KR101684752B1 - 구조용 접착제 조성물 - Google Patents

구조용 접착제 조성물 Download PDF

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KR101684752B1
KR101684752B1 KR1020147018721A KR20147018721A KR101684752B1 KR 101684752 B1 KR101684752 B1 KR 101684752B1 KR 1020147018721 A KR1020147018721 A KR 1020147018721A KR 20147018721 A KR20147018721 A KR 20147018721A KR 101684752 B1 KR101684752 B1 KR 101684752B1
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epoxy
adduct
component
anhydride
rti
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KR20140101838A (ko
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우메쉬 씨 데자이
티엔-치에 차오
마사유키 나카지마
칼리아파 지 라구나탄
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피피지 인더스트리즈 오하이오 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020147018721A 2011-12-09 2012-12-07 구조용 접착제 조성물 Active KR101684752B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/315,518 2011-12-09
US13/315,518 US20120129980A1 (en) 2010-11-19 2011-12-09 Structural adhesive compositions
PCT/US2012/068378 WO2013086277A2 (en) 2011-12-09 2012-12-07 Structural adhesive compositions

Publications (2)

Publication Number Publication Date
KR20140101838A KR20140101838A (ko) 2014-08-20
KR101684752B1 true KR101684752B1 (ko) 2016-12-08

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KR1020147018721A Active KR101684752B1 (ko) 2011-12-09 2012-12-07 구조용 접착제 조성물

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Country Link
US (1) US20120129980A1 (https=)
EP (1) EP2788397A2 (https=)
KR (1) KR101684752B1 (https=)
CN (1) CN104053694B (https=)
AU (1) AU2012347650B2 (https=)
BR (1) BR112014013594B1 (https=)
CA (1) CA2858186C (https=)
IN (1) IN2014DN04651A (https=)
MX (1) MX380981B (https=)
RU (1) RU2595040C2 (https=)
SG (1) SG11201403003SA (https=)
WO (1) WO2013086277A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240090704A (ko) * 2018-02-09 2024-06-21 피피지 인더스트리즈 오하이오 인코포레이티드 코팅 조성물

