MX380981B - Composiciones adhesivas estructurales. - Google Patents
Composiciones adhesivas estructurales.Info
- Publication number
- MX380981B MX380981B MX2014006899A MX2014006899A MX380981B MX 380981 B MX380981 B MX 380981B MX 2014006899 A MX2014006899 A MX 2014006899A MX 2014006899 A MX2014006899 A MX 2014006899A MX 380981 B MX380981 B MX 380981B
- Authority
- MX
- Mexico
- Prior art keywords
- epoxy
- component
- adduct
- core
- disclosed
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000004593 Epoxy Substances 0.000 abstract 4
- 239000002245 particle Substances 0.000 abstract 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 2
- 229910052799 carbon Inorganic materials 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000000539 dimer Substances 0.000 abstract 1
- 229920005862 polyol Polymers 0.000 abstract 1
- 150000003077 polyols Chemical class 0.000 abstract 1
- 239000000376 reactant Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
- C08G59/4276—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/315,518 US20120129980A1 (en) | 2010-11-19 | 2011-12-09 | Structural adhesive compositions |
| PCT/US2012/068378 WO2013086277A2 (en) | 2011-12-09 | 2012-12-07 | Structural adhesive compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2014006899A MX2014006899A (es) | 2015-05-15 |
| MX380981B true MX380981B (es) | 2025-03-12 |
Family
ID=47501441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2014006899A MX380981B (es) | 2011-12-09 | 2012-12-07 | Composiciones adhesivas estructurales. |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US20120129980A1 (https=) |
| EP (1) | EP2788397A2 (https=) |
| KR (1) | KR101684752B1 (https=) |
| CN (1) | CN104053694B (https=) |
| AU (1) | AU2012347650B2 (https=) |
| BR (1) | BR112014013594B1 (https=) |
| CA (1) | CA2858186C (https=) |
| IN (1) | IN2014DN04651A (https=) |
| MX (1) | MX380981B (https=) |
| RU (1) | RU2595040C2 (https=) |
| SG (1) | SG11201403003SA (https=) |
| WO (1) | WO2013086277A2 (https=) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010118580A (ja) | 2008-11-14 | 2010-05-27 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US20120128499A1 (en) * | 2010-11-19 | 2012-05-24 | Desai Umesh C | Structural adhesive compositions |
| US8796361B2 (en) | 2010-11-19 | 2014-08-05 | Ppg Industries Ohio, Inc. | Adhesive compositions containing graphenic carbon particles |
| US20140150970A1 (en) * | 2010-11-19 | 2014-06-05 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10294375B2 (en) * | 2011-09-30 | 2019-05-21 | Ppg Industries Ohio, Inc. | Electrically conductive coatings containing graphenic carbon particles |
| US12421118B2 (en) | 2011-09-30 | 2025-09-23 | Ppg Industries Ohio, Inc. | Graphenic carbon particles |
| KR102111816B1 (ko) * | 2012-08-03 | 2020-05-15 | 오씨브이 인텔렉츄얼 캐피탈 엘엘씨 | 개선된 파이버글라스 보강 복합재 |
| CA2903945C (en) * | 2013-03-04 | 2018-05-01 | Nippon Steel & Sumitomo Metal Corporation | Impact-absorbing component |
| SG11201510248YA (en) * | 2013-06-14 | 2016-01-28 | Ppg Ind Ohio Inc | Structural adhesive compositions |
| KR20160034330A (ko) * | 2013-07-24 | 2016-03-29 | 블루 큐브 아이피 엘엘씨 | 경화성 조성물 |
| CN104004482A (zh) * | 2014-06-13 | 2014-08-27 | 江苏悦达新材料科技有限公司 | 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法 |
| GB201411586D0 (en) * | 2014-06-30 | 2014-08-13 | Hexcel Composites Ltd | Adhesive composition |
