JP5468903B2 - Ｌｏｗ−ｋ誘電体材料のｃｍｐ用組成物及び方法 - Google Patents

Ｌｏｗ−ｋ誘電体材料のｃｍｐ用組成物及び方法 Download PDF

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Publication number
JP5468903B2
JP5468903B2 JP2009536289A JP2009536289A JP5468903B2 JP 5468903 B2 JP5468903 B2 JP 5468903B2 JP 2009536289 A JP2009536289 A JP 2009536289A JP 2009536289 A JP2009536289 A JP 2009536289A JP 5468903 B2 JP5468903 B2 JP 5468903B2
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Prior art keywords
silicone
composition
cmp composition
cmp
nonionic surfactant
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JP2009536289A
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Japanese (ja)
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JP2010509773A (ja
Inventor
ケレハー，ジェイソン
ウッドランド，ダニエル
リージ ザサウロ，フランシス デ
メズカー，ロバート
アッジョ，ジェイソン
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CMC Materials LLC
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Cabot Microelectronics Corp
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Publication of JP2010509773A publication Critical patent/JP2010509773A/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2009536289A 2006-11-09 2007-11-07 Ｌｏｗ−ｋ誘電体材料のｃｍｐ用組成物及び方法 Active JP5468903B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/595,536 US7456107B2 (en) 2006-11-09 2006-11-09 Compositions and methods for CMP of low-k-dielectric materials
US11/595,536 2006-11-09
PCT/US2007/023479 WO2008060419A2 (en) 2006-11-09 2007-11-07 Compositions and methods for cmp of low-k dielectric materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013208956A Division JP5937558B2 (ja) 2006-11-09 2013-10-04 Ｌｏｗ−ｋ誘電体材料のｃｍｐ用組成物及び方法

Publications (2)

Publication Number Publication Date
JP2010509773A JP2010509773A (ja) 2010-03-25
JP5468903B2 true JP5468903B2 (ja) 2014-04-09

Family

ID=39368345

Family Applications (2)

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JP2009536289A Active JP5468903B2 (ja) 2006-11-09 2007-11-07 Ｌｏｗ−ｋ誘電体材料のｃｍｐ用組成物及び方法
JP2013208956A Active JP5937558B2 (ja) 2006-11-09 2013-10-04 Ｌｏｗ−ｋ誘電体材料のｃｍｐ用組成物及び方法

Family Applications After (1)

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JP2013208956A Active JP5937558B2 (ja) 2006-11-09 2013-10-04 Ｌｏｗ−ｋ誘電体材料のｃｍｐ用組成物及び方法

Country Status (8)

Country Link
US (1) US7456107B2 (https=)
EP (1) EP2092035B1 (https=)
JP (2) JP5468903B2 (https=)
KR (1) KR101194901B1 (https=)
CN (2) CN105219274B (https=)
MY (1) MY143823A (https=)
TW (1) TWI357439B (https=)
WO (1) WO2008060419A2 (https=)

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CN108473850A (zh) * 2016-01-06 2018-08-31 嘉柏微电子材料股份公司 低k基板的抛光方法
CN108250972B (zh) * 2016-12-28 2021-09-21 安集微电子科技（上海）股份有限公司 一种用于阻挡层平坦化的化学机械抛光液
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CN113122143B (zh) * 2019-12-31 2024-03-08 安集微电子（上海）有限公司 一种化学机械抛光液及其在铜抛光中的应用

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Also Published As

Publication number Publication date
TWI357439B (en) 2012-02-01
CN101541911A (zh) 2009-09-23
WO2008060419A2 (en) 2008-05-22
US20080111101A1 (en) 2008-05-15
US7456107B2 (en) 2008-11-25
JP2010509773A (ja) 2010-03-25
MY143823A (en) 2011-07-15
CN105219274B (zh) 2020-04-14
JP2014027297A (ja) 2014-02-06
JP5937558B2 (ja) 2016-06-22
KR101194901B1 (ko) 2012-10-25
EP2092035A4 (en) 2010-09-08
EP2092035A2 (en) 2009-08-26
WO2008060419A3 (en) 2008-07-03
EP2092035B1 (en) 2019-05-08
TW200840860A (en) 2008-10-16
CN105219274A (zh) 2016-01-06
KR20090078346A (ko) 2009-07-17

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