JP5937558B2 - Low−k誘電体材料のcmp用組成物及び方法 - Google Patents
Low−k誘電体材料のcmp用組成物及び方法 Download PDFInfo
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- JP5937558B2 JP5937558B2 JP2013208956A JP2013208956A JP5937558B2 JP 5937558 B2 JP5937558 B2 JP 5937558B2 JP 2013208956 A JP2013208956 A JP 2013208956A JP 2013208956 A JP2013208956 A JP 2013208956A JP 5937558 B2 JP5937558 B2 JP 5937558B2
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
この例は、卓上研磨機を利用して、カーボンをドープしたシリコーン酸化物の表面を研磨するための、本発明のCMP組成物と、シリコーン含有界面活性剤を含まない対照の組成物を比較する。
この例は、卓上研磨機を利用して、カーボンをドープしたシリコーン酸化物の表面を研磨するための、本発明のCMP組成物とシリコーン含有界面活性剤を含まない対照の組成物を比較する。
Claims (19)
- low−k誘電体材料を研磨するための化学機械研磨(CMP)組成物であって、
(a)微粒子の砥材;
(b)親水性部分及び親油性部分を含む少なくとも1種のシリコーンフリー非イオン性界面活性剤;
(c)親水性部分及び親油性部分を含む少なくとも1種のシリコーン含有非イオン性界面活性剤であって、該親水性部分がポリオールを含む、界面活性剤;及び
(d)それらのための水性キャリア、
を含み、
該少なくとも1種のシリコーンフリー非イオン性界面活性剤と該少なくとも1種のシリコーン含有非イオン性界面活性剤とが、シリコーン含有界面活性剤に対するシリコーンフリー界面活性剤の濃度比が1以上でそれぞれ該組成物中に存在する、
化学機械研磨組成物。 - 該微粒子の砥材が、該組成物中に0.5〜20質量パーセントの範囲の量で存在する、請求項1に記載のCMP組成物。
- 該微粒子の砥材がシリカを含む、請求項1に記載のCMP組成物。
- 該少なくとも1種のシリコーンフリー非イオン性界面活性剤と該少なくとも1種のシリコーン含有非イオン性界面活性剤とが両方とも、25〜10,000ppmの範囲の濃度で該組成物中に存在する、請求項1に記載のCMP組成物。
- 該少なくとも1種のシリコーンフリー非イオン性界面活性剤の該親水性部分がポリオールを含み、該少なくとも1種のシリコーン含有非イオン性界面活性剤の該親水性部分がC 2 〜C 3 のポリオキシアルキレン基を含む、請求項1に記載のCMP組成物。
- 該ポリオールが、ポリグリセリン、炭水化物、及びそれらの組み合わせからなる群から選択される、請求項5に記載のCMP組成物。
- 該少なくとも1種のシリコーンフリー非イオン性界面活性剤の該親水性部分がC2〜C3のポリオキシアルキレン基を含む、請求項1に記載のCMP組成物。
- 該C2〜C3のポリオキシアルキレン基がポリオキシエチレン基である、請求項7に記載のCMP組成物。
- 該少なくとも1種のシリコーンフリー非イオン性界面活性剤の該親油性部分がC6〜C30の炭化水素部分を含む、請求項1に記載のCMP組成物。
- 該C6〜C30の炭化水素部分が、アルキル基、アルキル置換アリール基、アリール置換アルキル基、及びアリール基からなる群から選択される少なくとも1種の炭化水素部分を含む、請求項9に記載のCMP組成物。
- 該ポリオールが、ポリグリセリン、炭水化物、及びそれらの組み合わせからなる群から選択される、請求項1に記載のCMP組成物。
- 該少なくとも1種のシリコーン含有非イオン性界面活性剤の該親水性部分がC2〜C3のポリオキシアルキレン基を含む、請求項1に記載のCMP組成物。
- 該C2〜C3のポリオキシアルキレン基がポリオキシエチレン基である、請求項12に記載のCMP組成物。
- 該少なくとも1種のシリコーン含有非イオン性界面活性剤の該親油性部分がシリコーン基を含む、請求項1に記載のCMP組成物。
- シリコーン基がポリジメチルシロキサン基を含む、請求項14に記載のCMP組成物。
- 少なくとも1種の酸化剤をさらに含む、請求項1に記載のCMP組成物。
- 該少なくとも1種のシリコーンフリー非イオン性界面活性剤がノニルフェノールエトキシレートを含む、請求項1に記載のCMP組成物。
- 該少なくとも1種のシリコーン含有非イオン性界面活性剤がジメチコーンコポリオールを含む、請求項1に記載のCMP組成物。
- low−k誘電体基板を研磨するための化学機械研磨(CMP)方法であって、
(a)low−k誘電体材料を含む基板の表面を、研磨パッド及び水性CMP組成物に接触させること、
その際、該CMP組成物は、微粒子の砥材、親水性部分及び親油性部分を含む少なくとも1種のシリコーンフリー非イオン性界面活性剤、親水性部分及び親油性部分を含む少なくとも1種のシリコーン含有非イオン性界面活性剤であって、該親水性部分がポリオールを含む、界面活性剤、及びそれらのための水性キャリアを含み、該少なくとも1種のシリコーンフリー非イオン性界面活性剤と該少なくとも1種のシリコーン含有非イオン性界面活性剤とが、シリコーン含有界面活性剤に対するシリコーンフリー界面活性剤の濃度比が1以上でそれぞれ該組成物中に存在する;及び
(b)該基板の該表面の少なくとも一部を磨り減らすために十分な時間、該パッドと該基板との間の該表面に該CMP組成物の一部を接触させて保持しながら、該研磨パッド及び該基板の間に相対的な動作を起こすこと、
のステップを含む化学機械研磨方法。
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US11/595,536 US7456107B2 (en) | 2006-11-09 | 2006-11-09 | Compositions and methods for CMP of low-k-dielectric materials |
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Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7208325B2 (en) * | 2005-01-18 | 2007-04-24 | Applied Materials, Inc. | Refreshing wafers having low-k dielectric materials |