| DE102014226826A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
| US11242427B2 (en) | 2015-10-20 | 2022-02-08 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10377928B2 (en) | 2015-12-10 | 2019-08-13 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10351661B2 (en) | 2015-12-10 | 2019-07-16 | Ppg Industries Ohio, Inc. | Method for producing an aminimide |
| CN106118571A (zh) * | 2016-06-28 | 2016-11-16 | 四川东树新材料有限公司 | 风电叶片用含石墨烯结构胶黏剂及其制备方法 |
| CN110072915A (zh) * | 2016-10-28 | 2019-07-30 | 陶氏环球技术有限责任公司 | 具有改善的低温耐冲击性的耐碰撞环氧粘合剂 |
| US11739241B2 (en) | 2017-06-23 | 2023-08-29 | Ddp Specialty Electronic Material Us, Llc | High temperature epoxy adhesive formulations |
| TWI761598B (zh) | 2017-09-20 | 2022-04-21 | 美商片片堅俄亥俄州工業公司 | 雙成份結構之黏著劑及其使用方法 |
| US11732125B2 (en) | 2018-02-09 | 2023-08-22 | Ppg Industries Ohio, Inc. | Coating compositions |
| MX2021003324A (es) | 2018-09-20 | 2021-05-14 | Ppg Ind Ohio Inc | Composicion que contiene tiol. |
| WO2020077333A1 (en) | 2018-10-12 | 2020-04-16 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| CN112969738B (zh) * | 2018-10-29 | 2025-03-28 | 泽菲罗斯有限公司 | 改进的结构粘结粘合剂 |
| FR3098817A1 (fr) | 2019-07-16 | 2021-01-22 | Ppg Industries Ohio, Inc. | Compositions contenant des charges thermiquement conductrices |
| CN114585701B (zh) * | 2019-08-23 | 2024-04-09 | Ppg工业俄亥俄公司 | 用于改进双组分结构粘合剂的搭接剪切强度和位移的体系和方法 |
| BR112022003302A2 (pt) | 2019-08-23 | 2022-06-21 | Ppg Ind Ohio Inc | Composições de revestimento |
| EP4017897A1 (en) * | 2019-08-23 | 2022-06-29 | PRC-Desoto International, Inc. | Coating compositions |
| EP4017898B1 (en) * | 2019-08-23 | 2026-04-29 | PPG Industries Ohio Inc. | Systems and methods for improved lap shear strength and displacement of two-component structural adhesives |
| US20220372207A1 (en) | 2019-09-23 | 2022-11-24 | Ppg Industries Ohio, Inc. | Curable compositions |
| CN114829476B (zh) | 2019-12-11 | 2024-04-12 | Ppg工业俄亥俄公司 | 含有导热填料的组合物 |
| EP4110871A1 (en) | 2020-02-26 | 2023-01-04 | PPG Industries Ohio Inc. | Coated substrates and methods of preparing the same |
| US20230115050A1 (en) | 2020-02-26 | 2023-04-13 | Ppg Industries Ohio, Inc. | Thermally conductive and electrically insulating powder coating compositions |
| KR20220143746A (ko) | 2020-02-26 | 2022-10-25 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 2-층 유전체 코팅 |
| CN115702189A (zh) | 2020-04-15 | 2023-02-14 | Ppg工业俄亥俄公司 | 含有导热填料的组合物 |
| ES3040286T3 (en) | 2020-04-15 | 2025-10-29 | Ppg Ind Ohio Inc | Use of a coating formed from a composition containing thermally conductive fillers to provide a substrate with thermal and fire protection |
| CA3175421A1 (en) | 2020-04-15 | 2021-10-21 | Liang Ma | Compositions containing thermally conductive fillers |
| EP4136162A1 (en) | 2020-04-15 | 2023-02-22 | PPG Industries Ohio Inc. | Compositions containing thermally conductive fillers |
| WO2021211182A1 (en) | 2020-04-15 | 2021-10-21 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| WO2021211185A1 (en) | 2020-04-15 | 2021-10-21 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| CA3199506A1 (en) | 2020-12-18 | 2022-06-23 | Corey James DEDOMENIC | Thermally conductive and electrically insulating and/or fire-retardant electrodepositable coating compositions |
| EP4314187A1 (en) | 2021-03-26 | 2024-02-07 | PPG Industries Ohio Inc. | Coating compositions |
