MXPA05009600A - Dispositivos de conmutacion de calcogenuro multi-terminal. - Google Patents

Dispositivos de conmutacion de calcogenuro multi-terminal.

Info

Publication number
MXPA05009600A
MXPA05009600A MXPA05009600A MXPA05009600A MXPA05009600A MX PA05009600 A MXPA05009600 A MX PA05009600A MX PA05009600 A MXPA05009600 A MX PA05009600A MX PA05009600 A MXPA05009600 A MX PA05009600A MX PA05009600 A MXPA05009600 A MX PA05009600A
Authority
MX
Mexico
Prior art keywords
terminal
devices
switching devices
chalcogenide material
chalcogenide switching
Prior art date
Application number
MXPA05009600A
Other languages
English (en)
Inventor
Pashmakov Boil
Original Assignee
Energy Conversion Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Energy Conversion Devices Inc filed Critical Energy Conversion Devices Inc
Publication of MXPA05009600A publication Critical patent/MXPA05009600A/es

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/253Multistable switching devices, e.g. memristors having three or more electrodes, e.g. transistor-like devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/257Multistable switching devices, e.g. memristors having switching assisted by radiation or particle beam, e.g. optically controlled devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/50Resistive cell structure aspects
    • G11C2213/51Structure including a barrier layer preventing or limiting migration, diffusion of ions or charges or formation of electrolytes near an electrode

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Electronic Switches (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

Los dispositivos de conmutacion electronicos multi-terminales comprenden un material de calcogenuro conmutable entre un estado resistente y un estado conductivo. Los dispositivos incluyen una primera terminal, una segunda terminal y una terminal de control. La aplicacion de una senal de control en la terminal de control modula la conductividad del material de calcogenuro entre la primera y segunda terminales y/o el voltaje de umbral requerido para conmutar el material de calcogenuro entre la primera y segunda terminales desde un estado resistente en un estado conductivo. Los dispositivos puede utilizarse como dispositivos de interconexion o dispositivos de proporcion de senal en los circuitos y las redes.
MXPA05009600A 2003-03-10 2004-02-04 Dispositivos de conmutacion de calcogenuro multi-terminal. MXPA05009600A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/384,994 US6967344B2 (en) 2003-03-10 2003-03-10 Multi-terminal chalcogenide switching devices
PCT/US2004/003111 WO2004081977A2 (en) 2003-03-10 2004-02-04 Multi-terminal chalcogenide switching devices

Publications (1)

Publication Number Publication Date
MXPA05009600A true MXPA05009600A (es) 2005-11-04

Family

ID=32961414

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA05009600A MXPA05009600A (es) 2003-03-10 2004-02-04 Dispositivos de conmutacion de calcogenuro multi-terminal.

Country Status (10)

Country Link
US (1) US6967344B2 (es)
EP (1) EP1636825B1 (es)
JP (1) JP5396002B2 (es)
KR (1) KR101056078B1 (es)
CN (1) CN100521279C (es)
BR (1) BRPI0408230A (es)
CA (1) CA2518246A1 (es)
MX (1) MXPA05009600A (es)
TW (1) TWI257724B (es)
WO (1) WO2004081977A2 (es)