CN100400722C (zh) * | 2006-06-06 | 2008-07-09 | 河北工业大学 | 消除半导体硅晶片表面应力的方法 |
JP2008130988A (ja) * | 2006-11-24 | 2008-06-05 | Fujimi Inc | 研磨用組成物及び研磨方法 |
US8247327B2 (en) * | 2008-07-30 | 2012-08-21 | Cabot Microelectronics Corporation | Methods and compositions for polishing silicon-containing substrates |
JP2010226089A (ja) * | 2009-01-14 | 2010-10-07 | Rohm & Haas Electronic Materials Llc | 半導体ウェハをクリーニングする方法 |
SG189327A1 (en) * | 2010-10-07 | 2013-05-31 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers |
CN102585706B (zh) * | 2012-01-09 | 2013-11-20 | 清华大学 | 酸性化学机械抛光组合物 |
US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
US8920667B2 (en) * | 2013-01-30 | 2014-12-30 | Cabot Microelectronics Corporation | Chemical-mechanical polishing composition containing zirconia and metal oxidizer |
US20150375361A1 (en) * | 2014-06-25 | 2015-12-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
US20170243752A1 (en) * | 2014-08-29 | 2017-08-24 | Fujimi Incorporated | Polishing composition and method for producing polishing composition |
TWI625372B (zh) * | 2016-01-06 | 2018-06-01 | 卡博特微電子公司 | 低介電基板之研磨方法 |
CN108250972B (zh) * | 2016-12-28 | 2021-09-21 | 安集微电子科技(上海)股份有限公司 | 一种用于阻挡层平坦化的化学机械抛光液 |
US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
CN113122143B (zh) * | 2019-12-31 | 2024-03-08 | 安集微电子(上海)有限公司 | 一种化学机械抛光液及其在铜抛光中的应用 |
CN113122144A (zh) * | 2019-12-31 | 2021-07-16 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
Family Cites Families (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1493240A (en) * | 1923-02-15 | 1924-05-06 | Frank J Bohn | Surgical bone cutter and extractor |
US4201213A (en) * | 1978-01-30 | 1980-05-06 | Codman & Shurtleff, Inc. | Surgical tool |
US4777948A (en) * | 1984-01-16 | 1988-10-18 | Wright David W | Surgical tool |
US4911600A (en) * | 1984-01-20 | 1990-03-27 | Perkins Manufacturing Company | Lifting device |
GR850600B (ja) * | 1984-03-15 | 1985-07-02 | Procter & Gamble | |
US4708147A (en) * | 1985-02-25 | 1987-11-24 | Haaga John R | Universal biopsy needle |
US4733663A (en) * | 1986-07-02 | 1988-03-29 | Farley Daniel K | Medical instrument for removing bone |
US4834729A (en) * | 1986-12-30 | 1989-05-30 | Dyonics, Inc. | Arthroscopic surgical instrument |
US4850354A (en) * | 1987-08-13 | 1989-07-25 | Baxter Travenol Laboratories, Inc. | Surgical cutting instrument |
US4811734A (en) * | 1987-08-13 | 1989-03-14 | Baxter Travenol Laboratories, Inc. | Surgical cutting instrument |
US5653713A (en) * | 1989-04-24 | 1997-08-05 | Michelson; Gary Karlin | Surgical rongeur |
US5451227A (en) * | 1989-04-24 | 1995-09-19 | Michaelson; Gary K. | Thin foot plate multi bite rongeur |
US5226910A (en) * | 1989-07-05 | 1993-07-13 | Kabushiki Kaisha Topcon | Surgical cutter |
US5026375A (en) * | 1989-10-25 | 1991-06-25 | Origin Medsystems, Inc. | Surgical cutting instrument |
