JPS57133119A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS57133119A
JPS57133119A JP1900981A JP1900981A JPS57133119A JP S57133119 A JPS57133119 A JP S57133119A JP 1900981 A JP1900981 A JP 1900981A JP 1900981 A JP1900981 A JP 1900981A JP S57133119 A JPS57133119 A JP S57133119A
Authority
JP
Japan
Prior art keywords
epoxy resin
compounding
molecule
group
acid ester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1900981A
Other languages
Japanese (ja)
Other versions
JPS612089B2 (en
Inventor
Shuji Hayase
Takeo Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1900981A priority Critical patent/JPS57133119A/en
Publication of JPS57133119A publication Critical patent/JPS57133119A/en
Publication of JPS612089B2 publication Critical patent/JPS612089B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the titled composition giving a cured product having excellent heat resistance and mechanical and electrical characteristics, by compounding an epoxy resin, a specific polyvalent organic cyanic acid ester, an aluminum compound, a specific organosilane compound containing OH group, etc.
CONSTITUTION: The objective composition is prepared by compounding (A) 100pts.wt. of an epoxy resin (e.g. bisphenol A-type epoxy resin) with (B) ≤ 50pts.wt. of a polyvalent organic cyanic acid ester having at least two cyanate groups in the molecule (e.g. 1,3- or 1,4-dicyanatobenzene), (C) a catalytic amount (0.001W5pts.) of an aluminum compound (e.g. Al methoxide), and (D) a catalytic amount (0.01W5%) of an organosilane or organosiloxane compound having at least one OH group or hydrolyzable group bonded to silicon atom in the molecule.
USE: Insulation treatment of electrical equipment, etc.
COPYRIGHT: (C)1982,JPO&Japio
JP1900981A 1981-02-13 1981-02-13 Curable resin composition Granted JPS57133119A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1900981A JPS57133119A (en) 1981-02-13 1981-02-13 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1900981A JPS57133119A (en) 1981-02-13 1981-02-13 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS57133119A true JPS57133119A (en) 1982-08-17
JPS612089B2 JPS612089B2 (en) 1986-01-22

Family

ID=11987502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1900981A Granted JPS57133119A (en) 1981-02-13 1981-02-13 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS57133119A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015117358A (en) * 2013-12-16 2015-06-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． Insulating resin composition for printed circuit board, and products using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015117358A (en) * 2013-12-16 2015-06-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． Insulating resin composition for printed circuit board, and products using the same

Also Published As

Publication number Publication date
JPS612089B2 (en) 1986-01-22

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