JPS57133119A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS57133119A JPS57133119A JP1900981A JP1900981A JPS57133119A JP S57133119 A JPS57133119 A JP S57133119A JP 1900981 A JP1900981 A JP 1900981A JP 1900981 A JP1900981 A JP 1900981A JP S57133119 A JPS57133119 A JP S57133119A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- compounding
- molecule
- group
- acid ester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To prepare the titled composition giving a cured product having excellent heat resistance and mechanical and electrical characteristics, by compounding an epoxy resin, a specific polyvalent organic cyanic acid ester, an aluminum compound, a specific organosilane compound containing OH group, etc.
CONSTITUTION: The objective composition is prepared by compounding (A) 100pts.wt. of an epoxy resin (e.g. bisphenol A-type epoxy resin) with (B) ≤ 50pts.wt. of a polyvalent organic cyanic acid ester having at least two cyanate groups in the molecule (e.g. 1,3- or 1,4-dicyanatobenzene), (C) a catalytic amount (0.001W5pts.) of an aluminum compound (e.g. Al methoxide), and (D) a catalytic amount (0.01W5%) of an organosilane or organosiloxane compound having at least one OH group or hydrolyzable group bonded to silicon atom in the molecule.
USE: Insulation treatment of electrical equipment, etc.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1900981A JPS57133119A (en) | 1981-02-13 | 1981-02-13 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1900981A JPS57133119A (en) | 1981-02-13 | 1981-02-13 | Curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57133119A true JPS57133119A (en) | 1982-08-17 |
JPS612089B2 JPS612089B2 (en) | 1986-01-22 |
Family
ID=11987502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1900981A Granted JPS57133119A (en) | 1981-02-13 | 1981-02-13 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57133119A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015117358A (en) * | 2013-12-16 | 2015-06-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Insulating resin composition for printed circuit board, and products using the same |
-
1981
- 1981-02-13 JP JP1900981A patent/JPS57133119A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015117358A (en) * | 2013-12-16 | 2015-06-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Insulating resin composition for printed circuit board, and products using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS612089B2 (en) | 1986-01-22 |
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