| DE102021113089B4 (de) * | 2021-05-20 | 2023-05-11 | Jomoo Kitchen & Bath Deutschland Gmbh | Sanitär-Einrichtung |
| MX2024006742A (es) | 2021-12-02 | 2024-06-19 | Ppg Ind Ohio Inc | Composiciones de revestimiento. |
| CN114752334B (zh) * | 2022-04-11 | 2023-10-20 | 中国航发北京航空材料研究院 | 一种耐湿热贮存稳定的中温固化环氧结构胶膜及制备方法 |
| CA3252345A1 (en) | 2022-06-06 | 2023-12-14 | Ppg Industries Ohio, Inc. | COATING COMPOSITIONS |
| WO2024040260A1 (en) * | 2022-08-19 | 2024-02-22 | Ppg Industries Ohio, Inc. | Coating compositions |
| CN119968411A (zh) | 2022-08-22 | 2025-05-09 | Ppg工业俄亥俄公司 | 涂层组合物 |
| CN116042150A (zh) * | 2022-12-30 | 2023-05-02 | 浙江抟原复合材料有限公司 | 一种lng船围护系统用低温环氧树脂及其制备方法 |
| DE112024002400T5 (de) | 2023-06-01 | 2026-03-12 | Ppg Industries Ohio, Inc. | Zusammensetzungen, die thermisch leitfähige füllstoffe und thermisch expandierbare materialien enthalten |
| WO2025188361A2 (en) | 2023-11-19 | 2025-09-12 | Ppg Industries Ohio, Inc. | Curable compositions |
| WO2025183772A1 (en) | 2024-02-26 | 2025-09-04 | Ppg Industries Ohio, Inc. | Compositions containing a thermally conductive filler and a thermally expandable material |
| WO2025183769A1 (en) | 2024-02-26 | 2025-09-04 | Ppg Industries Ohio, Inc. | Furan-functional and isocyanate-functional compounds and reversibly curable compositions |
| WO2025183770A1 (en) | 2024-02-26 | 2025-09-04 | Ppg Industries Ohio, Inc. | Compositions containing furan-functional and isocyanate-functional compounds and expandable material |
| WO2025183771A1 (en) | 2024-02-26 | 2025-09-04 | Ppg Industries Ohio, Inc. | Compositions containing a thermally conductive filler and a thermally expandable material |
| WO2026059637A2 (en) | 2024-09-03 | 2026-03-19 | Ppg Industries Ohio, Inc. | Coating compositions and solvent-assisted degradable coatings formed therefrom |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3816365A (en) * | 1968-09-12 | 1974-06-11 | Ciba Geigy Ag | Adducts,containing epoxide groups,from polyglycidyl compounds and acid polyesters of aliphatic-cycloaliphatic dicarboxylic acids,process for their manufacture and use |
| US4668736A (en) * | 1984-07-18 | 1987-05-26 | Minnesota Mining And Manufacturing Company | Fast curing epoxy resin compositions |
| EP0305331A3 (de) * | 1987-08-25 | 1991-05-08 | Ciba-Geigy Ag | Epoxidflexibilisatoren |
| US5070119A (en) * | 1990-09-28 | 1991-12-03 | Ppg Industries, Inc. | Flexible intumescent coating composition |
| DE4317470C2 (de) * | 1993-05-26 | 2001-06-07 | Henkel Kgaa | Thermisch vernetzbarer Heißsiegel-Klebstoff und dessen Verwendung |
| JPH07309929A (ja) * | 1994-05-16 | 1995-11-28 | Dainippon Ink & Chem Inc | エポキシ樹脂及びその製造方法 |
| US7071258B1 (en) * | 2002-10-21 | 2006-07-04 | Nanotek Instruments, Inc. | Nano-scaled graphene plates |
| KR20040061909A (ko) * | 2002-12-31 | 2004-07-07 | 주식회사 금강고려화학 | 내후성 및 기계적 물성이 우수한 에폭시-폴리에스테르수지 조성과 분체 도료 조성물 |
| JP2006008730A (ja) * | 2004-06-22 | 2006-01-12 | Kyoeisha Chem Co Ltd | 油膜被覆鋼材と発泡した硬化エポキシ樹脂充填材との接着性の増強剤 |
| ES2691528T3 (es) * | 2006-07-31 | 2018-11-27 | Henkel Ag & Co. Kgaa | Composiciones adhesivas basadas en resina epoxi curable |
| BRPI0809752B1 (pt) * | 2007-04-11 | 2017-05-16 | Dow Global Technologies Inc | "adesivo estrutural de um componente e método" |
| KR20100059818A (ko) * | 2007-07-26 | 2010-06-04 | 헨켈 코포레이션 | 경화성 에폭시 수지계 접착제 조성물 |
| CN102102001B (zh) * | 2010-12-03 | 2013-04-17 | 烟台德邦科技有限公司 | 一种高导热石墨烯基环氧树脂胶粘剂及其制备方法 |
-
2011
