CN105219274B - 用于低介电常数的介电材料的化学机械抛光的组合物及方法 - Google Patents

用于低介电常数的介电材料的化学机械抛光的组合物及方法 Download PDF

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Publication number
CN105219274B
CN105219274B CN201510631776.8A CN201510631776A CN105219274B CN 105219274 B CN105219274 B CN 105219274B CN 201510631776 A CN201510631776 A CN 201510631776A CN 105219274 B CN105219274 B CN 105219274B
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China
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silicone
nonionic surfactant
group
composition
polishing
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Chinese (zh)
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CN105219274A (zh
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贾森·凯莱赫
丹尼尔·伍德兰德
弗朗西斯·德雷格塞索罗
罗伯特·梅兹克
贾森·阿吉奥
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CMC Materials LLC
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Cabot Microelectronics Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201510631776.8A 2006-11-09 2007-11-07 用于低介电常数的介电材料的化学机械抛光的组合物及方法 Active CN105219274B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/595,536 US7456107B2 (en) 2006-11-09 2006-11-09 Compositions and methods for CMP of low-k-dielectric materials
US11/595,536 2006-11-09
CNA2007800418877A CN101541911A (zh) 2006-11-09 2007-11-07 用于低介电常数的介电材料的化学机械抛光的组合物及方法

Related Parent Applications (1)

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CNA2007800418877A Division CN101541911A (zh) 2006-11-09 2007-11-07 用于低介电常数的介电材料的化学机械抛光的组合物及方法

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CN105219274A CN105219274A (zh) 2016-01-06
CN105219274B true CN105219274B (zh) 2020-04-14

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CN201510631776.8A Active CN105219274B (zh) 2006-11-09 2007-11-07 用于低介电常数的介电材料的化学机械抛光的组合物及方法
CNA2007800418877A Pending CN101541911A (zh) 2006-11-09 2007-11-07 用于低介电常数的介电材料的化学机械抛光的组合物及方法

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Country Status (8)

Country Link
US (1) US7456107B2 (https=)
EP (1) EP2092035B1 (https=)
JP (2) JP5468903B2 (https=)
KR (1) KR101194901B1 (https=)
CN (2) CN105219274B (https=)
MY (1) MY143823A (https=)
TW (1) TWI357439B (https=)
WO (1) WO2008060419A2 (https=)

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JP2010226089A (ja) * 2009-01-14 2010-10-07 Rohm & Haas Electronic Materials Llc 半導体ウェハをクリーニングする方法
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US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
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US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
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US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8920667B2 (en) * 2013-01-30 2014-12-30 Cabot Microelectronics Corporation Chemical-mechanical polishing composition containing zirconia and metal oxidizer
US20150375361A1 (en) * 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
JPWO2016031485A1 (ja) * 2014-08-29 2017-06-22 株式会社フジミインコーポレーテッド 研磨用組成物および研磨用組成物の製造方法
CN108473850A (zh) * 2016-01-06 2018-08-31 嘉柏微电子材料股份公司 低k基板的抛光方法
CN108250972B (zh) * 2016-12-28 2021-09-21 安集微电子科技（上海）股份有限公司 一种用于阻挡层平坦化的化学机械抛光液
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
CN113122144A (zh) * 2019-12-31 2021-07-16 安集微电子（上海）有限公司 一种化学机械抛光液
CN113122143B (zh) * 2019-12-31 2024-03-08 安集微电子（上海）有限公司 一种化学机械抛光液及其在铜抛光中的应用

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Also Published As

Publication number Publication date
TWI357439B (en) 2012-02-01
CN101541911A (zh) 2009-09-23
WO2008060419A2 (en) 2008-05-22
US20080111101A1 (en) 2008-05-15
US7456107B2 (en) 2008-11-25
JP2010509773A (ja) 2010-03-25
MY143823A (en) 2011-07-15
JP2014027297A (ja) 2014-02-06
JP5937558B2 (ja) 2016-06-22
KR101194901B1 (ko) 2012-10-25
EP2092035A4 (en) 2010-09-08
JP5468903B2 (ja) 2014-04-09
EP2092035A2 (en) 2009-08-26
WO2008060419A3 (en) 2008-07-03
EP2092035B1 (en) 2019-05-08
TW200840860A (en) 2008-10-16
CN105219274A (zh) 2016-01-06
KR20090078346A (ko) 2009-07-17

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