en) * 2005-07-29 2007-02-08 X-Sten, Corp. Tools for percutaneous spinal ligament decompression and device for supporting same
US8062298B2 (en) * 2005-10-15 2011-11-22 Baxano, Inc. Flexible tissue removal devices and methods
US20070162061A1 (en) * 2005-11-04 2007-07-12 X-Sten, Corp. Tissue excision devices and methods
US7942830B2 (en) * 2006-05-09 2011-05-17 Vertos Medical, Inc. Ipsilateral approach to minimally invasive ligament decompression procedure

Also Published As

Publication number Publication date
TWI357439B (en) 2012-02-01
CN101541911A (zh) 2009-09-23
WO2008060419A2 (en) 2008-05-22
US20080111101A1 (en) 2008-05-15
US7456107B2 (en) 2008-11-25
JP2010509773A (ja) 2010-03-25
CN105219274B (zh) 2020-04-14
JP2014027297A (ja) 2014-02-06
JP5937558B2 (ja) 2016-06-22
KR101194901B1 (ko) 2012-10-25
EP2092035A4 (en) 2010-09-08
JP5468903B2 (ja) 2014-04-09
EP2092035A2 (en) 2009-08-26
WO2008060419A3 (en) 2008-07-03
EP2092035B1 (en) 2019-05-08
TW200840860A (en) 2008-10-16
CN105219274A (zh) 2016-01-06
KR20090078346A (ko) 2009-07-17

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