SG11201403003SA - Structural adhesive compositions - Google Patents

Structural adhesive compositions

Info

Publication number
SG11201403003SA
SG11201403003SA SG11201403003SA SG11201403003SA SG11201403003SA SG 11201403003S A SG11201403003S A SG 11201403003SA SG 11201403003S A SG11201403003S A SG 11201403003SA SG 11201403003S A SG11201403003S A SG 11201403003SA SG 11201403003S A SG11201403003S A SG 11201403003SA
Authority
SG
Singapore
Prior art keywords
adhesive compositions
structural adhesive
structural
compositions
adhesive
Prior art date
Application number
SG11201403003SA
Inventor
Umesh C Desai
Tien-Chieh Chao
Masayuki Nakajima
Kaliappa G Ragunathan
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of SG11201403003SA publication Critical patent/SG11201403003SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
SG11201403003SA 2011-12-09 2012-12-07 Structural adhesive compositions SG11201403003SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/315,518 US20120129980A1 (en) 2010-11-19 2011-12-09 Structural adhesive compositions
PCT/US2012/068378 WO2013086277A2 (en) 2011-12-09 2012-12-07 Structural adhesive compositions

Publications (1)

Publication Number Publication Date
SG11201403003SA true SG11201403003SA (en) 2014-07-30

Family

ID=47501441

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201403003SA SG11201403003SA (en) 2011-12-09 2012-12-07 Structural adhesive compositions

Country Status (12)

Country Link
US (1) US20120129980A1 (en)
EP (1) EP2788397A2 (en)
KR (1) KR101684752B1 (en)
CN (1) CN104053694B (en)
AU (1) AU2012347650B2 (en)
BR (1) BR112014013594B1 (en)
CA (1) CA2858186C (en)
IN (1) IN2014DN04651A (en)
MX (1) MX2014006899A (en)
RU (1) RU2595040C2 (en)
SG (1) SG11201403003SA (en)
WO (1) WO2013086277A2 (en)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010118580A (en) 2008-11-14 2010-05-27 Toshiba Corp Non-volatile semiconductor memory device
US20120128499A1 (en) * 2010-11-19 2012-05-24 Desai Umesh C Structural adhesive compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20140150970A1 (en) * 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10294375B2 (en) * 2011-09-30 2019-05-21 Ppg Industries Ohio, Inc. Electrically conductive coatings containing graphenic carbon particles
CA2880548A1 (en) * 2012-08-03 2014-02-06 Ocv Intellectual Capital, Llc Improved fiberglass reinforced composites
JP5787044B2 (en) * 2013-03-04 2015-09-30 新日鐵住金株式会社 Shock absorbing parts
WO2014201369A1 (en) * 2013-06-14 2014-12-18 Ppg Industries Ohio, Inc. Structural adhesive compositions
CA2917693A1 (en) * 2013-07-24 2015-01-29 Dow Global Technologies Llc Curable compositions
CN104004482A (en) * 2014-06-13 2014-08-27 江苏悦达新材料科技有限公司 Epoxy/organic silicon/graphene hybridization high heat conductivity adhesive and preparation method thereof
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
DE102014226826A1 (en) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa The epoxy resin composition
US11242427B2 (en) 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
CN106118571A (en) * 2016-06-28 2016-11-16 四川东树新材料有限公司 Wind electricity blade graphene-containing structural adhesive and preparation method thereof
WO2018080760A1 (en) * 2016-10-28 2018-05-03 Dow Global Technologies Llc Crash durable epoxy adhesive having improved low-temperature impact resistance
US11739241B2 (en) 2017-06-23 2023-08-29 Ddp Specialty Electronic Material Us, Llc High temperature epoxy adhesive formulations
TWI761598B (en) 2017-09-20 2022-04-21 美商片片堅俄亥俄州工業公司 Two-component structural adhesive and method of using the same
US11732125B2 (en) 2018-02-09 2023-08-22 Ppg Industries Ohio, Inc. Coating compositions
US20220127448A1 (en) 2018-09-20 2022-04-28 Ppg Industries Ohio, Inc. Thiol-containing composition
WO2020077333A1 (en) 2018-10-12 2020-04-16 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
EP3873964A1 (en) * 2018-10-29 2021-09-08 Zephyros, Inc. Improved structural bonding adhesive
FR3098817A1 (en) 2019-07-16 2021-01-22 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
KR20220051221A (en) 2019-08-23 2022-04-26 피피지 인더스트리즈 오하이오 인코포레이티드 Systems and Methods for Improved Lap Shear Strength and Displacement of Two-Component Structural Adhesives
KR20220051217A (en) * 2019-08-23 2022-04-26 피피지 인더스트리즈 오하이오 인코포레이티드 Systems and Methods for Improved Lap Shear Strength and Displacement of Two-Component Structural Adhesives
US20220325129A1 (en) * 2019-08-23 2022-10-13 Prc-Desoto International, Inc. Coating compositions
KR20220047609A (en) 2019-08-23 2022-04-18 피피지 인더스트리즈 오하이오 인코포레이티드 coating composition
US20220372207A1 (en) 2019-09-23 2022-11-24 Ppg Industries Ohio, Inc. Curable compositions
CN114829476B (en) 2019-12-11 2024-04-12 Ppg工业俄亥俄公司 Composition containing heat conductive filler
CA3168168A1 (en) 2020-02-26 2021-09-02 Sijmen J. VISSER Two-layer dielectric coating
MX2022010565A (en) 2020-02-26 2022-11-07 Ppg Ind Ohio Inc Coated substrates and methods of preparing the same.
KR20220143132A (en) 2020-02-26 2022-10-24 피피지 인더스트리즈 오하이오 인코포레이티드 Thermally Conductive and Electrically Insulating Powder Coating Composition
WO2021211182A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
WO2021211185A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
MX2022012970A (en) 2020-04-15 2023-01-05 Ppg Ind Ohio Inc Compositions containing thermally conductive fillers.
EP4136162A1 (en) 2020-04-15 2023-02-22 PPG Industries Ohio Inc. Compositions containing thermally conductive fillers
EP4136140A1 (en) 2020-04-15 2023-02-22 PPG Industries Ohio Inc. Compositions containing thermally conductive fillers
AU2021256983B2 (en) 2020-04-15 2024-03-14 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
KR20230120662A (en) 2020-12-18 2023-08-17 피피지 인더스트리즈 오하이오 인코포레이티드 Thermally conductive and electrically insulating and/or flame retardant electrodepositable coating composition
EP4314187A1 (en) 2021-03-26 2024-02-07 PPG Industries Ohio Inc. Coating compositions
WO2023102525A1 (en) 2021-12-02 2023-06-08 Ppg Industries Ohio, Inc. Coating compositions
CN114752334B (en) * 2022-04-11 2023-10-20 中国航发北京航空材料研究院 Medium-temperature cured epoxy structural adhesive film with stable humidity and heat resistance and storage and preparation method thereof
WO2023240057A1 (en) 2022-06-06 2023-12-14 Ppg Industries Ohio, Inc. Coating compositions
WO2024040260A1 (en) * 2022-08-19 2024-02-22 Ppg Industries Ohio, Inc. Coating compositions
WO2024044576A1 (en) 2022-08-22 2024-02-29 Ppg Industries Ohio, Inc. Coating compositions