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US7085155B2 (en) * 2003-03-10 2006-08-01 Energy Conversion Devices, Inc. Secured phase-change devices
US20040257848A1 (en) * 2003-06-18 2004-12-23 Macronix International Co., Ltd. Method for adjusting the threshold voltage of a memory cell
US7381611B2 (en) * 2003-08-04 2008-06-03 Intel Corporation Multilayered phase change memory
US7485891B2 (en) * 2003-11-20 2009-02-03 International Business Machines Corporation Multi-bit phase change memory cell and multi-bit phase change memory including the same, method of forming a multi-bit phase change memory, and method of programming a multi-bit phase change memory
DE102004037450B4 (de) * 2004-08-02 2009-04-16 Qimonda Ag Verfahren zum Betrieb eines Schalt-Bauelements
US20060172067A1 (en) * 2005-01-28 2006-08-03 Energy Conversion Devices, Inc Chemical vapor deposition of chalcogenide materials
US20080286446A1 (en) * 2005-01-28 2008-11-20 Smuruthi Kamepalli Seed-Assisted MOCVD Growth of Threshold Switching and Phase-Change Materials
US7317200B2 (en) * 2005-02-23 2008-01-08 Micron Technology, Inc. SnSe-based limited reprogrammable cell
US7525117B2 (en) * 2005-08-09 2009-04-28 Ovonyx, Inc. Chalcogenide devices and materials having reduced germanium or telluruim content
CN100382330C (zh) * 2005-08-11 2008-04-16 上海交通大学 可实现多位存储的单元结构
US7511532B2 (en) 2005-11-03 2009-03-31 Cswitch Corp. Reconfigurable logic structures
US8183551B2 (en) * 2005-11-03 2012-05-22 Agale Logic, Inc. Multi-terminal phase change devices
US8222917B2 (en) * 2005-11-03 2012-07-17 Agate Logic, Inc. Impedance matching and trimming apparatuses and methods using programmable resistance devices
US7494849B2 (en) * 2005-11-03 2009-02-24 Cswitch Inc. Methods for fabricating multi-terminal phase change devices
US7675765B2 (en) 2005-11-03 2010-03-09 Agate Logic, Inc. Phase-change memory (PCM) based universal content-addressable memory (CAM) configured as binary/ternary CAM
US7746682B2 (en) * 2005-11-03 2010-06-29 Agata Logic Inc. SEU hardened latches and memory cells using programmable resistance devices
US7741638B2 (en) * 2005-11-23 2010-06-22 Hewlett-Packard Development Company, L.P. Control layer for a nanoscale electronic switching device
JP5520484B2 (ja) * 2005-12-12 2014-06-11 オヴォニクス,インコーポレイテッド ゲルマニウムまたはテルル含有量の少ないカルコゲナイドデバイス及びカルコゲナイド材料
US7754603B2 (en) * 2006-05-22 2010-07-13 Ovonyx, Inc. Multi-functional chalcogenide electronic devices having gain
US7547906B2 (en) * 2006-05-22 2009-06-16 Ovonyx, Inc. Multi-functional chalcogenide electronic devices having gain
US7969769B2 (en) * 2007-03-15 2011-06-28 Ovonyx, Inc. Multi-terminal chalcogenide logic circuits
US7687309B2 (en) 2007-06-28 2010-03-30 International Business Machines Corporation CMOS-process-compatible programmable via device
US7772582B2 (en) * 2007-07-11 2010-08-10 International Business Machines Corporation Four-terminal reconfigurable devices
US7659534B2 (en) * 2007-08-03 2010-02-09 International Business Machines Corporation Programmable via devices with air gap isolation
US7969770B2 (en) * 2007-08-03 2011-06-28 International Business Machines Corporation Programmable via devices in back end of line level
JP4595125B2 (ja) * 2007-08-31 2010-12-08 独立行政法人産業技術総合研究所 固体メモリ
JP4621897B2 (ja) 2007-08-31 2011-01-26 独立行政法人産業技術総合研究所 固体メモリ
US8228719B2 (en) * 2008-06-06 2012-07-24 Ovonyx, Inc. Thin film input/output
US8467236B2 (en) 2008-08-01 2013-06-18 Boise State University Continuously variable resistor
US8377741B2 (en) * 2008-12-30 2013-02-19 Stmicroelectronics S.R.L. Self-heating phase change memory cell architecture
US8148707B2 (en) 2008-12-30 2012-04-03 Stmicroelectronics S.R.L. Ovonic threshold switch film composition for TSLAGS material
US7939815B2 (en) * 2008-12-30 2011-05-10 Stmicroelectronics S.R.L. Forming a carbon passivated ovonic threshold switch
US8546785B2 (en) 2010-03-31 2013-10-01 Hewlett-Packard Development Company, L.P. Memristive device
US8345472B2 (en) 2010-12-21 2013-01-01 Intel Corporation Three-terminal ovonic threshold switch as a current driver in a phase change memory
FR2977077B1 (fr) * 2011-06-27 2013-08-02 Commissariat Energie Atomique Generateur de retards utilisant une resistance programmable a base de materiau a changement de phase
US8737114B2 (en) * 2012-05-07 2014-05-27 Micron Technology, Inc. Switching device structures and methods
US9019743B2 (en) * 2012-11-29 2015-04-28 Taiwan Semiconductor Manufacturing Company, Ltd. Method and structure for resistive switching random access memory with high reliable and high density
WO2015163972A2 (en) * 2014-02-14 2015-10-29 Hrl Laboratories, Llc A reconfigurable electromagnetic surface of pixelated metal patches
US20160005965A1 (en) * 2014-07-01 2016-01-07 Micron Technology, Inc. Memory cells having a first selecting chalcogenide material and a second selecting chalcogenide material and methods therof
US9406881B1 (en) 2015-04-24 2016-08-02 Micron Technology, Inc. Memory cells having a heater electrode formed between a first storage material and a second storage material and methods of forming the same
KR102608887B1 (ko) * 2016-08-10 2023-12-04 에스케이하이닉스 주식회사 반도체 장치
JP7079201B2 (ja) * 2016-10-04 2022-06-01 ソニーセミコンダクタソリューションズ株式会社 スイッチ素子および記憶装置ならびにメモリシステム
KR102295524B1 (ko) * 2017-03-27 2021-08-30 삼성전자 주식회사 메모리 소자
US10541271B2 (en) 2017-10-18 2020-01-21 Macronix International Co., Ltd. Superlattice-like switching devices
EP3570339B1 (en) 2018-05-17 2020-12-30 IMEC vzw Switching device with active portion switching from insulating state to conducting state
US10374009B1 (en) 2018-07-17 2019-08-06 Macronix International Co., Ltd. Te-free AsSeGe chalcogenides for selector devices and memory devices using same
US10943952B2 (en) * 2019-06-10 2021-03-09 Sandisk Technologies Llc Threshold switch for memory
CN110767802B (zh) * 2019-09-24 2021-03-09 华中科技大学 用于纳米级相变存储器单元的电极配置结构
CN110783454B (zh) * 2019-09-24 2021-03-09 华中科技大学 纳米级相变存储器单元电极配置结构的加工方法
US11289540B2 (en) 2019-10-15 2022-03-29 Macronix International Co., Ltd. Semiconductor device and memory cell
US11158787B2 (en) 2019-12-17 2021-10-26 Macronix International Co., Ltd. C—As—Se—Ge ovonic materials for selector devices and memory devices using same
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Also Published As

Publication number Publication date
EP1636825B1 (en) 2013-04-10
CN1993842A (zh) 2007-07-04
TWI257724B (en) 2006-07-01
EP1636825A2 (en) 2006-03-22
TW200505066A (en) 2005-02-01
US20040178401A1 (en) 2004-09-16
CN100521279C (zh) 2009-07-29
JP5396002B2 (ja) 2014-01-22
JP2007525816A (ja) 2007-09-06
WO2004081977A3 (en) 2006-10-26
CA2518246A1 (en) 2004-09-23
EP1636825A4 (en) 2010-03-24
WO2004081977A2 (en) 2004-09-23
BRPI0408230A (pt) 2006-02-21
US6967344B2 (en) 2005-11-22
KR101056078B1 (ko) 2011-08-10
KR20050110668A (ko) 2005-11-23

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