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010118580A (ja) 2008-11-14 2010-05-27 Toshiba Corp 不揮発性半導体記憶装置
US20120128499A1 (en) * 2010-11-19 2012-05-24 Desai Umesh C Structural adhesive compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20140150970A1 (en) * 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10294375B2 (en) * 2011-09-30 2019-05-21 Ppg Industries Ohio, Inc. Electrically conductive coatings containing graphenic carbon particles
US12421118B2 (en) 2011-09-30 2025-09-23 Ppg Industries Ohio, Inc. Graphenic carbon particles
KR102111816B1 (ko) * 2012-08-03 2020-05-15 오씨브이 인텔렉츄얼 캐피탈 엘엘씨 개선된 파이버글라스 보강 복합재
CA2903945C (en) * 2013-03-04 2018-05-01 Nippon Steel & Sumitomo Metal Corporation Impact-absorbing component
SG11201510248YA (en) * 2013-06-14 2016-01-28 Ppg Ind Ohio Inc Structural adhesive compositions
KR20160034330A (ko) * 2013-07-24 2016-03-29 블루 큐브 아이피 엘엘씨 경화성 조성물
CN104004482A (zh) * 2014-06-13 2014-08-27 江苏悦达新材料科技有限公司 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
DE102014226826A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Epoxidharz-Zusammensetzung
US11242427B2 (en) 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
CN106118571A (zh) * 2016-06-28 2016-11-16 四川东树新材料有限公司 风电叶片用含石墨烯结构胶黏剂及其制备方法
CN110072915A (zh) * 2016-10-28 2019-07-30 陶氏环球技术有限责任公司 具有改善的低温耐冲击性的耐碰撞环氧粘合剂
US11739241B2 (en) 2017-06-23 2023-08-29 Ddp Specialty Electronic Material Us, Llc High temperature epoxy adhesive formulations
TWI761598B (zh) 2017-09-20 2022-04-21 美商片片堅俄亥俄州工業公司 雙成份結構之黏著劑及其使用方法
MX2021003324A (es) 2018-09-20 2021-05-14 Ppg Ind Ohio Inc Composicion que contiene tiol.
WO2020077333A1 (en) 2018-10-12 2020-04-16 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
CN112969738B (zh) * 2018-10-29 2025-03-28 泽菲罗斯有限公司 改进的结构粘结粘合剂
FR3098817A1 (fr) 2019-07-16 2021-01-22 Ppg Industries Ohio, Inc. Compositions contenant des charges thermiquement conductrices
CN114585701B (zh) * 2019-08-23 2024-04-09 Ppg工业俄亥俄公司 用于改进双组分结构粘合剂的搭接剪切强度和位移的体系和方法
BR112022003302A2 (pt) 2019-08-23 2022-06-21 Ppg Ind Ohio Inc Composições de revestimento
EP4017897A1 (en) * 2019-08-23 2022-06-29 PRC-Desoto International, Inc. Coating compositions
EP4017898B1 (en) * 2019-08-23 2026-04-29 PPG Industries Ohio Inc. Systems and methods for improved lap shear strength and displacement of two-component structural adhesives
US20220372207A1 (en) 2019-09-23 2022-11-24 Ppg Industries Ohio, Inc. Curable compositions
CN114829476B (zh) 2019-12-11 2024-04-12 Ppg工业俄亥俄公司 含有导热填料的组合物
EP4110871A1 (en) 2020-02-26 2023-01-04 PPG Industries Ohio Inc. Coated substrates and methods of preparing the same
US20230115050A1 (en) 2020-02-26 2023-04-13 Ppg Industries Ohio, Inc. Thermally conductive and electrically insulating powder coating compositions
KR20220143746A (ko) 2020-02-26 2022-10-25 피피지 인더스트리즈 오하이오 인코포레이티드 2-층 유전체 코팅
CN115702189A (zh) 2020-04-15 2023-02-14 Ppg工业俄亥俄公司 含有导热填料的组合物
ES3040286T3 (en) 2020-04-15 2025-10-29 Ppg Ind Ohio Inc Use of a coating formed from a composition containing thermally conductive fillers to provide a substrate with thermal and fire protection
CA3175421A1 (en) 2020-04-15 2021-10-21 Liang Ma Compositions containing thermally conductive fillers
EP4136162A1 (en) 2020-04-15 2023-02-22 PPG Industries Ohio Inc. Compositions containing thermally conductive fillers
WO2021211182A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
WO2021211185A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
CA3199506A1 (en) 2020-12-18 2022-06-23 Corey James DEDOMENIC Thermally conductive and electrically insulating and/or fire-retardant electrodepositable coating compositions
EP4314187A1 (en) 2021-03-26 2024-02-07 PPG Industries Ohio Inc. Coating compositions
DE102021113089B4 (de) * 2021-05-20 2023-05-11 Jomoo Kitchen & Bath Deutschland Gmbh Sanitär-Einrichtung
MX2024006742A (es) 2021-12-02 2024-06-19 Ppg Ind Ohio Inc Composiciones de revestimiento.
CN114752334B (zh) * 2022-04-11 2023-10-20 中国航发北京航空材料研究院 一种耐湿热贮存稳定的中温固化环氧结构胶膜及制备方法
CA3252345A1 (en) 2022-06-06 2023-12-14 Ppg Industries Ohio, Inc. COATING COMPOSITIONS
WO2024040260A1 (en) * 2022-08-19 2024-02-22 Ppg Industries Ohio, Inc. Coating compositions
CN119968411A (zh) 2022-08-22 2025-05-09 Ppg工业俄亥俄公司 涂层组合物
CN116042150A (zh) * 2022-12-30 2023-05-02 浙江抟原复合材料有限公司 一种lng船围护系统用低温环氧树脂及其制备方法
DE112024002400T5 (de) 2023-06-01 2026-03-12 Ppg Industries Ohio, Inc. Zusammensetzungen, die thermisch leitfähige füllstoffe und thermisch expandierbare materialien enthalten
WO2025188361A2 (en) 2023-11-19 2025-09-12 Ppg Industries Ohio, Inc. Curable compositions
WO2025183772A1 (en) 2024-02-26 2025-09-04 Ppg Industries Ohio, Inc. Compositions containing a thermally conductive filler and a thermally expandable material
WO2025183769A1 (en) 2024-02-26 2025-09-04 Ppg Industries Ohio, Inc. Furan-functional and isocyanate-functional compounds and reversibly curable compositions
WO2025183770A1 (en) 2024-02-26 2025-09-04 Ppg Industries Ohio, Inc. Compositions containing furan-functional and isocyanate-functional compounds and expandable material
WO2025183771A1 (en) 2024-02-26 2025-09-04 Ppg Industries Ohio, Inc. Compositions containing a thermally conductive filler and a thermally expandable material
WO2026059637A2 (en) 2024-09-03 2026-03-19 Ppg Industries Ohio, Inc. Coating compositions and solvent-assisted degradable coatings formed therefrom