- 2011-12-09 US US13/315,518 patent/US20120129980A1/en not_active Abandoned
-
2012
- 2012-12-07 RU RU2014127905/04A patent/RU2595040C2/ru active
- 2012-12-07 EP EP12809911.6A patent/EP2788397A2/en active Pending
- 2012-12-07 SG SG11201403003SA patent/SG11201403003SA/en unknown
- 2012-12-07 WO PCT/US2012/068378 patent/WO2013086277A2/en not_active Ceased
- 2012-12-07 CA CA2858186A patent/CA2858186C/en active Active
- 2012-12-07 BR BR112014013594-0A patent/BR112014013594B1/pt active IP Right Grant
- 2012-12-07 IN IN4651DEN2014 patent/IN2014DN04651A/en unknown
- 2012-12-07 AU AU2012347650A patent/AU2012347650B2/en not_active Ceased
- 2012-12-07 MX MX2014006899A patent/MX380981B/es unknown
- 2012-12-07 CN CN201280067282.6A patent/CN104053694B/zh active Active
- 2012-12-07 KR KR1020147018721A patent/KR101684752B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| BR112014013594B1 (pt) | 2021-01-05 |
| KR101684752B1 (ko) | 2016-12-08 |
| MX2014006899A (es) | 2015-05-15 |
| CN104053694A (zh) | 2014-09-17 |
| CA2858186A1 (en) | 2013-06-13 |
| RU2595040C2 (ru) | 2016-08-20 |
| US20120129980A1 (en) | 2012-05-24 |
| BR112014013594A8 (pt) | 2017-06-13 |
| CN104053694B (zh) | 2016-08-17 |
| CA2858186C (en) | 2016-06-07 |
| RU2014127905A (ru) | 2016-02-10 |
| AU2012347650A1 (en) | 2014-06-26 |
| EP2788397A2 (en) | 2014-10-15 |
| AU2012347650B2 (en) | 2015-09-17 |
| WO2013086277A3 (en) | 2013-08-15 |
| IN2014DN04651A (https=) | 2015-04-03 |
| SG11201403003SA (en) | 2014-07-30 |
| KR20140101838A (ko) | 2014-08-20 |
| WO2013086277A2 (en) | 2013-06-13 |
| BR112014013594A2 (pt) | 2017-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX380981B (es) | Composiciones adhesivas estructurales. | |
| MX2021014593A (es) | Composiciones adhesivas estructurales. | |
| MX373886B (es) | Composiciones de adhesivo estructural. | |
| JP2014504663A5 (https=) | ||
| WO2013025303A3 (en) | Curable resin compositions | |
| WO2012139974A3 (de) | Schlagzähmodifizierte klebstoffe | |
| SG179001A1 (en) | Adhesive film, multilayer circuit board, electronic component and semiconductor device | |
| TW200740922A (en) | Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film | |
| JP2016522278A5 (https=) | ||
| MY162601A (en) | Curable epoxy resin composition | |
| WO2014049028A3 (en) | Resin composition and composite structure containing resin | |
| WO2012006001A3 (en) | Storage-stable heat-activated tertiary amine catalysts for epoxy resins | |
| BRPI0915938A2 (pt) | mistura, processo para preparar a mistura, uso da mistura, adesivo estrutural, e, resina epóxi curada | |
| WO2013025304A3 (en) | Curable resin compositions | |
| IN2014DN08701A (https=) | ||
| WO2009038097A1 (ja) | エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物 | |
| MY175000A (en) | Epoxy resin, epoxy resin composition and cured product | |
| FR2987049B1 (fr) | Resines epoxydes biosourcees a reactivite amelioree. | |
| WO2012047420A3 (en) | Thermosettable compositions and thermosets therefrom | |
| PH12017501555A1 (en) | Mercaptoethylglycol uril compound and utilization thereof | |
| TWI455949B (zh) | 烯烴樹脂、環氧樹脂、硬化性樹脂組成物及其硬化物 | |
| WO2014062530A3 (en) | Toughened epoxy thermosets containing core shell rubbers and polyols | |
| WO2011059883A3 (en) | One-pack type liquid epoxy resin composition and adhesion method using same | |
| WO2011149556A3 (en) | Composites | |
| JP2012248370A5 (https=) |