US5017222A (en) * | 1989-12-07 | 1991-05-21 | Dow Corning Corporation | Polish containing micronized wax particles |
JPH06114070A (ja) * | 1990-06-22 | 1994-04-26 | Vance Prod Inc | 外科用組織切除装置 |
US5957882A (en) * | 1991-01-11 | 1999-09-28 | Advanced Cardiovascular Systems, Inc. | Ultrasound devices for ablating and removing obstructive matter from anatomical passageways and blood vessels |
US5387215A (en) * | 1992-02-12 | 1995-02-07 | Sierra Surgical Inc. | Surgical instrument for cutting hard tissue and method of use |
US5613972A (en) * | 1992-07-15 | 1997-03-25 | The University Of Miami | Surgical cutting heads with curled cutting wings |
US5385570A (en) * | 1993-01-12 | 1995-01-31 | R. J. Surgical Instruments, Inc. | Surgical cutting instrument |
US6716216B1 (en) * | 1998-08-14 | 2004-04-06 | Kyphon Inc. | Systems and methods for treating vertebral bodies |
US5526822A (en) * | 1994-03-24 | 1996-06-18 | Biopsys Medical, Inc. | Method and apparatus for automated biopsy and collection of soft tissue |
JPH0813167A (ja) * | 1994-06-29 | 1996-01-16 | Yushiro Chem Ind Co Ltd | 水溶性研削油剤 |
US5458112A (en) * | 1994-08-15 | 1995-10-17 | Arrow Precision Products, Inc. | Biliary biopsy device |
CA2203568A1 (en) * | 1994-10-24 | 1996-05-02 | Smith & Nephew Endoscopy, Inc. | Hollow surgical cutter with apertured flutes |
US5562102A (en) * | 1994-11-21 | 1996-10-08 | Taylor; Thomas V. | Multiple biopsy device |
US5601561A (en) * | 1995-01-17 | 1997-02-11 | W. L. Gore & Associates, Inc. | Guided bone rasp |
US5879365A (en) * | 1995-04-04 | 1999-03-09 | United States Surgical Corporation | Surgical cutting apparatus |
US5873886A (en) * | 1995-04-04 | 1999-02-23 | United States Surgical Corporation | Surgical cutting apparatus |
US5681337A (en) * | 1995-06-07 | 1997-10-28 | Bray Jr.; Robert S. | Bone shaver |
US5827305A (en) * | 1996-01-24 | 1998-10-27 | Gordon; Mark G. | Tissue sampling device |
AU1670597A (en) * | 1996-02-07 | 1997-08-28 | Hitachi Chemical Company, Ltd. | Cerium oxide abrasive, semiconductor chip, semiconductor device, process for the production of them, and method for the polishing of substrates |
AU1078997A (en) * | 1996-04-12 | 1997-11-07 | Surgical Dynamics, Inc. | Surgical cutting device removably connected to a rotary drive element |
US6096053A (en) * | 1996-05-03 | 2000-08-01 | Scimed Life Systems, Inc. | Medical retrieval basket |
US6258111B1 (en) * | 1997-10-03 | 2001-07-10 | Scieran Technologies, Inc. | Apparatus and method for performing ophthalmic procedures |
US6852095B1 (en) * | 1997-07-09 | 2005-02-08 | Charles D. Ray | Interbody device and method for treatment of osteoporotic vertebral collapse |
US5925050A (en) * | 1997-08-15 | 1999-07-20 | The University Of Iowa Research Foundation | Self-clearing bone biting instrument |
US5980525A (en) * | 1997-10-27 | 1999-11-09 | Bristol-Myers Squibb Company | Bone reamer with impeller |
