MY108461A - Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same. - Google Patents

Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same.

Info

Publication number
MY108461A
MY108461A MYPI92001776A MYPI19921776A MY108461A MY 108461 A MY108461 A MY 108461A MY PI92001776 A MYPI92001776 A MY PI92001776A MY PI19921776 A MYPI19921776 A MY PI19921776A MY 108461 A MY108461 A MY 108461A
Authority
MY
Malaysia
Prior art keywords
carbon atoms
less carbon
group
epoxy resin
semiconductor devices
Prior art date
Application number
MYPI92001776A
Other languages
English (en)
Inventor
Takebe Kazuo
Sugiyama Yasuhide
Morimoto Takashi
Naitoh Shigeki
Kanagawa Shuichi
Kamio Kunimasa
Saito Noriaki
Shiomi Yutaka
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP26365891A external-priority patent/JPH0597946A/ja
Priority claimed from JP13060092A external-priority patent/JPH05320320A/ja
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of MY108461A publication Critical patent/MY108461A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
MYPI92001776A 1991-10-11 1992-10-01 Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same. MY108461A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26365891A JPH0597946A (ja) 1991-10-11 1991-10-11 フエノール類とナフトアルデヒド類との縮合物、そのグリシジルエーテル化物及びエポキシ樹脂組成物
JP13060092A JPH05320320A (ja) 1992-05-22 1992-05-22 エポキシ樹脂組成物及び樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
MY108461A true MY108461A (en) 1996-09-30

Family

ID=26465691

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI92001776A MY108461A (en) 1991-10-11 1992-10-01 Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same.

Country Status (8)

Country Link
US (1) US5478871A (cg-RX-API-DMAC7.html)
EP (1) EP0536748B1 (cg-RX-API-DMAC7.html)
KR (1) KR100225166B1 (cg-RX-API-DMAC7.html)
CA (1) CA2079821A1 (cg-RX-API-DMAC7.html)
DE (1) DE69222109T2 (cg-RX-API-DMAC7.html)
MY (1) MY108461A (cg-RX-API-DMAC7.html)
SG (1) SG50417A1 (cg-RX-API-DMAC7.html)
TW (1) TW206247B (cg-RX-API-DMAC7.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0589143B1 (en) * 1992-09-21 1997-01-15 Sumitomo Bakelite Company Limited Epoxy resin composition based on diglycidylether of biphenyldiol
DE4310525A1 (de) * 1993-03-31 1994-10-06 Basf Lacke & Farben Dreilagiges Metallrohrbeschichtungsmittel sowie Verfahren zur Außenbeschichtung von Metallrohren im Dreilagenverfahren
TW475926B (en) * 1996-06-06 2002-02-11 Sumitomo Chemical Co Novel ester compound and thermosetting resin composition using the same
US6201094B1 (en) * 1998-09-22 2001-03-13 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
US6239248B1 (en) * 1998-09-22 2001-05-29 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
US6001950A (en) 1998-09-22 1999-12-14 Borden Chemical, Inc. Phenol-novolacs with improved optical properties
JP3707043B2 (ja) * 1999-03-18 2005-10-19 三菱瓦斯化学株式会社 プリント配線板用プリプレグ及び積層板
WO2001094435A1 (en) * 2000-06-05 2001-12-13 Borden Chemical, Inc. Glyoxal-phenolic condensates with enhanced fluorescence
US6379800B1 (en) 2000-06-05 2002-04-30 Borden Chemical, Inc. Glyoxal-phenolic condensates with enhanced fluorescence
JP2002037859A (ja) * 2000-07-19 2002-02-06 Sumitomo Chem Co Ltd 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
US6660811B2 (en) * 2001-01-30 2003-12-09 Dainippon Ink And Chemicals, Inc. Epoxy resin composition and curing product thereof
EP1657268B1 (en) * 2003-08-21 2015-05-27 Asahi Kasei Chemicals Corporation Photosensitive composition and cured product thereof
US7348100B2 (en) * 2003-10-21 2008-03-25 Valence Technology, Inc. Product and method for the processing of precursors for lithium phosphate active materials
US20120296011A1 (en) * 2010-01-29 2012-11-22 Nipponkayaku Kabushikikaisha Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof
CN103282396B (zh) * 2010-12-28 2015-03-18 三菱瓦斯化学株式会社 芳烃树脂、光刻法用底层膜形成组合物以及形成多层抗蚀图案的方法
KR101869929B1 (ko) * 2011-06-03 2018-06-21 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 페놀계 수지 및 리소그래피용 하층막 형성 재료
WO2013137663A1 (ko) 2012-03-14 2013-09-19 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이를 포함하는 조성물, 경화물, 이의 용도 및 알콕시실릴기를 갖는 에폭시 화합물의 제조방법
JP5935955B2 (ja) * 2014-03-20 2016-06-15 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂、その製造方法、硬化性組成物、レジスト用組成物及びカラーレジスト
US11767424B2 (en) * 2019-10-25 2023-09-26 Dic Corporation Polyfunctional phenolic resin, polyfunctional epoxy resin, curable resin composition containing these, and cured product thereof
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1187232A (en) * 1980-04-17 1985-05-14 John R. Blickensderfer Phenolic friction particles
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPS6225116A (ja) * 1986-07-17 1987-02-03 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テルから得られる樹脂
JPH01271415A (ja) * 1988-04-22 1989-10-30 Dainippon Ink & Chem Inc 熱硬化性エポキシ樹脂組成物
JP2628099B2 (ja) * 1989-08-18 1997-07-09 武田薬品工業株式会社 軟質ウレタンフォームの製造法
EP0414537B1 (en) * 1989-08-23 1999-02-17 Director-General Of The Agency Of Industrial Science And Technology Organic ferromagnetic substance
US4960634A (en) * 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof

Also Published As

Publication number Publication date
DE69222109T2 (de) 1998-01-29
TW206247B (cg-RX-API-DMAC7.html) 1993-05-21
DE69222109D1 (de) 1997-10-16
CA2079821A1 (en) 1993-04-12
EP0536748A1 (en) 1993-04-14
KR100225166B1 (ko) 1999-10-15
EP0536748B1 (en) 1997-09-10
KR930007997A (ko) 1993-05-20
US5478871A (en) 1995-12-26
SG50417A1 (en) 1998-07-20

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