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3816365A (en) * 1968-09-12 1974-06-11 Ciba Geigy Ag Adducts,containing epoxide groups,from polyglycidyl compounds and acid polyesters of aliphatic-cycloaliphatic dicarboxylic acids,process for their manufacture and use
US4668736A (en) * 1984-07-18 1987-05-26 Minnesota Mining And Manufacturing Company Fast curing epoxy resin compositions
US5070119A (en) * 1990-09-28 1991-12-03 Ppg Industries, Inc. Flexible intumescent coating composition
DE4317470C2 (en) * 1993-05-26 2001-06-07 Henkel Kgaa Thermally crosslinkable heat seal adhesive and its use
JPH07309929A (en) * 1994-05-16 1995-11-28 Dainippon Ink & Chem Inc Epoxy resin and its production
KR20040061909A (en) * 2002-12-31 2004-07-07 주식회사 금강고려화학 Epoxy-polyester resin and powdered paint composition having excellent weatherability and mechanical properties
JP2006008730A (en) * 2004-06-22 2006-01-12 Kyoeisha Chem Co Ltd Enhancer for adhesiveness between oil film coated steel material and foamed cured epoxy resin filler
KR101352811B1 (en) * 2006-07-31 2014-02-17 헨켈 아게 운트 코. 카게아아 Curable epoxy resin-based adhesive compositions
ATE510897T1 (en) * 2007-04-11 2011-06-15 Dow Global Technologies Llc HEAT RESISTANT STRUCTURAL EPOXY RESINS
WO2009017690A2 (en) * 2007-07-26 2009-02-05 Henkel Corporation Curable epoxy resin-based adhesive compositions

Also Published As

Publication number Publication date
KR20140101838A (en) 2014-08-20
WO2013086277A3 (en) 2013-08-15
CN104053694B (en) 2016-08-17
WO2013086277A2 (en) 2013-06-13
AU2012347650A1 (en) 2014-06-26
RU2014127905A (en) 2016-02-10
US20120129980A1 (en) 2012-05-24
RU2595040C2 (en) 2016-08-20
KR101684752B1 (en) 2016-12-08
CN104053694A (en) 2014-09-17
BR112014013594B1 (en) 2021-01-05
MX2014006899A (en) 2015-05-15
CA2858186C (en) 2016-06-07
CA2858186A1 (en) 2013-06-13
IN2014DN04651A (en) 2015-04-03
AU2012347650B2 (en) 2015-09-17
BR112014013594A8 (en) 2017-06-13
EP2788397A2 (en) 2014-10-15
BR112014013594A2 (en) 2017-06-13

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