DE19802145C1 (de) * | 1998-01-22 | 1999-09-30 | Storz Karl Gmbh & Co | Medizinisches Schiebeschaftinstrument |
WO1999039648A1 (en) * | 1998-02-10 | 1999-08-12 | Dubrul William R | Entrapping apparatus and method for use |
US5968238A (en) * | 1998-02-18 | 1999-10-19 | Turtle Wax, Inc. | Polishing composition including water soluble polishing agent |
US6428498B2 (en) * | 1998-04-14 | 2002-08-06 | Renan Uflacker | Suction catheter for rapidly debriding abscesses |
US6296639B1 (en) * | 1999-02-12 | 2001-10-02 | Novacept | Apparatuses and methods for interstitial tissue removal |
US6022362A (en) * | 1998-09-03 | 2000-02-08 | Rubicor Medical, Inc. | Excisional biopsy devices and methods |
JP2000114212A (ja) * | 1998-10-05 | 2000-04-21 | Asahi Denka Kogyo Kk | シリコンウェハー用研磨助剤 |
US6083237A (en) * | 1998-10-23 | 2000-07-04 | Ethico Endo-Surgery, Inc. | Biopsy instrument with tissue penetrating spiral |
US6541381B2 (en) * | 1998-11-06 | 2003-04-01 | Beaver Creek Concepts Inc | Finishing method for semiconductor wafers using a lubricating boundary layer |
AU2000226357A1 (en) * | 1999-02-01 | 2000-08-18 | Garland U. Edwards | Surgical reamer cutter |
US7189206B2 (en) * | 2003-02-24 | 2007-03-13 | Senorx, Inc. | Biopsy device with inner cutter |
KR100773964B1 (ko) * | 1999-02-03 | 2007-11-08 | 신세스 게엠바하 | 외과용 리머 |
US6264087B1 (en) * | 1999-07-12 | 2001-07-24 | Powermed, Inc. | Expanding parallel jaw device for use with an electromechanical driver device |
US6692445B2 (en) * | 1999-07-27 | 2004-02-17 | Scimed Life Systems, Inc. | Biopsy sampler |
US6638233B2 (en) * | 1999-08-19 | 2003-10-28 | Fox Hollow Technologies, Inc. | Apparatus and methods for material capture and removal |
US6248081B1 (en) * | 1999-09-28 | 2001-06-19 | Scimed Life Systems, Inc. | Endoscopic submucosal core biopsy device |
US6287304B1 (en) * | 1999-10-15 | 2001-09-11 | Neothermia Corporation | Interstitial cauterization of tissue volumes with electrosurgically deployed electrodes |
DK176336B1 (da) * | 1999-12-22 | 2007-08-20 | Asahi Optical Co Ltd | Endoskopisk vævsindsamlingsinstrument |
US6746093B2 (en) * | 2001-06-08 | 2004-06-08 | Raul Martinez | Methods and apparatus for image transfer to non-planar surfaces |
US20030162399A1 (en) * | 2002-02-22 | 2003-08-28 | University Of Florida | Method, composition and apparatus for tunable selectivity during chemical mechanical polishing of metallic structures |
US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
JP2004051756A (ja) * | 2002-07-19 | 2004-02-19 | Sanyo Chem Ind Ltd | Cmpプロセス用研磨組成物 |
US20040092102A1 (en) * | 2002-11-12 | 2004-05-13 | Sachem, Inc. | Chemical mechanical polishing composition and method |
JP2004247605A (ja) * | 2003-02-14 | 2004-09-02 | Toshiba Corp | Cmp用スラリーおよび半導体装置の製造方法 |
US7473267B2 (en) * | 2003-04-25 | 2009-01-06 | Warsaw Orthopedic, Inc. | System and method for minimally invasive posterior fixation |
