CN104053694B - 结构粘结剂组合物 - Google Patents

结构粘结剂组合物 Download PDF

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Publication number
CN104053694B
CN104053694B CN201280067282.6A CN201280067282A CN104053694B CN 104053694 B CN104053694 B CN 104053694B CN 201280067282 A CN201280067282 A CN 201280067282A CN 104053694 B CN104053694 B CN 104053694B
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China
Prior art keywords
epoxy
compositions
adduct
anhydride
diacid
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Chinese (zh)
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CN104053694A (zh
Inventor
U·C·德赛
赵天杰
中岛将行
K·G·拉古内森
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PPG Industries Inc
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PPG Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201280067282.6A 2011-12-09 2012-12-07 结构粘结剂组合物 Active CN104053694B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/315,518 2011-12-09
US13/315,518 US20120129980A1 (en) 2010-11-19 2011-12-09 Structural adhesive compositions
PCT/US2012/068378 WO2013086277A2 (en) 2011-12-09 2012-12-07 Structural adhesive compositions

Publications (2)

Publication Number Publication Date
CN104053694A CN104053694A (zh) 2014-09-17
CN104053694B true CN104053694B (zh) 2016-08-17

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CN201280067282.6A Active CN104053694B (zh) 2011-12-09 2012-12-07 结构粘结剂组合物

Country Status (12)

Country Link
US (1) US20120129980A1 (https=)
EP (1) EP2788397A2 (https=)
KR (1) KR101684752B1 (https=)
CN (1) CN104053694B (https=)
AU (1) AU2012347650B2 (https=)
BR (1) BR112014013594B1 (https=)
CA (1) CA2858186C (https=)
IN (1) IN2014DN04651A (https=)
MX (1) MX380981B (https=)
RU (1) RU2595040C2 (https=)
SG (1) SG11201403003SA (https=)
WO (1) WO2013086277A2 (https=)

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US10294375B2 (en) * 2011-09-30 2019-05-21 Ppg Industries Ohio, Inc. Electrically conductive coatings containing graphenic carbon particles
US12421118B2 (en) 2011-09-30 2025-09-23 Ppg Industries Ohio, Inc. Graphenic carbon particles
KR102111816B1 (ko) * 2012-08-03 2020-05-15 오씨브이 인텔렉츄얼 캐피탈 엘엘씨 개선된 파이버글라스 보강 복합재
CA2903945C (en) * 2013-03-04 2018-05-01 Nippon Steel & Sumitomo Metal Corporation Impact-absorbing component
SG11201510248YA (en) * 2013-06-14 2016-01-28 Ppg Ind Ohio Inc Structural adhesive compositions
KR20160034330A (ko) * 2013-07-24 2016-03-29 블루 큐브 아이피 엘엘씨 경화성 조성물
CN104004482A (zh) * 2014-06-13 2014-08-27 江苏悦达新材料科技有限公司 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
DE102014226826A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Epoxidharz-Zusammensetzung
US11242427B2 (en) 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
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CN110072915A (zh) * 2016-10-28 2019-07-30 陶氏环球技术有限责任公司 具有改善的低温耐冲击性的耐碰撞环氧粘合剂
US11739241B2 (en) 2017-06-23 2023-08-29 Ddp Specialty Electronic Material Us, Llc High temperature epoxy adhesive formulations
TWI761598B (zh) 2017-09-20 2022-04-21 美商片片堅俄亥俄州工業公司 雙成份結構之黏著劑及其使用方法
US11732125B2 (en) 2018-02-09 2023-08-22 Ppg Industries Ohio, Inc. Coating compositions
MX2021003324A (es) 2018-09-20 2021-05-14 Ppg Ind Ohio Inc Composicion que contiene tiol.
WO2020077333A1 (en) 2018-10-12 2020-04-16 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
CN112969738B (zh) * 2018-10-29 2025-03-28 泽菲罗斯有限公司 改进的结构粘结粘合剂
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CN114585701B (zh) * 2019-08-23 2024-04-09 Ppg工业俄亥俄公司 用于改进双组分结构粘合剂的搭接剪切强度和位移的体系和方法
BR112022003302A2 (pt) 2019-08-23 2022-06-21 Ppg Ind Ohio Inc Composições de revestimento
EP4017897A1 (en) * 2019-08-23 2022-06-29 PRC-Desoto International, Inc. Coating compositions
EP4017898B1 (en) * 2019-08-23 2026-04-29 PPG Industries Ohio Inc. Systems and methods for improved lap shear strength and displacement of two-component structural adhesives
US20220372207A1 (en) 2019-09-23 2022-11-24 Ppg Industries Ohio, Inc. Curable compositions
CN114829476B (zh) 2019-12-11 2024-04-12 Ppg工业俄亥俄公司 含有导热填料的组合物
EP4110871A1 (en) 2020-02-26 2023-01-04 PPG Industries Ohio Inc. Coated substrates and methods of preparing the same
US20230115050A1 (en) 2020-02-26 2023-04-13 Ppg Industries Ohio, Inc. Thermally conductive and electrically insulating powder coating compositions
KR20220143746A (ko) 2020-02-26 2022-10-25 피피지 인더스트리즈 오하이오 인코포레이티드 2-층 유전체 코팅
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Also Published As

Publication number Publication date
BR112014013594B1 (pt) 2021-01-05
KR101684752B1 (ko) 2016-12-08
MX2014006899A (es) 2015-05-15
CN104053694A (zh) 2014-09-17
CA2858186A1 (en) 2013-06-13
RU2595040C2 (ru) 2016-08-20
MX380981B (es) 2025-03-12
US20120129980A1 (en) 2012-05-24
BR112014013594A8 (pt) 2017-06-13
CA2858186C (en) 2016-06-07
RU2014127905A (ru) 2016-02-10
AU2012347650A1 (en) 2014-06-26
EP2788397A2 (en) 2014-10-15
AU2012347650B2 (en) 2015-09-17
WO2013086277A3 (en) 2013-08-15
IN2014DN04651A (https=) 2015-04-03
SG11201403003SA (en) 2014-07-30
KR20140101838A (ko) 2014-08-20
WO2013086277A2 (en) 2013-06-13
BR112014013594A2 (pt) 2017-06-13

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