KR101194901B1 - 낮은-ｋ 유전 물질의 ＣＭＰ용 조성물 및 방법 - Google Patents

낮은-ｋ 유전 물질의 ＣＭＰ용 조성물 및 방법 Download PDF

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Publication number
KR101194901B1
KR101194901B1 KR1020097009510A KR20097009510A KR101194901B1 KR 101194901 B1 KR101194901 B1 KR 101194901B1 KR 1020097009510 A KR1020097009510 A KR 1020097009510A KR 20097009510 A KR20097009510 A KR 20097009510A KR 101194901 B1 KR101194901 B1 KR 101194901B1
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South Korea
Prior art keywords
silicone
nonionic surfactant
composition
cmp
cmp composition
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KR1020097009510A
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Korean (ko)
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KR20090078346A (ko
Inventor
제이슨 켈레허
다니엘 우드랜드
프랑세 드 레게 테사우로
로버트 메드스컬
제이슨 아지오
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
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Publication of KR20090078346A publication Critical patent/KR20090078346A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020097009510A 2006-11-09 2007-11-07 낮은-ｋ 유전 물질의 ＣＭＰ용 조성물 및 방법 Active KR101194901B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/595,536 US7456107B2 (en) 2006-11-09 2006-11-09 Compositions and methods for CMP of low-k-dielectric materials
US11/595,536 2006-11-09
PCT/US2007/023479 WO2008060419A2 (en) 2006-11-09 2007-11-07 Compositions and methods for cmp of low-k dielectric materials

Publications (2)

Publication Number Publication Date
KR20090078346A KR20090078346A (ko) 2009-07-17
KR101194901B1 true KR101194901B1 (ko) 2012-10-25

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ID=39368345

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Application Number Title Priority Date Filing Date
KR1020097009510A Active KR101194901B1 (ko) 2006-11-09 2007-11-07 낮은-ｋ 유전 물질의 ＣＭＰ용 조성물 및 방법

Country Status (8)

Country Link
US (1) US7456107B2 (https=)
EP (1) EP2092035B1 (https=)
JP (2) JP5468903B2 (https=)
KR (1) KR101194901B1 (https=)
CN (2) CN105219274B (https=)
MY (1) MY143823A (https=)
TW (1) TWI357439B (https=)
WO (1) WO2008060419A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180091936A (ko) * 2016-01-06 2018-08-16 캐보트 마이크로일렉트로닉스 코포레이션 저-k 기재의 연마 방법

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JP2008130988A (ja) * 2006-11-24 2008-06-05 Fujimi Inc 研磨用組成物及び研磨方法
US8247327B2 (en) * 2008-07-30 2012-08-21 Cabot Microelectronics Corporation Methods and compositions for polishing silicon-containing substrates
JP2010226089A (ja) * 2009-01-14 2010-10-07 Rohm & Haas Electronic Materials Llc 半導体ウェハをクリーニングする方法
KR101907860B1 (ko) * 2010-10-07 2018-10-15 바스프 에스이 수성 연마 조성물 및 패턴화 또는 비패턴화 저-ｋ 유전층을 갖는 기판의 화학적 기계적 연마 방법
CN102585706B (zh) * 2012-01-09 2013-11-20 清华大学 酸性化学机械抛光组合物
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US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8920667B2 (en) * 2013-01-30 2014-12-30 Cabot Microelectronics Corporation Chemical-mechanical polishing composition containing zirconia and metal oxidizer
US20150375361A1 (en) * 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
JPWO2016031485A1 (ja) * 2014-08-29 2017-06-22 株式会社フジミインコーポレーテッド 研磨用組成物および研磨用組成物の製造方法
CN108250972B (zh) * 2016-12-28 2021-09-21 安集微电子科技（上海）股份有限公司 一种用于阻挡层平坦化的化学机械抛光液
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
CN113122144A (zh) * 2019-12-31 2021-07-16 安集微电子（上海）有限公司 一种化学机械抛光液
CN113122143B (zh) * 2019-12-31 2024-03-08 安集微电子（上海）有限公司 一种化学机械抛光液及其在铜抛光中的应用

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Cited By (2)

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KR20180091936A (ko) * 2016-01-06 2018-08-16 캐보트 마이크로일렉트로닉스 코포레이션 저-k 기재의 연마 방법
KR102778918B1 (ko) * 2016-01-06 2025-03-07 씨엠씨 머티리얼즈 엘엘씨 저-k 기재의 연마 방법

Also Published As

Publication number Publication date
TWI357439B (en) 2012-02-01
CN101541911A (zh) 2009-09-23
WO2008060419A2 (en) 2008-05-22
US20080111101A1 (en) 2008-05-15
US7456107B2 (en) 2008-11-25
JP2010509773A (ja) 2010-03-25
MY143823A (en) 2011-07-15
CN105219274B (zh) 2020-04-14
JP2014027297A (ja) 2014-02-06
JP5937558B2 (ja) 2016-06-22
EP2092035A4 (en) 2010-09-08
JP5468903B2 (ja) 2014-04-09
EP2092035A2 (en) 2009-08-26
WO2008060419A3 (en) 2008-07-03
EP2092035B1 (en) 2019-05-08
TW200840860A (en) 2008-10-16
CN105219274A (zh) 2016-01-06
KR20090078346A (ko) 2009-07-17

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