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3816365A (en) * 1968-09-12 1974-06-11 Ciba Geigy Ag Adducts,containing epoxide groups,from polyglycidyl compounds and acid polyesters of aliphatic-cycloaliphatic dicarboxylic acids,process for their manufacture and use
US4668736A (en) * 1984-07-18 1987-05-26 Minnesota Mining And Manufacturing Company Fast curing epoxy resin compositions
EP0305331A3 (de) * 1987-08-25 1991-05-08 Ciba-Geigy Ag Epoxidflexibilisatoren
US5070119A (en) * 1990-09-28 1991-12-03 Ppg Industries, Inc. Flexible intumescent coating composition
DE4317470C2 (de) * 1993-05-26 2001-06-07 Henkel Kgaa Thermisch vernetzbarer Heißsiegel-Klebstoff und dessen Verwendung
JPH07309929A (ja) * 1994-05-16 1995-11-28 Dainippon Ink & Chem Inc エポキシ樹脂及びその製造方法
US7071258B1 (en) * 2002-10-21 2006-07-04 Nanotek Instruments, Inc. Nano-scaled graphene plates
KR20040061909A (ko) * 2002-12-31 2004-07-07 주식회사 금강고려화학 내후성 및 기계적 물성이 우수한 에폭시-폴리에스테르수지 조성과 분체 도료 조성물
JP2006008730A (ja) * 2004-06-22 2006-01-12 Kyoeisha Chem Co Ltd 油膜被覆鋼材と発泡した硬化エポキシ樹脂充填材との接着性の増強剤
ES2691528T3 (es) * 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
BRPI0809752B1 (pt) * 2007-04-11 2017-05-16 Dow Global Technologies Inc "adesivo estrutural de um componente e método"
KR20100059818A (ko) * 2007-07-26 2010-06-04 헨켈 코포레이션 경화성 에폭시 수지계 접착제 조성물
CN102102001B (zh) * 2010-12-03 2013-04-17 烟台德邦科技有限公司 一种高导热石墨烯基环氧树脂胶粘剂及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240090704A (ko) * 2018-02-09 2024-06-21 피피지 인더스트리즈 오하이오 인코포레이티드 코팅 조성물
KR102805877B1 (ko) * 2018-02-09 2025-05-09 피피지 인더스트리즈 오하이오 인코포레이티드 코팅 조성물

Also Published As

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BR112014013594B1 (pt) 2021-01-05
MX2014006899A (es) 2015-05-15
CN104053694A (zh) 2014-09-17
CA2858186A1 (en) 2013-06-13
RU2595040C2 (ru) 2016-08-20
MX380981B (es) 2025-03-12
US20120129980A1 (en) 2012-05-24
BR112014013594A8 (pt) 2017-06-13
CN104053694B (zh) 2016-08-17
CA2858186C (en) 2016-06-07
RU2014127905A (ru) 2016-02-10
AU2012347650A1 (en) 2014-06-26
EP2788397A2 (en) 2014-10-15
AU2012347650B2 (en) 2015-09-17
WO2013086277A3 (en) 2013-08-15
IN2014DN04651A (https=) 2015-04-03
SG11201403003SA (en) 2014-07-30
KR20140101838A (ko) 2014-08-20
WO2013086277A2 (en) 2013-06-13
BR112014013594A2 (pt) 2017-06-13

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