TW200427827A (en) * | 2003-05-30 | 2004-12-16 | Sumitomo Chemical Co | Metal polishing composition |
US20050080441A1 (en) * | 2003-10-10 | 2005-04-14 | Duke University | Surgical instruments which are especially useful for ophthalmic surgical procedures, and methods of making the same |
KR20060132588A (ko) * | 2003-10-23 | 2006-12-21 | 트랜스1 인코포레이티드 | 척추의 최소 개입절차를 수행하기 위한 도구 및 도구 키트 |
US6972277B2 (en) * | 2004-02-19 | 2005-12-06 | Goldschmidt Gbmh | Foaming clean and polish emulsions comprising bisquaternary organomodified silicone |
US20050228403A1 (en) * | 2004-03-31 | 2005-10-13 | Manoa Medical, Inc., A Delaware Corporation | Tissue cutting devices and methods |
CA2506961C (en) * | 2004-05-11 | 2013-05-07 | Inrad, Inc. | Core biopsy device |
WO2006007410A2 (en) * | 2004-06-16 | 2006-01-19 | Medtronic, Inc. | Minimally invasive coring vein harvester |
CA2574977C (en) * | 2004-07-29 | 2010-01-26 | X-Sten, Corp. | Spinal ligament modification devices |
JP4012180B2 (ja) * | 2004-08-06 | 2007-11-21 | 株式会社東芝 | Cmp用スラリー、研磨方法、および半導体装置の製造方法 |
US8048080B2 (en) * | 2004-10-15 | 2011-11-01 | Baxano, Inc. | Flexible tissue rasp |
US20060122535A1 (en) * | 2004-12-08 | 2006-06-08 | Wolfgang Daum | Method and device to obtain percutaneous tissue samples |
US8109945B2 (en) * | 2005-02-04 | 2012-02-07 | St. Jude Medical Puerto Rico Llc | Percutaneous suture path tracking device with cutting blade |
JP4542927B2 (ja) * | 2005-03-17 | 2010-09-15 | 富士フイルム株式会社 | 膜形成用組成物、該組成物から得られた絶縁膜およびそれを有する電子デバイス |
US20070055263A1 (en) * | 2005-07-29 | 2007-03-08 | X-Sten Corp. | Tools for Percutaneous Spinal Ligament Decompression and Device for Supporting Same |
US8696671B2 (en) * | 2005-07-29 | 2014-04-15 | Vertos Medical Inc. | Percutaneous tissue excision devices |
US8062298B2 (en) * | 2005-10-15 | 2011-11-22 | Baxano, Inc. | Flexible tissue removal devices and methods |
US20070162061A1 (en) * | 2005-11-04 | 2007-07-12 | X-Sten, Corp. | Tissue excision devices and methods |
US7942830B2 (en) * | 2006-05-09 | 2011-05-17 | Vertos Medical, Inc. | Ipsilateral approach to minimally invasive ligament decompression procedure |
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CN105219274A (zh) | 2016-01-06 |
WO2008060419A3 (en) | 2008-07-03 |
JP2014027297A (ja) | 2014-02-06 |
US7456107B2 (en) | 2008-11-25 |
JP2010509773A (ja) | 2010-03-25 |
EP2092035A2 (en) | 2009-08-26 |
EP2092035B1 (en) | 2019-05-08 |
JP5468903B2 (ja) | 2014-04-09 |
WO2008060419A2 (en) | 2008-05-22 |
CN105219274B (zh) | 2020-04-14 |
CN101541911A (zh) | 2009-09-23 |
KR20090078346A (ko) | 2009-07-17 |
US20080111101A1 (en) | 2008-05-15 |
TWI357439B (en) | 2012-02-01 |
MY143823A (en) | 2011-07-15 |
KR101194901B1 (ko) | 2012-10-25 |
TW200840860A (en) | 2008-10-16 |
EP2092035A4 (en) | 2010-09-08 |
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